Order this document by MMSF2P02E/D SEMICONDUCTOR TECHNICAL DATA Medium Power Surface Mount Products Motorola Preferred Device MiniMOS devices are an advanced series of power MOSFETs which utilize Motorola’s TMOS process. These miniature surface mount MOSFETs feature ultra low RDS(on) and true logic level performance. They are capable of withstanding high energy in the avalanche and commutation modes and the drain–to–source diode has a low reverse recovery time. MiniMOS devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc–dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients. • • • • • • • • SINGLE TMOS POWER MOSFET 2.5 AMPERES 20 VOLTS RDS(on) = 0.250 OHM D CASE 751–05, Style 13 SO–8 G Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life Logic Level Gate Drive — Can Be Driven by Logic ICs Miniature SO–8 Surface Mount Package — Saves Board Space Diode Is Characterized for Use In Bridge Circuits Diode Exhibits High Speed Avalanche Energy Specified Mounting Information for SO–8 Package Provided IDSS Specified at Elevated Temperature S N–C 1 8 Drain Source 2 7 Drain Source 3 6 Drain Gate 4 5 Drain Top View MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)(1) Rating Drain–to–Source Voltage Gate–to–Source Voltage — Continuous Drain Current — Continuous @ TA = 25°C (2) Drain Current — Continuous @ TA = 100°C Drain Current — Single Pulse (tp ≤ 10 µs) Total Power Dissipation @ TA = 25°C(2) Operating and Storage Temperature Range Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C (VDD = 20 Vdc, VGS = 5.0 Vdc, IL = 6.0 Apk, L = 12 mH, RG = 25 Ω) Thermal Resistance — Junction to Ambient(2) Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds Symbol Value Unit VDSS VGS 20 Vdc ± 20 Vdc ID ID IDM PD 2.5 1.7 13 Adc 2.5 Watts TJ, Tstg EAS – 55 to 150 °C 216 mJ RθJA 50 °C/W TL 260 °C Apk DEVICE MARKING S2P02 (1) Negative sign for P–Channel device omitted for clarity. (2) Mounted on 2” square FR4 board (1” sq. 2 oz. Cu 0.06” thick single sided), 10 sec. max. ORDERING INFORMATION Device MMSF2P02ER2 Reel Size Tape Width Quantity 13″ 12 mm embossed tape 2500 units Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Designer’s, HDTMOS and MiniMOS are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Thermal Clad is a registered trademark of Bergquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. REV 4 TMOS Motorola Motorola, Inc. 1996 Power MOSFET Transistor Device Data 1 MMSF2P02E ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)(1) Symbol Characteristic Min Typ Max Unit 20 — — 24.7 — — — — — — 1.0 10 — — 100 1.0 2.0 4.7 3.0 — — — 0.19 0.3 0.25 0.4 gFS 1.0 2.8 — Mhos Ciss — 340 475 pF Coss — 220 300 Crss — 75 150 td(on) — 20 40 tr — 40 80 td(off) — 53 106 tf — 41 82 td(on) — 13 26 tr — 29 58 td(off) — 30 60 tf — 28 56 QT — 10 15 Q1 — 1.1 — Q2 — 3.3 — Q3 — 2.5 — VSD — 1.5 2.0 Vdc trr — 34 64 ns ta — 18 — tb — 16 — QRR — 0.035 — OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 µAdc) Temperature Coefficient (Positive) V(BR)DSS Zero Gate Voltage Drain Current (VDS = 20 Vdc, VGS = 0 Vdc) (VDS = 20 Vdc, VGS = 0 Vdc, TJ = 125°C) IDSS Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0) IGSS Vdc mV/°C µAdc nAdc ON CHARACTERISTICS(2) Gate Threshold Voltage (VDS = VGS, ID = 250 µAdc) Threshold Temperature Coefficient (Negative) VGS(th) Static Drain–to–Source On–Resistance (VGS = 10 Vdc, ID = 2.0 Adc) (VGS = 4.5 Vdc, ID = 1.0 Adc) RDS(on) Forward Transconductance (VDS = 3.0 Vdc, ID = 1.0 Adc) Vdc mV/°C Ohm DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance (VDS = 16 Vdc, VGS = 0 Vdc, f = 1.0 MHz) Transfer Capacitance SWITCHING CHARACTERISTICS(3) Turn–On Delay Time Rise Time Turn–Off Delay Time (VDD = 10 Vdc, ID = 2.0 Adc, VGS = 5.0 Vdc, RG = 6.0 Ω) Fall Time Turn–On Delay Time Rise Time Turn–Off Delay Time (VDD = 10 Vdc, ID = 2.0 Adc, VGS = 10 Vdc, RG = 6.0 Ω) Fall Time Gate Charge (VDS = 16 Vdc, ID = 2.0 Adc, VGS = 10 Vdc) SOURCE–DRAIN DIODE CHARACTERISTICS Forward On–Voltage(2) (IS = 2.0 Adc, VGS = 0 Vdc) Reverse Recovery Time (IS = 2.0 Adc, VGS = 0 Vdc, dIS/dt = 100 A/µs) Reverse Recovery Stored Charge ns ns nC µC (1) Negative sign for P–Channel device omitted for clarity. (2) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%. (3) Switching characteristics are independent of operating junction temperature. 2 Motorola TMOS Power MOSFET Transistor Device Data MMSF2P02E TYPICAL ELECTRICAL CHARACTERISTICS 4 4.1 V 3.9 V 1 3.7 V 3.5 V 3.3 V 0 0.4 0.8 1.2 1.6 100°C 2 25°C TJ = –55°C 1 3 3.5 4 4.5 VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS) VGS, GATE–TO–SOURCE VOLTAGE (VOLTS) Figure 1. On–Region Characteristics Figure 2. Transfer Characteristics 0.6 ID = 1 A TJ = 25°C 0.5 0.4 0.3 0.2 0.1 0 3 3 0 2.5 2 4 7 6 5 8 9 10 0.6 TJ = 25°C 0.5 0.4 VGS = 4.5 0.3 0.2 10 V 0.1 0 0.5 1 1.5 2 VGS, GATE–TO–SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPS) Figure 3. On–Resistance versus Gate–to–Source Voltage Figure 4. On–Resistance versus Drain Current and Gate Voltage 2.0 100 VGS = 10 V ID = 2 A VGS = 0 V 1.5 I DSS , LEAKAGE (nA) RDS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS) I D , DRAIN CURRENT (AMPS) 4.3 V RDS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS) I D , DRAIN CURRENT (AMPS) 4.5 V 2 VDS ≥ 10 V TJ = 25°C 4.7 V 3 0 RDS(on) , DRAIN–TO–SOURCE RESISTANCE (NORMALIZED) 4 5V VGS = 10 7 V 1.0 0.5 0 – 50 – 25 0 25 50 75 100 125 150 TJ = 125°C 10 100°C 1 0 4 8 12 16 TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 5. On–Resistance Variation with Temperature Figure 6. Drain–to–Source Leakage Current versus Voltage Motorola TMOS Power MOSFET Transistor Device Data 20 3 MMSF2P02E POWER MOSFET SWITCHING t = Q/IG(AV) During the rise and fall time interval when switching a resistive load, VGS remains virtually constant at a level known as the plateau voltage, VSGP. Therefore, rise and fall times may be approximated by the following: tr = Q2 x RG/(VGG – VGSP) tf = Q2 x RG/VGSP where VGG = the gate drive voltage, which varies from zero to VGG RG = the gate drive resistance and Q2 and VGSP are read from the gate charge curve. 1000 VDS = 0 V TJ = 25°C Ciss 800 C, CAPACITANCE (pF) VGS = 0 V 600 Crss 400 Ciss Coss 200 Crss 0 10 td(on) = RG Ciss In [VGG/(VGG – VGSP)] td(off) = RG Ciss In (VGG/VGSP) The capacitance (Ciss) is read from the capacitance curve at a voltage corresponding to the off–state condition when calculating td(on) and is read at a voltage corresponding to the on–state when calculating td(off). At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET source lead, inside the package and in the circuit wiring which is common to both the drain and gate current paths, produces a voltage at the source which reduces the gate drive current. The voltage is determined by Ldi/dt, but since di/dt is a function of drain current, the mathematical solution is complex. The MOSFET output capacitance also complicates the mathematics. And finally, MOSFETs have finite internal gate resistance which effectively adds to the resistance of the driving source, but the internal resistance is difficult to measure and, consequently, is not specified. 12 9 6 3 ID = 2 A TJ = 25°C 2 4 6 8 Qg, TOTAL GATE CHARGE (nC) 10 0 12 Figure 8. Gate–to–Source and Drain–to–Source Voltage versus Total Charge 100 2 TJ = 25°C VGS = 0 V IS, SOURCE CURRENT (AMPS) t, TIME (ns) VDD = 10 V ID = 2 A VGS = 10 V TJ = 25°C td(off) tr tf td(on) 1 10 RG, GATE RESISTANCE (OHMS) Figure 9. Resistive Switching Time Variation versus Gate Resistance 4 4 Q3 0 8 Q2 Q1 Figure 7. Capacitance Variation 10 12 VGS VDS 0 30 5 0 5 10 15 20 25 VGS VDS GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (VOLTS) 16 QT VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS) The published capacitance data is difficult to use for calculating rise and fall because drain–gate capacitance varies greatly with applied voltage. Accordingly, gate charge data is used. In most cases, a satisfactory estimate of average input current (IG(AV)) can be made from a rudimentary analysis of the drive circuit so that During the turn–on and turn–off delay times, gate current is not constant. The simplest calculation uses appropriate values from the capacitance curves in a standard equation for voltage change in an RC network. The equations are: VGS, GATE–TO–SOURCE VOLTAGE (VOLTS) Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (∆t) are determined by how fast the FET input capacitance can be charged by current from the generator. 100 1.6 1.2 0.8 0.4 0 0.6 0.8 1 1.2 1.4 VSD, SOURCE–TO–DRAIN VOLTAGE (VOLTS) 1.6 Figure 10. Diode Forward Voltage versus Current Motorola TMOS Power MOSFET Transistor Device Data MMSF2P02E di/dt = 300 A/µs 100 I D , DRAIN CURRENT (AMPS) I S , SOURCE CURRENT Standard Cell Density trr High Cell Density trr tb ta 10 VGS = 20 V SINGLE PULSE TC = 25°C 1 ms 10 ms 1 dc 0.1 RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.01 0.1 1 t, TIME 10 100 VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 12. Maximum Rated Forward Biased Safe Operating Area Figure 11. Reverse Recovery Time (trr) 250 EAS, SINGLE PULSE DRAIN–TO–SOURCE AVALANCHE ENERGY (mJ) Mounted on 2” sq. FR4 board (1” sq. 2 oz. Cu 0.06” thick single sided), 10s max. ID = 6 A 200 150 100 50 0 25 50 75 100 125 150 TJ, STARTING JUNCTION TEMPERATURE (°C) Figure 13. Maximum Avalanche Energy versus Starting Junction Temperature rating must be derated for temperature as shown in the accompanying graph (Figure 13). Maximum energy at currents below rated continuous ID can safely be assumed to equal the values indicated. Although many E–FETs can withstand the stress of drain– to–source avalanche at currents up to rated pulsed current (IDM), the energy rating is specified at rated continuous current (ID), in accordance with industry custom. The energy Rthja(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE 10 1 0.1 D = 0.5 0.2 0.1 0.05 0.02 Normalized to θja at 10s. Chip 0.0022 Ω 0.0210 Ω 0.2587 Ω 0.0020 F 0.0207 F 0.3517 F 0.7023 Ω 0.6863 Ω 0.01 0.01 3.1413 F 108.44 F SINGLE PULSE 0.001 1.0E–05 1.0E–04 1.0E–03 1.0E–02 1.0E–01 t, TIME (s) 1.0E+00 1.0E+01 1.0E+02 Ambient 1.0E+03 Figure 14. Thermal Response Motorola TMOS Power MOSFET Transistor Device Data 5 MMSF2P02E di/dt IS trr ta tb TIME 0.25 IS tp IS Figure 15. Diode Reverse Recovery Waveform INFORMATION FOR USING THE SO–8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self–align when subjected to a solder reflow process. 0.060 1.52 0.275 7.0 0.155 4.0 0.024 0.6 0.050 1.270 inches mm SO–8 POWER DISSIPATION The power dissipation of the SO–8 is a function of the input pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SO–8 package, PD can be calculated as follows: PD = TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into 6 the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 2.5 Watts. PD = 150°C – 25°C 50°C/W = 2.5 Watts The 50°C/W for the SO–8 package assumes the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 2.5 Watts using the footprint shown. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. Motorola TMOS Power MOSFET Transistor Device Data MMSF2P02E SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed 260°C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 13 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The STEP 1 PREHEAT ZONE 1 “RAMP” 200°C STEP 2 STEP 3 VENT HEATING “SOAK” ZONES 2 & 5 “RAMP” DESIRED CURVE FOR HIGH MASS ASSEMBLIES line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 –189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 “SPIKE” “SOAK” 170°C STEP 6 VENT STEP 7 COOLING 205° TO 219°C PEAK AT SOLDER JOINT 160°C 150°C 150°C 100°C 140°C 100°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 16. Typical Solder Heating Profile Motorola TMOS Power MOSFET Transistor Device Data 7 MMSF2P02E PACKAGE DIMENSIONS –A– M 1 4 R 0.25 (0.010) 4X –B– X 45 _ B M 5 P 8 NOTES: 1. DIMENSIONS A AND B ARE DATUMS AND T IS A DATUM SURFACE. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 3. DIMENSIONS ARE IN MILLIMETER. 4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 6. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. J M_ C F G –T– K SEATING PLANE 8X D 0.25 (0.010) M T B S A S CASE 751–05 SO–8 ISSUE P DIM A B C D F G J K M P R MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.18 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 STYLE 13: PIN 1. 2. 3. 4. 5. 6. 7. 8. N.C. SOURCE SOURCE GATE DRAIN DRAIN DRAIN DRAIN Motorola reserves the right to make changes without further notice to any products herein. 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