Order this document by MPX5700/D SEMICONDUCTOR TECHNICAL DATA " " !!# ! " "# !" " The MPX5700 series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. INTEGRATED PRESSURE SENSOR 0 to 700 kPa (0 to 101.5 psi) 0.2 to 4.7 V OUTPUT Features • 2.5% Maximum Error over 0° to 85°C • Ideally Suited for Microprocessor or Microcontroller–Based Systems BASIC CHIP CARRIER ELEMENT CASE 867–08, STYLE 1 • Available in Differential and Gauge Configurations • Patented Silicon Shear Stress Strain Gauge • Durable Epoxy Unibody Element VS 3 THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X–ducer SENSING ELEMENT 2 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY 1 Vout DIFFERENTIAL PORT OPTION CASE 867C–05, STYLE 1 PINS 4, 5 AND 6 ARE NO CONNECTS PIN NUMBER GND Figure 1. Fully Integrated Pressure Sensor Schematic MAXIMUM RATINGS(1) Parametrics v 1 Atmosphere) Burst Pressure (P2 v 1 Atmosphere) Overpressure (P2 Symbol Value Unit P1max 2800 kPa P1burst 5000 kPa Tstg – 40 to +125 °C TA – 40 to +125 °C Storage Temperature Operating Temperature 1 Vout 4 N/C 2 Gnd 5 N/C 3 VS 6 N/C NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the Lead. 1. TC = 25°C unless otherwise noted. Maximum Ratings apply to Case 867–08 only. 2. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 3. This sensor is designed for applications where P1 is always greater than, or equal to P2. Senseon and X–ducer are trademarks of Motorola, Inc. REV 2 Motorola Sensor Device Data Motorola, Inc. 1997 1 OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 700 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io – 7.0 10 mAdc Zero Pressure Offset(3) (0 to 85°C) Voff 0.088 0.2 0.313 Vdc Full Scale Output(4) (0 to 85°C) VFSO 4.587 4.7 4.813 Vdc Full Scale Span(5) (0 to 85°C) VFSS — 4.5 — Vdc Accuracy(6) (0 to 85°C) — — — ± 2.5 %VFSS V/P — 6.4 — mV/kPa Sensitivity Response Time(7) tR — 1.0 — ms IO+ — 0.1 — mAdc — — 20 — ms Symbol Min Typ Max Unit Weight, Basic Element (Case 867) — — 4.0 — Grams Cavity Volume — — — 0.01 IN3 Volumetric Displacement — — — 0.001 IN3 Output Source Current at Full Scale Output Warm–Up Time(8) Decoupling circuit shown in Figure 4 required to meet electrical specifications. MECHANICAL CHARACTERISTICS Characteristic NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. 9. P2 max is 500 kPa. 2 Motorola Sensor Device Data ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. (For use of the MPX5700D in a high pressure, cyclic application, consult the factory.) The MPX5700 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows a typical decoupling circuit for interfacing the sensor to the A/D input of a microprocessor. Proper decoupling of the power supply is recommended. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit below. (The output will saturate outside of the specified pressure range.) 5.0 TRANSFER FUNCTION: Vout = VS*(0.0012858*P+0.04) ± ERROR 4.0 VS = 5.0 Vdc TEMP = 0 to 85°C 3.5 OUTPUT (V) 4.5 3.0 TYPICAL 2.5 2.0 MIN MAX 1.5 1.0 0.5 0 0 100 200 400 600 300 500 DIFFERENTIAL PRESSURE (kPa) 700 800 Figure 2. Output versus Pressure Differential FLUORO SILICONE DIE COAT STAINLESS STEEL METAL COVER ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ DIE P1 WIRE BOND LEAD FRAME P2 MPX5700 OUTPUT (PIN 1) 50 pF A/D 51 k µ PROCESSOR RTV DIE BOND EPOXY CASE Figure 3. Cross–Sectional Diagram (Not to Scale) Motorola Sensor Device Data Figure 4. Typical Decoupling Filter for Sensor to Microprocessor Interface 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX5700D 867–08C Stainless Steel Cap MPX5700DP 867C–05 Side with Part Marking MPX5700GP 867B–04 Side with Port Attached MPX5700GS 867E–03 Side with Port Attached MPX5700GSX 867F–03 Side with Port Attached ORDERING INFORMATION The MPX5700 pressure sensor is available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series D i T Device Type O i Options C Case Type T Order Number Device Marking Basic Element Differential 867–08C MPX5700D MPX5700D Ported Elements Differential Dual Ports 867C–05 MPX5700DP MPX5700DP Gauge 867B–04 MPX5700GP MPX5700GP Gauge, Axial 867E–03 MPX5700GS MPX5700D Gauge, Axial PC Mount 867F–03 MPX5700GSX MPX5700D 4 Motorola Sensor Device Data PACKAGE DIMENSIONS C R M B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). POSITIVE PRESSURE (P1) –A– N PIN 1 SEATING PLANE 1 2 3 4 5 L DIM A B C D F G J L M N R S 6 –T– G J S F D 6 PL 0.136 (0.005) M T A M INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 STYLE 1: PIN 1. 2. 3. 4. 5. 6. CASE 867–08 ISSUE N MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66 VOUT GROUND VCC V1 V2 VEX BASIC ELEMENT (A, D) –T– A U L SEATING PLANE R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. PORT #1 POSITIVE PRESSURE (P1) V DIM A B C D F G J K L N P Q R S U V –Q– N B K 1 PIN 1 –P– C J 0.25 (0.010) M T Q 3 4 5 6 S G M 2 F D 6 PL 0.13 (0.005) M T P CASE 867B–04 ISSUE E S Q INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC 0.182 0.194 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC 4.62 4.93 S STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX PRESSURE SIDE PORTED (AP, GP) Motorola Sensor Device Data 5 PACKAGE DIMENSIONS–CONTINUED P 0.25 (0.010) M T Q U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– M L V DIM A B C D F G J K L N P Q R S U V W X PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N –Q– PORT #2 VACUUM (P2) B PIN 1 1 2 3 4 5 K 6 C SEATING PLANE –T– –T– S SEATING PLANE D 6 PL G J F 0.13 (0.005) M A INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 M STYLE 1: PIN 1. 2. 3. 4. 5. 6. CASE 867C–05 ISSUE F VOUT GROUND VCC V1 V2 VEX PRESSURE AND VACUUM SIDES PORTED (DP) C A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –B– V DIM A B C D E F G J K N S V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K J N 5 –T– 3 2 1 S G F E 4 D INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.027 0.033 0.178 0.186 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.220 0.240 0.182 0.194 MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.69 0.84 4.52 4.72 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 5.59 6.10 4.62 4.93 6 PL 0.13 (0.005) M CASE 867E–03 ISSUE D T B M STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX PRESSURE SIDE PORTED (AS, GS) 6 Motorola Sensor Device Data PACKAGE DIMENSIONS–CONTINUED –T– C A E –Q– U N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) –P– 0.25 (0.010) T Q M 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.027 0.033 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. F CASE 867F–03 ISSUE D MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.68 0.84 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.93 VOUT GROUND VCC V1 V2 VEX PRESSURE SIDE PORTED (ASX, GSX) Motorola Sensor Device Data 7 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. 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Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: [email protected] – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET: http://motorola.com/sps 8 ◊ MPX5700/D Motorola Sensor Device Data