MOTOROLA MMDF3N06HD

Order this document
by MMDF3N06HD/D
SEMICONDUCTOR TECHNICAL DATA
Medium Power Surface Mount Products
Motorola Preferred Device
DUAL TMOS
POWER MOSFET
60 VOLTS
RDS(on) = 100 mW
Dual HDTMOS are an advanced series of power MOSFETs
which utilize Motorola’s High Cell Density TMOS process. These
miniature surface mount MOSFETs feature low RDS(on) and true
logic level performance. Dual HDTMOS devices are designed for
use in low voltage, high speed switching applications where power
efficiency is important. Typical applications are dc–dc converters,
and power management in portable and battery powered products
such as computers, printers, cellular and cordless phones. They
can also be used for low voltage motor controls in mass storage
products such as disk drives and tape drives.
•
•
•
•
•
•
•
Low RDS(on) Provides Higher Efficiency and Extends Battery Life
Logic Level Gate Drive — Can Be Driven by Logic ICs
Miniature SO–8 Surface Mount Package — Saves Board Space
Diode Is Characterized for Use In Bridge Circuits
Diode Exhibits High Speed, With Soft Recovery
IDSS Specified at Elevated Temperature
Mounting Information for SO–8 Package Provided

D
G
CASE 751–05, Style 11
SO–8
S
D
G
Source–1
1
8
Drain–1
Gate–1
2
7
Drain–1
Source–2
3
6
Drain–2
Gate–2
4
5
Drain–2
Top View
S
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Drain–to–Source Voltage
Gate–to–Source Voltage — Continuous
Drain Current — Continuous @ TA = 25°C
Symbol
Value
Unit
VDSS
VGS
60
Vdc
± 20
Vdc
3.3
16.5
Adc
Apk
1.7
Adc
2.0
Watts
ID
IDM
IS
Source Current — Continuous @ TA = 25°C
Total Power Dissipation @ TA = 25°C (1)
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 60 Vdc, VGS = 5.0 Vdc, VDS = 32 Vdc, IL = 15 Apk, L = 10 mH, RG = 25 Ω)
Thermal Resistance — Junction–to–Ambient
Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds
PD
TJ, Tstg
EAS
– 55 to 150
RθJA
62.5
°C/W
TL
260
°C
°C
mJ
105
DEVICE MARKING
D3N06
ORDERING INFORMATION
Device
MMDF3N06HDR2
Reel Size
Tape Width
Quantity
13″
12 mm embossed tape
2500 units
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
HDTMOS and MiniMOS are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
TMOS
Motorola
Motorola, Inc.
1997 Power MOSFET Transistor Device Data
1
MMDF3N06HD
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
60
—
—
—
—
0.001
0.05
1.0
25
—
12
100
1.0
—
—
—
—
67.5
82.5
100
200
—
7.5
—
Ciss
—
442
618
Coss
—
97.6
137
Crss
—
24.4
34.2
td(on)
—
10.6
22.1
tr
—
15.9
31.8
td(off)
—
23.8
47.6
Unit
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 0.25 mAdc)
V(BR)DSS
Zero Gate Voltage Drain Current
(VDS = 48 Vdc, VGS = 0 Vdc)
(VDS = 48 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0 Vdc)
IGSS
Vdc
µAdc
nAdc
ON CHARACTERISTICS(1)
Gate Threshold Voltage
(VDS = VGS, ID = 0.25 mAdc)
VGS(th)
Static Drain–to–Source On–Resistance
(VGS = 10 Vdc, ID = 3.3 Adc)
(VGS = 4.5 Vdc, ID = 2.5 Adc)
RDS(on)
Forward Transconductance
(VDS = 15 Vdc, ID = 1.5 Adc)
Vdc
gFS
mW
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
(VDS = 25 Vdc,
Vdc VGS = 0 Vdc,
Vdc
f = 1.0 MHz)
Transfer Capacitance
pF
SWITCHING CHARACTERISTICS(2)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
(VDD = 30 Vdc,
Vd ID = 3.3
3 3 Adc,
Ad
VGS = 4.5
4 5 Vdc,
Vdc
RG = 30 Ω))
Fall Time
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
(VDD = 15 Vdc,
Vd ID = 3.0
3 0 Adc,
Ad
VGS = 10 Vdc
Vdc,
RG = 9.1 Ω))
Fall Time
Gate Charge
(See Figure 8)
((VDS = 30 Vdc,
Vd , ID = 3.3
3 3 Adc,
Ad ,
VGS = 10 Vdc)
tf
—
14.7
29.4
td(on)
—
7.0
14
tr
—
4.8
9.6
td(off)
—
32.4
64.8
tf
—
14.2
28.4
QT
—
14.5
29
Q1
—
1.8
—
Q2
—
3.5
—
Q3
—
3.75
—
—
—
0.78
0.65
1.2
—
trr
—
27.9
—
ta
—
23
—
tb
—
4.9
—
QRR
—
0.038
—
ns
ns
nC
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
VSD
(IS = 1.7 Adc, VGS = 0 Vdc)
(IS = 1.7 Adc, VGS = 0 Vdc, TJ = 125°C)
Reverse Recovery Time
(IS = 1
1.7
7 Adc
Adc, VGS = 0 Vdc,
Vdc
dIS/dt = 100 A/µs)
Reverse Recovery Stored Charge
Vdc
ns
µC
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
2
Motorola TMOS Power MOSFET Transistor Device Data
MMDF3N06HD
TYPICAL ELECTRICAL CHARACTERISTICS
6.0
5.0
3.3 V
3.1 V
3.5 V
3.7 V
3.9 V
4.5 V
4.3 V
4.0
4.1 V
2.9 V
3.0
2.7 V
2.0
2.5 V
1.0
0
RDS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS)
VDS ≥ 10 V
TJ = 25°C
I D , DRAIN CURRENT (AMPS)
VGS = 10 V
6.0 V
5.0
100°C
4.0
25°C
3.0
TJ = –55°C
2.0
1.0
2.3 V
2.1 V
0
0
0.2
0.6
0.4
0.8
1.0
1.2
1.4
1.8
1.6
2.0
2.25
2.5
2.75
3.0
Figure 2. Transfer Characteristics
0.25
0.2
0.15
0.1
0.05
0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
10
3.25
3.5
4.5
5.0
0.09
TJ = 25°C
0.085
VGS = 4.5 V
0.08
0.075
0.07
10 V
0.065
0.06
1.0
1.5
2.0
2.5
3.0
3.5
4.0
ID, DRAIN CURRENT (AMPS)
Figure 3. On–Resistance versus
Gate–to–Source Voltage
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
1.8
1000
VGS = 0 V
VGS = 10 V
ID = 1.5 A
1.4
I DSS , LEAKAGE (nA)
RDS(on), DRAIN–TO–SOURCE RESISTANCE (NORMALIZED)
2.0
Figure 1. On–Region Characteristics
ID = 3.0 A
TJ = 25°C
1.6
1.75
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
0.3
2.0
1.5
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
RDS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS)
I D , DRAIN CURRENT (AMPS)
6.0
1.2
1.0
0.8
0.6
0.4
100
TJ = 125°C
10
100°C
1.0
25°C
0.2
0
– 50
0
– 25
0
25
50
75
100
125
150
0
5.0
10
15
20
25
TJ, JUNCTION TEMPERATURE (°C)
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 5. On–Resistance Variation
with Temperature
Figure 6. Drain–to–Source Leakage Current
versus Voltage
Motorola TMOS Power MOSFET Transistor Device Data
30
3
MMDF3N06HD
POWER MOSFET SWITCHING
Switching behavior is most easily modeled and predicted
by recognizing that the power MOSFET is charge controlled.
The lengths of various switching intervals (∆t) are determined by how fast the FET input capacitance can be charged
by current from the generator.
The published capacitance data is difficult to use for calculating rise and fall because drain–gate capacitance varies
greatly with applied voltage. Accordingly, gate charge data is
used. In most cases, a satisfactory estimate of average input
current (IG(AV)) can be made from a rudimentary analysis of
the drive circuit so that
t = Q/IG(AV)
During the rise and fall time interval when switching a resistive load, VGS remains virtually constant at a level known as
the plateau voltage, VSGP. Therefore, rise and fall times may
be approximated by the following:
tr = Q2 x RG/(VGG – VGSP)
tf = Q2 x RG/VGSP
where
VGG = the gate drive voltage, which varies from zero to VGG
RG = the gate drive resistance
and Q2 and VGSP are read from the gate charge curve.
During the turn–on and turn–off delay times, gate current is
not constant. The simplest calculation uses appropriate values from the capacitance curves in a standard equation for
voltage change in an RC network. The equations are:
td(on) = RG Ciss In [VGG/(VGG – VGSP)]
td(off) = RG Ciss In (VGG/VGSP)
The capacitance (Ciss) is read from the capacitance curve at
a voltage corresponding to the off–state condition when calculating td(on) and is read at a voltage corresponding to the
on–state when calculating td(off).
At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET source
lead, inside the package and in the circuit wiring which is
common to both the drain and gate current paths, produces a
voltage at the source which reduces the gate drive current.
The voltage is determined by Ldi/dt, but since di/dt is a function of drain current, the mathematical solution is complex.
The MOSFET output capacitance also complicates the
mathematics. And finally, MOSFETs have finite internal gate
resistance which effectively adds to the resistance of the
driving source, but the internal resistance is difficult to measure and, consequently, is not specified.
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
The switching characteristics of a MOSFET body diode
are very important in systems using it as a freewheeling or
commutating diode. Of particular interest are the reverse recovery characteristics which play a major role in determining
switching losses, radiated noise, EMI and RFI.
System switching losses are largely due to the nature of
the body diode itself. The body diode is a minority carrier device, therefore it has a finite reverse recovery time, trr, due to
the storage of minority carrier charge, QRR, as shown in the
typical reverse recovery wave form of Figure 11. It is this
stored charge that, when cleared from the diode, passes
through a potential and defines an energy loss. Obviously,
repeatedly forcing the diode through reverse recovery further
increases switching losses. Therefore, one would like a
diode with short trr and low QRR specifications to minimize
these losses.
The abruptness of diode reverse recovery effects the
amount of radiated noise, voltage spikes, and current ringing. The mechanisms at work are finite irremovable circuit
parasitic inductances and capacitances acted upon by high
di/dts. The diode’s negative di/dt during ta is directly controlled by the device clearing the stored charge. However,
the positive di/dt during tb is an uncontrollable diode characteristic and is usually the culprit that induces current ringing.
Therefore, when comparing diodes, the ratio of tb/ta serves
as a good indicator of recovery abruptness and thus gives a
comparative estimate of probable noise generated. A ratio of
1 is considered ideal and values less than 0.5 are considered
snappy.
Compared to Motorola standard cell density low voltage
MOSFETs, high cell density MOSFET diodes are faster
(shorter trr), have less stored charge and a softer reverse recovery characteristic. The softness advantage of the high
cell density diode means they can be forced through reverse
recovery at a higher di/dt than a standard cell MOSFET
diode without increasing the current ringing or the noise generated. In addition, power dissipation incurred from switching
the diode will be less due to the shorter recovery time and
lower switching losses.
Standard Cell Density
trr
I S , SOURCE CURRENT
High Cell Density
trr
tb
ta
t, TIME
Figure 7. Reverse Recovery Time (trr)
4
Motorola TMOS Power MOSFET Transistor Device Data
MMDF3N06HD
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25°C. Peak
repetitive pulsed power limits are determined by using the
thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance – General Data and Its Use.”
Switching between the off–state and the on–state may traverse any load line provided neither rated peak current (IDM)
nor rated voltage (VDSS) is exceeded, and that the transition
time (tr, tf) does not exceed 10 µs. In addition the total power
averaged over a complete switching cycle must not exceed
(TJ(MAX) – TC)/(RθJC).
A power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For reli-
TJ = 25°C
C, CAPACITANCE (pF)
1000
800
Crss
600
Ciss
400
200
Coss
0
–10
–5.0
5.0
20
0
10
15
25
VGS
VDS
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
30
12
10
9.0
VGS
20
8.0
7.0
6.0
5.0
Q1
4.0
3.0
1.0
0
Q3
0
2.0
10
ID = 3.0 A
TJ = 25°C
VDS
4.0
6.0
8.0
12
10
Qg, TOTAL GATE CHARGE (nC)
0
14
16
Figure 9. Gate–to–Source and
Drain–to–Source Voltage versus Total Charge
2.5
1000
VDD = 30 V
ID = 3.0 A
VGS = 10 V
TJ = 25°C
IS, SOURCE CURRENT (AMPS)
t, TIME (ns)
Q2
2.0
Figure 8. Capacitance Variation
100
30
QT
11
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Ciss
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
1200
able operation, the stored energy from circuit inductance dissipated in the transistor while in avalanche must be less than
the rated limit and must be adjusted for operating conditions
differing from those specified. Although industry practice is to
rate in terms of energy, avalanche energy capability is not a
constant. The energy rating decreases non–linearly with an
increase of peak current in avalanche and peak junction temperature.
Although many E–FETs can withstand the stress of drain–
to–source avalanche at currents up to rated pulsed current
(IDM), the energy rating is specified at rated continuous current (ID), in accordance with industry custom. The energy rating must be derated for temperature as shown in the
accompanying graph (Figure 9). Maximum energy at currents below rated continuous ID can safely be assumed to
equal the values indicated.
td(off)
tf
tr
td(on)
10
TJ = 25°C
VGS = 0 V
2.0
1.5
1.0
0.5
0
1.0
1.0
10
RG, GATE RESISTANCE (OHMS)
100
Figure 10. Resistive Switching Time Variation
versus Gate Resistance
Motorola TMOS Power MOSFET Transistor Device Data
0.5
0.6
0.65
0.7
0.75
0.55
VSD, SOURCE–TO–DRAIN VOLTAGE (VOLTS)
0.8
Figure 11. Diode Forward Voltage
versus Current
5
MMDF3N06HD
10
120
VGS = 12 V
SINGLE PULSE
TA = 25°C
EAS, SINGLE PULSE DRAIN-TO-SOURCE
AVALANCHE ENERGY (mJ)
I D , DRAIN CURRENT (AMPS)
100
1.0 ms
10 ms
1.0
0.1
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
dc
ID = 3.0 A
100
80
60
40
20
0.01
0.1
1.0
0
10
100
25
45
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
65
85
105
125
145
TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 12. Maximum Rated Forward Biased
Safe Operating Area
Figure 13. Maximum Avalanche Energy versus
Starting Junction Temperature
TYPICAL ELECTRICAL CHARACTERISTICS
Rthja(t), EFFECTIVE TRANSIENT
THERMAL RESISTANCE
1.0
D = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.0106 Ω
Chip
Junction
0.01
0.0253 F
0.0431 Ω
0.1406 F
0.1643 Ω
0.5064 F
0.3507 Ω
2.9468 F
0.4302 Ω
177.14 F
SINGLE PULSE
Ambient
0.001
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 14. Thermal Response
di/dt
IS
trr
ta
tb
TIME
0.25 IS
tp
IS
Figure 15. Diode Reverse Recovery Waveform
6
Motorola TMOS Power MOSFET Transistor Device Data
MMDF3N06HD
INFORMATION FOR USING THE SO–8 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self–align when subjected to a
solder reflow process.
0.060
1.52
0.275
7.0
0.155
4.0
0.024
0.6
0.050
1.270
inches
mm
SO–8 POWER DISSIPATION
The power dissipation of the SO–8 is a function of the input
pad size. This can vary from the minimum pad size for
soldering to the pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from the
device junction to ambient; and the operating temperature, TA.
Using the values provided on the data sheet for the SO–8
package, PD can be calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this case
is 2.0 Watts.
PD = 150°C – 25°C = 2.0 Watts
62.5°C/W
The 62.5°C/W for the SO–8 package assumes the
recommended footprint on a glass epoxy printed circuit board
to achieve a power dissipation of 2.0 Watts using the footprint
shown. Another alternative would be to use a ceramic
substrate or an aluminum core board such as Thermal Clad.
Using board material such as Thermal Clad, the power
dissipation can be doubled using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
Motorola TMOS Power MOSFET Transistor Device Data
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
7
MMDF3N06HD
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones and a figure
for belt speed. Taken together, these control settings make up
a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remembers
these profiles from one operating session to the next. Figure
12 shows a typical heating profile for use when soldering a
surface mount device to a printed circuit board. This profile will
vary among soldering systems, but it is a good starting point.
Factors that can affect the profile include the type of soldering
system in use, density and types of components on the board,
type of solder used, and the type of board or substrate material
being used. This profile shows temperature versus time. The
STEP 1
PREHEAT
ZONE 1
“RAMP”
200°C
STEP 2
STEP 3
VENT
HEATING
“SOAK” ZONES 2 & 5
“RAMP”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
line on the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this
profile. The type of solder used was 62/36/2 Tin Lead Silver
with a melting point between 177 –189°C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
STEP 6
VENT
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
“SPIKE”
“SOAK”
170°C
STEP 7
COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
160°C
150°C
150°C
100°C
140°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 16. Typical Solder Heating Profile
8
Motorola TMOS Power MOSFET Transistor Device Data
MMDF3N06HD
PACKAGE DIMENSIONS
–A–
M
1
4
R
4X
0.25 (0.010)
–B–
X 45 _
B
M
5
P
8
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
J
M_
C
F
G
–T–
K
SEATING
PLANE
8X
D
0.25 (0.010)
M
T B
S
A
S
CASE 751–05
SO–8
ISSUE P
Motorola TMOS Power MOSFET Transistor Device Data
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.18
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
STYLE 11:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
SOURCE 1
GATE 1
SOURCE 2
GATE 2
DRAIN 2
DRAIN 2
DRAIN 1
DRAIN 1
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MMDF3N06HD
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447
JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1,
Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488
Mfax: [email protected] – TOUCHTONE 602–244–6609
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
INTERNET: http://motorola.com/sps
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Motorola TMOS Power MOSFET Transistor
Device Data