MOTOROLA MPXV4006G

Freescale Semiconductor, Inc.
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by MPXV4006G/D
SEMICONDUCTOR TECHNICAL DATA
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The MPXV4006G series piezoresistive transducer is a state–of–the–art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This sensor combines a
highly sensitive implanted strain gauge with advanced micromachining techniques,
thin–film metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
INTEGRATED
PRESSURE SENSOR
0 to 6 kPa (0 to 0.87 psi)
0.2 to 4.7 V OUTPUT
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Features
• Temperature Compensated over 10° to 60°C
• Ideally Suited for Microprocessor or Microcontroller–
Based Systems
SMALL OUTLINE PACKAGE
SURFACE MOUNT
SMALL OUTLINE PACKAGE
THROUGH–HOLE
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• Available in Gauge Surface Mount (SMT) or Through–
hole (DIP) Configurations
• Durable Thermoplastic (PPS) Package
MPXV4006G6U
CASE 482
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CASE 482C
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Figure 1. Fully Integrated Pressure Sensor
Schematic
PIN NUMBER
MPXV4006GP
CASE 1369
1
N/C
5
N/C
2
VS
6
N/C
3
Gnd
7
N/C
4
Vout
8
N/C
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is noted by the notch
in the lead.
MPXV4006DP
CASE 1351
Replaces MPXT4006D/D
REV 4
Motorola Sensor Device Data
 Motorola, Inc. 2002
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MAXIMUM RATINGS(NOTE)
Parametrics
Symbol
Value
Unit
Pmax
24
kPa
Storage Temperature
Tstg
–30 to +100
°C
Operating Temperature
TA
+10 to +60
°C
Maximum Pressure (P1 > P2)
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3
required to meet electrical specifications.)
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Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
0
—
6.0
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply Current
IS
—
—
10
mAdc
(RL = 51kΩ)
VFSS
—
4.6
—
V
(RL = 51kΩ)
Voff
0.100
0.225
0.430
V
V/P
—
766
—
mV/kPa
—
—
—
±5.0
%VFSS
Full Scale
Span(2)
Offset(3)(5)
Sensitivity
Accuracy(4)(5)
(10 to 60°C)
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• Offset Stability:
Output deviation, after 1000 temperature cycles, 30 to 100°C, and 1.5 million pressure cycles, with
minimum rated pressure applied.
• TcSpan:
Output deviation over the temperature range of 10 to 60°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C,
relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006G, external mechanical stresses and mounting position can affect
the zero pressure output reading. To obtain the 5% FSS accuracy, the device output must be “autozeroed’’ after installation. Autozeroing
is defined as storing the zero pressure output reading and subtracting this from the device’s output during normal operations.
2
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ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
test for dry air, and other media, are available from the factory.
Contact the factory for information regarding media tolerance
in your application.
Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves
are shown for operation over a temperature range of 10°C to
60°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
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Figure 2. Cross–Sectional Diagram (Not to Scale)
Figure 3. Recommended power supply decoupling
and output filtering recommendations.
For additional output filtering, please refer to
Application Note AN1646.
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The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic chip
carrier (Case 482). A fluorosilicone gel isolates the die surface
and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPXV4006G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Internal reliability and qualification
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Figure 4. Output versus Pressure Differential
(See Note 5 in Operating Characteristics)
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PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola pres-
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Part Number
sure sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Case Type
Pressure (P1) Side Identifier
MPXV4006G6U/T1
482
Stainless Steel Cap
MPXV4006GC6U/T1
482A
Side with Port Attached
MPXV4006G7U
482B
Stainless Steel Cap
MPXV4006GC7U
482C
Side with Port Attached
MPXV4006GP
1369
Side with Port Attached
MPXV4006DP
1351
Side with Part Marking
ORDERING INFORMATION
MPXV4006G series pressure sensors are available in the basic element package or with pressure ports. Two packing options
are offered for the 482 and 482A case configurations.
Device Type
Basic Element
Ported Element
Options
Case No.
MPX Series Order No.
Packing Options
Marking
Element Only
482
MPXV4006G6U
Rails
MPXV4006G
Element Only
482
MPXV4006G6T1
Tape and Reel
MPXV4006G
Element Only
482
MPXV4006G7U
Rails
MPXV4006G
Axial Port
482A
MPXV4006GC6U
Rails
MPXV4006G
Axial Port
482A
MPXV4006GC6T1
Tape and Reel
MPXV4006G
Axial Port
482A
MPXV4006GC7U
Rails
MPXV4006G
Side Port
1369
MPXV4006GP
Trays
MPXV4006G
Dual Port
1351
MPXV4006DP
Trays
MPXV4006G
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection interface between the board and the package. With the correct
footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and shorting between solder pads.
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4
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SMALL OUTLINE PACKAGE DIMENSIONS
SURFACE MOUNT
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SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED
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SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED
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SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED
THROUGH–HOLE
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8
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NOTES
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NOTES
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NOTES
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Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by
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intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life,
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Opportunity/Affirmative Action Employer.
MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective
owners.
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MPXV4006G/D