MCC BZT52B9V1 410 mw zener diode 2.4 to 75 volt Datasheet

MCC
R
Micro Commercial Components
BZT52B2V4
THRU
BZT52B75
omponents
20736 Marilla Street Chatsworth
!"#
$ % !"#
Features
•
•
•
•
•
•
•
•
410 mW
Zener Diode
2.4 to 75 Volts
Planar Die Construction
410mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix designates
RoHS Compliant. See ordering information)
Halogen free available upon request by adding suffix "-HF"
SOD123
A
B
Absolute Maximum Ratings
Symbol
Rating
Rating
Unit
410
mW
PD
Power dissipation
TJ
Junction Temperature
-55 to +175
к
Storage Temperature Range
-55 to +175
к
TSTG
C
E
H
D
J
G
Absolute Maximum Ratings
Symbol
RthJA
Rating
Thermal Resistance Junction
to Ambient*
Rating
Unit
DIM
430
к/W
A
B
C
D
E
G
H
J
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm2
Electrical Characteristics
Symbol
VF
Rating
Maximum Forward
Voltage (IF=10mAdc)
Rating
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.140
.152
3.55
3.85
.100
.112
2.55
2.85
.055
.071
1.40
1.80
----.053
----1.35
.012
.031
0.30
.78
.006
----0.15
--------.01
----.25
----.006
----.15
NOTE
Unit
0.9
V
0.093"
0.036”
Revision: F
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2017/11/22
MCC
BZT52B2V4 THRU BZT52B75
R
Micro Commercial Components
Electrical Characteristics@25 C
O
Maximum Zener
Impedance (2)
ZZT(OHMS)
ZENER VOLTAGE
Vz(1)
VOLTS
Type
Maximum Zener
Impedance (2)
ZZK(OHMS)
Max.
REVERSE
CURRENT
IR(Max)@VR
Marking
µA
100
75
50
25
15
1.0
1.0
1.0
1.0
1.0
W1/2WX
W2/2W1
W3/2W2
W4/2W3
W5/2W4
10
1.0
5
5
1.0
2.0
W6/2W5
W7/2W6
0.1
0.1
0.8
1.0
Min.
2.35
2.64
2.94
3.23
3.52
Nom.
2.4
2.7
3.0
3.3
3.6
Max.
2.45
2.75
3.06
3.37
3.67
IZT(mA)
5
5
5
5
5
Max.
85
83
95
95
95
IZK(mA)
BZT52B2V4
BZT52B2V7
BZT52B3V0
BZT52B3V3
BZT52B3V6
1
1
1
1
1
600
600
600
600
600
BZT52B3V9
BZT52B4V3
3.82
4.21
3.9
4.3
3.98
4.39
5
5
95
95
1
1
600
600
BZT52B4V7
4.61
4.7
4.79
5
78
1
500
BZT52B5V1
5.0
5.1
5.2
5
60
1
480
BZT52B5V6
5.49
5.6
5.71
5
40
1
400
BZT52B6V2
6.08
6.2
6.32
5
10
1
150
0.1
2.0
WB/2WA
BZT52B6V8
6.66
6.8
6.94
5
8
1
80
0.1
3.0
WC/2WB
V
W8/2W7
W9/2W8
WA/2W9
BZT52B7V5
7.35
7.5
7.65
5
7
1
80
0.1
5.0
WD/2WC
BZT52B8V2
8.04
8.2
8.36
5
7
1
80
0.1
6.0
WE/2WD
BZT52B9V1
8.92
9.1
9.28
5
10
1
100
0.1
7.0
WF/2WE
BZT52B10
9.80
10
10.2
5
15
1
150
0.1
7.5
WG/2WF
BZT52B11
10.78
11
11.22
5
20
1
150
0.1
8.5
WH/2WG
BZT52B12
11.76
12
12.24
5
20
1
150
0.1
9.0
WI/2WH
BZT52B13
12.74
13
13.3
5
25
1
170
0.1
10.0
WK/2WI
BZT52B15
14.7
15
15.3
5
30
1
200
0.1
11.0
WL/2WJ
BZT52B16
15.68
16
16.3
5
40
1
200
0.1
12.0
WM/2WK
BZT52B18
17.6
18
18.4
5
50
1
225
0.1
14.0
WN/2WL
BZT52B20
19.6
20
20.4
5
50
1
225
0.1
15.0
WO/2WM
BZT52B22
21.56
22
22.44
5
55
1
250
0.1
17.0
WP/2WN
18.0
WR/2WO
BZT52B24
23.52
24
24.5
5
70
1
250
0.1
BZT52B27
26.46
27
27.54
2
80
1
300
0.1
20.0
WS/2WP
BZT52B30
29.4
30
30.6
2
80
1
300
0.1
22.5
WT/2WQ
BZT52B33
32.34
33
33.7
2
80
1
325
0.1
25.0
WU/2WR
BZT52B36
35.28
36
36.72
2
90
1
350
0.1
27.0
WW/2WS
BZT52B39
38.22
39
39.8
2
90
1
350
0.1
29.0
WX/2WT
BZT52B43
42.14
43
43.86
2
100
1
375
0.1
32.0
WY/2WU
BZT52B47
46.06
47
47.94
2
100
1
375
0.1
35.0
WZ/2WV
BZT52B51
49.98
51
52.02
2
100
1
400
0.1
38.0
XA/2X1
BZT52B56
54.88
56
57.12
2
135
1
1000
0.1
42.0
X2/2X2
BZT52B62
60.76
62
63.24
2
150
1
1000
0.1
46.0
X3/2X3
BZT52B68
66.64
68
69.36
2
200
1
1000
0.1
51.0
X4/2X4
BZT52B75
73.50
75
76.50
2
250
1
1000
0.1
56.0
X5/2X5
2
(1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm
(2) f=1KHz
Revision: F
www.mccsemi.com
2 of 3
2017/11/22
MCC
R
Micro Commercial Components
Ordering Information :
Device
Packing
Part Number-TP
Tape&Reel: 3Kpcs/Reel
Note : Adding "-HF" suffix for halogen free, eg. Part Number-TP-HF
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approval of Micro Commercial Components Corporation.
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