TSC MBRS16100 Surface mount schottky barrier rectifier Datasheet

MBRS1635 thru MBRS16150
Taiwan Semiconductor
CREAT BY ART
FEATURES
Surface Mount Schottky Barrier Rectifiers
- Low power loss, high efficiency
- Ideal for automated placement
- Guardring for overvoltage protection
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
TO-263AB (D2PAK)
Case: TO-263AB (D2PAK)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity: As marked
Weight: 1.37 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
SYMBOL
MBRS MBRS MBRS MBRS MBRS MBRS MBRS
1635
1645
1650
1660
1690 16100 16150
Unit
Maximum repetitive peak reverse voltage
VRRM
35
45
50
60
90
100
150
V
Maximum RMS voltage
VRMS
24
31
35
42
63
70
105
V
Maximum DC blocking voltage
VDC
35
45
50
60
90
100
150
V
Maximum average forward rectified current
IF(AV)
16
A
Peak repetitive forward current
(Rated VR, Square wave, 20KHz)
IFRM
32
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
150
A
Peak repetitive reverse surge Current (Note 1)
IRRM
1
VF
0.63
0.75
0.85
0.95
0.57
0.65
0.82
0.92
0.3
0.1
7.5
5
Maximum instantaneous forward voltage (Note 2)
IF=16A, TJ=25℃
IF=16A, TJ=125℃
Maximum reverse current @ rated VR
TJ=25 ℃
TJ=125 ℃
Typical thermal resistance
Operating junction temperature range
Storage temperature range
IR
0.5
0.5
15
10
A
V
mA
O
RθJC
1.5
TJ
- 55 to +150
O
C
- 55 to +175
O
C
TSTG
C/W
Note 1: 2.0μs Pulse Width, f=1.0KHz
Note 2: Pulse Test : 300μs Pulse Width, 1% Duty Cycle
Document Number: DS_D1309064
Version: I13
MBRS1635 thru MBRS16150
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
AEC-Q101
PACKING CODE GREEN COMPOUND
QUALIFIED
MBRS16xx
(Note 1)
PACKAGE
PACKING
D2PAK
800 / 13" Paper reel
CODE
RN
Prefix "H"
Suffix "G"
C0
2
50 / Tube
D PAK
Note 1: "xx" defines voltage from 35V (MBRS1635) to 150V (MBRS16150)
EXAMPLE
AEC-Q101
PREFERRED P/N
PART NO.
PACKING CODE
MBRS1660 RN
MBRS1660
RN
MBRS1660 RNG
MBRS1660
RN
MBRS1660HRN
MBRS1660
QUALIFIED
H
GREEN COMPOUND
CODE
G
DESCRIPTION
Green compound
RN
AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT
20
AVERAGE FORWARD A
CURRENT (A)
16
12
8
RESISTIVE OR
INDUCTIVELOAD
WITH HEATSINK
4
0
50
60
70
80
90
100
110
120
130
140
150
PEAK FORWARD SURGE CURRENT (A)
FIG.1 FORWARD CURRENT DERATING CURVE
150
125
100
75
50
8.3ms Single Half Sine Wave
JEDEC Method
25
0
1
10
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
100
100
INSTANTANEOUS REVERSE A
CURRENT (mA)
Pulse Width=300μs
1% Duty Cycle
INSTANTANEOUS FORWARD A
CURRENT (A)
100
NUMBER OF CYCLES AT 60 Hz
CASE TEMPERATURE (oC)
10
TJ=125℃
1
TJ=25℃
0.1
MBRS1635-1645
MBRS1650-16150
10
TJ=125℃
1
0.1
TJ=75℃
0.01
MBRS1635-1645
MBRS1650-16150
TJ=25℃
0.001
0.01
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
FORWARD VOLTAGE (V)
Document Number: DS_D1309064
1
1.1 1.2
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Version: I13
MBRS1635 thru MBRS16150
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE
100
f=1.0MHz
Vsig=50mVp-p
TRANSIENT THERMAL IMPEDANCE A
(℃/W)
JUNCTION CAPACITANCE (pF) A
10000
10
1000
MBRS1635-1645
MBRS1650-16150
100
1
0.1
0.1
1
10
100
0.01
0.1
1
REVERSE VOLTAGE (V)
10
100
T-PULSE DURATION(s)
PACKAGE OUTLINE DIMENSIONS
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
-
10.5
-
0.413
B
14.60
15.88
0.575
0.625
C
2.41
2.67
0.095
0.105
D
0.68
0.94
0.027
0.037
E
2.29
2.79
0.090
0.110
F
4.44
4.70
0.175
0.185
G
1.14
1.40
0.045
0.055
H
1.14
1.40
0.045
0.055
I
8.25
9.25
0.325
0.364
J
0.36
0.53
0.014
0.021
K
2.03
2.79
0.080
0.110
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
10.8
0.425
B
8.3
0.327
C
1.1
0.043
D
3.5
0.138
E
16.9
0.665
F
9.5
0.374
G
2.5
0.098
MARKING DIAGRAM
P/N
= Specific Device Code
G
= Green Compound
YWW
= Date Code
F
= Factory Code
Document Number: DS_D1309064
Version: I13
MBRS1635 thru MBRS16150
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1309064
Version: I13
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