www.fairchildsemi.com FAN2534/FAN2535 150 mA CMOS LDO Regulator with Fast Start, Enable Features • • • • • • • • • • • 70dB Ripple rejection ( >45dB up to 1MHz) 150µsec Power On Time 150µsec Enable Time Low noise - 50µVrms Enable optimized for CDMA time slices 180 mV dropout voltage at 150 mA Enable/Shutdown Control Enable time independent of noise bypass capacitor value SOT23-5 package Thermal limiting 300 mA trimmed current limit Applications • • • • low dropout voltage, fast enable required in CDMA handset applications, exceptional loop stability to accommodate a wide variety of external capacitors, and a compact SOT23-5 surface-mount package. These products offer significant improvements over older Bipolar and CMOS designs and are pin-compatible with many popular devices. The FAN2534 and FAN2535 devices are distinguished by the assignment of pin 4: FAN2534: pin 4 – ADJ, allowing the user to adjust the output voltage over a wide range using an external voltage divider. FAN2534-XX: pin 4 – BYP, to which a bypass capacitor may be connected for optimal noise performance. Output voltage is fixed, as specified by the suffix XX. Cellular Phones and accessories PDAs Portable cameras and video recorders Laptop, notebook and palmtop computers FAN2535-XX: pin 4 – ERR, a flag which indicates that the output voltage has dropped below the specified minimum due to a fault condition. Description The FAN2534/FAN2535 family of micropower low-dropout voltage regulators utilize CMOS technology to offer a new level of cost-effective performance in GSM, TDMA, and CDMA cellular handsets, laptop and notebook computers, and other portable devices. Proprietary design technics ensure high ripple rejection. Other features include low noise, short circuit current limit, thermal shutdown circuit, The standard fixed output voltages available are 2.6V, 2.85V, and 3.0V . Custom output voltages are also available: please contact your local Fairchild Sales Office for information. Block Diagrams EN EN EN VIN VIN BYP Bandgap Error Amplifier Bandgap p VOUT Error Amplifier VIN Bandgap p ERR Error Amplifier p VOUT VOUT ADJ Thermal Sense FAN2534 Thermal Sense GND FAN2534-XX Thermal Sense GND GND FAN2535-XX REV. 1.0.2 8/26/03 FAN2534/FAN2535 PRODUCT SPECIFICATION Pin Assignments VIN 1 FB 5 VOUT 4 ADJ/BYP/ERR SHDN GND 2 CAP+ EN 3 CAP- Pin No. FAN2534 FAN2534-XX FAN2535-XX 1. VIN VIN VIN 2. GND GND GND 3. EN EN EN 4. ADJ BYP ERR 5. VOUT VOUT VOUT Pin Descriptions Pin Name Pin No. Type Pin Function Description ADJ 4 Input FAN2534 Adjust. Ratio of potential divider from VOUT to ADJ determines output voltage. BYP 4 Passive FAN2534-XX Bypass. Connect 10 nF capacitor for noise reduction. ERR 4 Open drain FAN2535-XX Error. Error flag output. LOW when Vout< 95% of nominal; HIGH when Vout> 95% of nominal. EN 3 Digital Input Enable. LOW in Shutdown Mode; HIGH in Enable Mode VIN 1 Power in Voltage Input. Supply voltage input. VOUT 5 Power out Voltage Output. Regulated output voltage. GND 2 Power Ground. Absolute Maximum Ratings (Note 1) Parameter Min. Typ. Max. Unit 7 V Power Supply Voltages VIN (Measured to GND); Enable Input (EN); ERR Output; 0 Power Dissipation Operating Junction Temperature Internally limited -65 Lead Soldering (5 seconds) Storage Electrostatic Discharge (Note 2) 2 -65 4 150 °C 260 °C 150 °C kV REV. 1.0.2 8/26/03 PRODUCT SPECIFICATION FAN2534/FAN2535 Operating Conditions Symbol Parameter VIN Min. Input Voltage Range Typ. Max. Units VOUT+VDO 6.5 V VOUT Output Voltage Range FAN2534-XX, FAN2535-XX (Note 3) 2.3 3.3 V VOUT Output Voltage Range (FAN2534 only) 2.0 5.0 V VEN Enable Input Voltage 0 VIN V VERR ERR Flag Voltage VIN V -40 +125 °C TJ Junction Temperature θJA Thermal resistance 220 °C/W θJC Thermal resistance 130 °C/W DC Electrical Characteristics (Notes 4, 5) Symbol Parameter Conditions Min. Typ. Max. Units Regulator VDO ∆VO Drop Out Voltage (Note 6) Output Voltage Accuracy (Note 7) IOUT = 100 µA 2.5 4 mV IOUT = 50 mA 50 75 mV IOUT = 100 mA 100 140 mV IOUT = 150 mA 180 220 mV -1 1 % -3.7 2 % Initial Accuracy at no load Over Line, Load & Temp IGND(NL) Ground Pin Current No Load 90 µA IGND(FL) IOUT = 150 mA 110 µA Ground Pin Current Protection Current Limit IGSD Shut-Down Current TSH Thermal Shutdown Temperature Hysteresis ETL ERR Trip Level 300 EN = 0V FAN2535 only 90 400 mA 1 µA 155 °C 15 °C 93 96 % 0.4 1.2 V Enable Input VEL Logic Low Voltage VEH Logic High Voltage IEH Input Current High 1 µA IEL Input Current Low 1 µA REV. 1.0.2 8/26/03 1.4 2 V 3 FAN2534/FAN2535 PRODUCT SPECIFICATION Switching Characteristics (Notes 4, 5) Parameter Conditions Min. Typ. Max. Unit Enable Response time (Note 8) CL=10µF CBP=10nF 150 300 µsec Power "ON" Response time CL=10uF CBP=10nF VOUT = 3.0V 150 500 µsec 3 msec Typ. Max. Units Error Flag Response time (FAN2535-XX only) AC Performance Characteristics (Notes 4, 5) Symbol Parameter Conditions Min. ∆VOUT/ ∆VIN Line regulation VIN = (VOUT + 1) to 6.5V, IL = 10mA 0.05 0.2 % /V ∆VOUT/ VOUT Load regulation IOUT = 0.1 to 100mA 1.0 2.0 % eN Output noise BW: 300Hz–50KHz COUT = 10µF, CBYP = 0.01µF 50 µVRMS PSRR Power Supply Ripple Rejection 100 Hz, COUT = 1µF, CBYP = 0.01µF 0mA<IL<150mA 70 dB Notes: 1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only if Operating Conditions are not exceeded. 2. Using Mil Std. 883E, method 3015.7(Human Body Model), 400V when using JEDEC method A115-A (Machine Model). 3. For specific output voltages of the fixed oputput voltage versions please refer to the table: "Output Voltage Options and Ordering Information" on Page 9. Custom fixed output voltages, not listed in the table, are also available. 4. Unless otherwise stated, TA = 25°C, VIN = VOUT + 1V, IOUT = 100µA, VEH > 2.0 V. 5. Bold values indicate -40 <TJ <125°C. 6. Dropout Voltage is defined as the input to output differential at which the output voltage drops to 2% below the nominal value measured at 1V input - output differential. 7. Adjustable version, has a bandgap reference voltage of 1.0V, trimmed to +/-1% initial accuracy. 8. When using repeated cycling, F>0.5Hz. 4 REV. 1.0.2 8/26/03 PRODUCT SPECIFICATION FAN2534/FAN2535 Functional Description Applications Information Utilizing CMOS technology, the FAN2534/FAN2535 product family is optimized for use in compact battery powered systems, offering a unique combination of high ripple rejection, low noise, low power consumption, extremely low dropout voltages, high tolerance for a variety of output capacitors, and less than 1µA "OFF" current. In the circuit, a differential amplifier controls a series-pass P-Channel MOSFET, and a separate error amplifier compares the load voltage at the output with an onboard trimmed low voltage bandgap reference. The series resistance of the pass P-Channel MOSFET is approximately 1 Ohm, yielding an unusually low dropout voltage even under high load conditions. External Capacitors – Selection Thermal shutdown and current limit circuits protect the device under extreme conditions. When the device temperature reaches 155°C, the output is disabled, until the device cooles down by 15°C, then re-enabled. The user can to shut down the device using the Enable control pin at any time. The current limit circuit is trimmed, which leads to consistent power on /enable delays, and provides safe short circuit current densities even in narrow traces of the PCB. An input capacitor of 2.2µF (nominal value) or greater, connected between the Input pin and Ground, placed in close proximity to the device, will improve transient response and ripple rejection. Higher values will further improve ripple rejection and transient response. An input capacitor is recommended when the input source, either a battery or a regulated AC voltage, is located far from the device. Any good quality ceramic, tantalum, or metal film capacitor will give acceptable performance, however in extreme cases capacitor surge current ratings may have to be considered. A carefully optimized control loop accommodates a wide range of ESR values in the output bypass capacitor, allowing the user to optimize space, cost, and performance requirements. An Enable pin shuts down the regulator output to conserve power, reducing supply current to less than 1µA. The output can then be re-Enabled within 150µSec, fulfilling the fast power-cycling needs of CDMA applications. Depending on the device type selected, other control and status functions are available at pin 4. The fixed-voltage versions are available with either a noise-bypass pin or an Error flag pin option. The error flag can be used as a diagnostic function to indicate that the output voltage has dropped more than 5% below the nominal value. The adjustable-voltage versions utilize pin 4 to connect to an external voltage divider which feeds back to the regulator error amplifier, thus setting the output voltage to the desired value. REV. 1.0.2 8/26/03 The FAN2534/FAN2535 allows the user to utilize a wide variety of capacitors compared to other LDO products. An innovative design approach offers significantly reduced sensitivity to ESR (Equivalent Series Resistance), which degrades regulator loop stability in older designs. While the improvements featured in the FAN2534/FAN2535 family greatly simplify the design task, capacitor quality still must be considered if the designer is to achieve optimal circuit performance. In general, ceramic capacitors offer superior ESR performance, and a smaller case size than tantalums. Input Capacitor Output Capacitor An output capacitor is required to maintain regulator loop stability. Stable operation will be achieved with a wide variety of capacitors with ESR values ranging from 0mΩ up to 400mΩ. Multilayer ceramic, tantalum or aluminum electrolytic capacitors may be used. A nominal value of at least 1µF is recommended. Note that the choice of output capacitor effects load transient response, ripple rejection, and it has a slight effect on noise performance as well. Bypass Capacitor (FAN2534-XX Only) In the fixed-voltage configuration, connecting a capacitor between the bypass pin and ground can significantly reduce output noise. Values ranging from 0pF to 47nF can be used, depending on the sensitivity to output noise in the application. At the high-impedance Bypass pin, care must be taken in the PCB layout to minimize noise pickup, and capacitors must be selected to minimize current loading (leakage). Noise pickup from external sources can be considerable. Leakage currents into the Bypass pin will directly affect regulator accuracy and should be kept as low as possible; thus, highquality ceramic and film types are recommended for their low leakage characteristics. Cost-sensitive applications not concerned with noise can omit this capacitor. 5 FAN2534/FAN2535 Control Functions Enable Pin Connecting 2.0V or greater to the Enable pin will enable the output, while 0.4V or less will disable it while reducing the quiescent current consumption to less than 1µA. If this shutdown function is not needed, the pin can simply be connected permanently to the VIN pin. Allowing this pin to float will cause erratic operation. Error Flag (FAN2535-XX Only) Fault conditions such as input voltage dropout (low VIN), overheating, or overloading (excessive output current), will set an error flag: The ERR pin which is an open-drain output, will go LOW when VOUT is less than 95% or the specified output voltage. When the voltage at VOUT is greater than 95% of the specified output voltage, the ERR pin is HIGH. A logic pullup resistor of 100K Ohm is recommended at this output. The pin can be left disconnected if unused. Thermal Protection The FAN2534/FAN2535 is designed to supply high peak output currents for brief periods, however sustained excessive output load at high input - output voltage difference will cause the device temperature to increase and exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 155°C, an onboard thermal protection will disable the output until the temperature drops approximately 15°C below the limit, at which point the output is re-enabled. During a thermal shutdown situation the user may assert the power-down function at the Enable pin, reducing power consumption to a minimum. Thermal Characteristics The FAN2534/FAN2535 is designed to supply 150mA at the specified output voltage with an operating die (junction) temperature of up to 125°C. Once the power dissipation and thermal resistance is known, the maximum junction temperature of the device can be calculated. While the power dissipation is calculated from known electrical parameters, the actual thermal resistance depends on the thermal characteristics of the SOT23-5 surface-mount package and the surrounding PC Board copper to which it is mounted. The power dissipation is equal to the product of the input-tooutput voltage differential and the output current plus the ground current multiplied by the input voltage, or: P D = ( V IN – V OUT )I OUT + V IN I GND PRODUCT SPECIFICATION The relationship describing the thermal behavior of the package is: T J ( max ) – T A P D ( max ) = ------------------------------- θ JA where TJ(max) is the maximum allowable junction temperature of the die, which is 125°C, and TA is the ambient operating temperature. θJA is dependent on the surrounding PC board layout and can be empirically obtained. While the θJC (junction-to-case) of the SOT23-5 package is specified at 130°C /W, the θJA of the minimum PWB footprint will be at least 235°C /W. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the size of the copper area, the resulting θJA can range from approximately 180°C /W for one square inch to nearly 130°C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing thermal resistance. The heat contributed by the dissipation of other devices located nearby must be included in the design considerations. Once the limiting parameters in these two relationships have been determined, the design can be modified to ensure that the device remains within specified operating conditions. If overload conditions are not considered, it is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, reenables, and then again overheats and shuts down repeatedly due to an unmanaged fault condition. Adjustable Version The FAN2534 adjustable version includes an input pin ADJ which allows the user to select an output voltage ranging from 2.5V to near VIN, using an external resistor divider. The voltage VADJ presented to the ADJ pin is fed to the onboard error amplifier which adjusts the output voltage until VADJ is equal to the onboard bandgap reference voltage of 1.00V(typ). The equation is: R upper V OUT = 1.00V × 1 + ---------------R lower Since the bandgap reference voltage is trimmed, 1% initial accuracy can be achieved. The total value of the resistor chain should not exceed 250K Ohm total to keep the error amplifier biased during no-load conditions. Programming output voltages very near VIN need to allow for the magnitude and variation of the dropout voltage VDO over load, supply, and temperature variations. Note that the low-leakage FET input to the CMOS Error Amplifier induces no bias current error to the calculation. The ground pin current IGND can be found in the charts provided in the Electrical Characteristics section. 6 REV. 1.0.2 8/26/03 PRODUCT SPECIFICATION FAN2534/FAN2535 General PWB Layout Considerations For optimum device performance, careful circuit layout and grounding technics must be used. Establishing a small local ground, to which the GND pin, and the output and bypass capacitors are connected, is recommended, while the input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feedthrough vias. In general, the highfrequency compensation components (input, bypass, and output capacitors) should be located as close to the device as possible. The proximity of the output capacitor is especially important to achieve optimum performance, especially during high load conditions. A large copper area in the local ground serves as heat sink (as discussed above) when high power dissipation significantly increases device temperature. Component-side copper provides significantly better thermal performance. Added feedthrough connecting the device side ground plane to the back plane further reduces thermal resistance. REV. 1.0.2 8/26/03 7 FAN2534/FAN2535 PRODUCT SPECIFICATION Typical Performance Characteristics Enable Delay Disable Delay VEN VEN C out = 3.3µF, C byp = 10nF, I load = 150mA Disable Delay = 214µSec C out = 3.3µF, C byp = 10nF, I load = 150mA Enable Delay = 152µSec VOUT VOUT Ground Current vs Ambient Temperature Power on Delay 110 ILOAD = 0mA C out = 3.3µF, C byp = 10nF, ILOAD = 150mA Power on Delay = 150µSec VOUT Ground Current (µA) VIN 100 90 80 70 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (°C) Ripple Rejection Plot Noise Plot 1.8µV -30 dB -35 1.6µV -40 1.4µV 1.2µV Cout = 3.3µF, Cbyp = 10nF Iload = 150mA Cout = 3.3µF, Cbyp = 10nF Iload = 150mA -45 -50 1µV -55 800nV -60 600nV -65 400nV -70 -75 200nV 8 -80 REV. 1.0.2 8/26/03 PRODUCT SPECIFICATION FAN2534/FAN2535 Typical Performance Characteristics (Continued) Dropout Voltage vs Ambient Temperature 0.6 240 0.4 220 Droupout Voltage (mV) VOUT Variation (%) VOUT Variation vs Ambient Temperature 0.2 Iload = 150mA 0.0 -0.2 -0.4 -0.6 -0.8 -25 0 25 50 Ambient Temperature (°C) 75 Iload = 150mA 200 180 160 140 120 -40 -20 0 20 40 Ambient Temperature (°C) 60 Dropout Voltage vs Load Current 160 Droupout Voltage (mV) 140 T = 25°C 120 100 80 60 40 20 0 0 25 REV. 1.0.2 8/26/03 50 75 100 Load Current (mA) 125 150 9 FAN2534/FAN2535 PRODUCT SPECIFICATION Mechanical Dimensions 5-Lead SOT-23 Package Symbol B e e1 D A A1 10 Millimeters Min Max Min Max A .035 .057 .90 1.45 A1 .000 .006 .00 .15 B .008 .020 .20 .50 c .003 .010 .08 .25 D .106 .122 2.70 3.10 E .059 .071 1.50 1.80 c L H α E Inches e .037 BSC .95 BSC e1 .075 BSC 1.90 BSC H .087 .126 2.20 3.20 L .004 .024 .10 .60 α 0° 10° 0° 10° Notes REV. 1.0.2 8/26/03 PRODUCT SPECIFICATION FAN2534/FAN2535 Output Voltage Options and Ordering Information Product Number VOUT Pin 4 Function Package Marking FAN2534SX Adj. Adjust AJA FAN2534S26X 2.6 Bypass AJG FAN2534S30X 3.0 Bypass AJW FAN2535S26X 2.6 Error output AKG FAN2535S285X 2.85 Error output AKN Tape and Reel Information Quantity Reel Size Width 3000 7" 8mm DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 8/26/03 0.0m 004 Stock#DS30002591 2002 Fairchild Semiconductor Corporation