TI1 CY74FCT163374CPAC 16-bit register Datasheet

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT163374
CY74FCT163H374
16-Bit Registers
SCCS050 - March 1997 - Revised March 2000
Features
Functional Description
• Low power, pin-compatible replacement for LCX and
LPT families
• 5V tolerant inputs and outputs
• 24 mA balanced drive outputs
• Power-off disable outputs permits live insertion
• Edge-rate control circuitry for reduced noise
• FCT-C speed at 5.2 ns
• Latch-up performance exceeds JEDEC standard no. 17
• Typical output skew < 250 ps
• Industrial temperature range of –40˚C to +85˚C
• TSSOP (19.6-mil pitch) or SSOP (25-mil pitch)
• Typical Volp (ground bounce) performance exceeds Mil
Std 883D
• VCC = 2.7V to 3.6V
• ESD (HBM) > 2000V
CY74FCT163H374
• Bus hold on data inputs
• Eliminates the need for external pull-up or pull-down
resistors
• Devices with bus hold are not recommended for translating rail-to-rail CMOS signals to 3.3V logic levels
These devices are 16-bit D-type registers designed for use as
buffered registers in high-speed, low power bus applications.
These devices can be used as two independent 8-bit registers
or as a single 16-bit register by connecting the output Enable
(OE) and Clock (CLK) inputs. The outputs are 24-mA balanced
output drivers with current limiting resistors to reduce the need
for external terminating resistors, and provide for minimal
undershoot and reduced ground bounce. Flow-through pinout
and small shrink packaging aid in simplifying board layout.
The CY74FCT163H374 has “bus hold” on the data inputs,
which retains the input’s last state whenever the source driving
the input goes to high impedance. This eliminates the need for
pull-up/down resistors and prevents floating inputs.
The CY74FCT163374 is designed with inputs and outputs
capable of being driven by 5.0V buses, allowing its use in
mixed voltage systems as a translator. The outputs are also
designed with a power off disable feature enabling its use in
applications requiring live insertion.
Logic Block Diagrams CY74FCT163374, CY74FCT163H374
Pin Configuration
SSOP/TSSOP
Top View
1OE
1
48
1CLK
1O1
2
3
47
46
1 D1
GND
1O3
4
5
45
44
GND
1 D3
1O4
6
43
1 D4
VCC
1O5
7
42
8
9
41
VCC
1 D5
1O2
1OE
2OE
1CLK
2CLK
1D1
D
1O1
2 D1
C
D
2O1
C
1O6
GND
1O7
1O8
2O1
TO 7 OTHER CHANNELS
2O2
TO 7 OTHER CHANNELS
GND
2O3
10
11
12
13
40
39
38
14
15
37
36
35
34
1 D2
1 D6
GND
1 D7
1 D8
2 D1
2 D2
GND
2 D3
16
33
2O4
17
32
2 D4
VCC
2O5
18
31
19
30
VCC
2 D5
2O6
20
29
2 D6
GND
2O7
21
28
22
27
GND
2 D7
2O8
23
26
2 D8
2OE
24
25
2CLK
Lite Drive is a trademark of Cypress Semiconductor Corporation.
Copyright
© 2000, Texas Instruments Incorporated
CY74FCT163374
CY74FCT163H374
Maximum Ratings[3, 4]
Function Table[1]
Inputs
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Outputs
D
CLK
OE
O
Function
X
L
H
Z
High-Z
X
H
H
Z
L
L
L
H
L
H
Storage Temperature ..................................... −55°C to +125°C
Ambient Temperature with
Power Applied .................................................. −55°C to +125°C
Load
Register
Supply Voltage Range ..................................... 0.5V to +4.6V
DC Input Voltage .................................................−0.5V to +7.0V
L
H
Z
DC Output Voltage ..............................................−0.5V to +7.0V
H
H
Z
DC Output Current
(Maximum Sink Current/Pin) ...........................−60 to +120 mA
Power Dissipation .......................................................... 1.0W
Pin Description
Name
D
Operating Range
Description
Data
Inputs[2]
Range
CLK
Clock Inputs
OE
Three-State Output Enable Inputs (Active LOW)
O
Three-State Outputs
Industrial
Ambient
Temperature
VCC
−40°C to +85°C
2.7V to 3.6V
Electrical Characteristics for Non Bus Hold Devices Over the Operating Range VCC=2.7V to 3.6V
Parameter
Description
Test Conditions
VIH
Input HIGH Voltage
All Inputs
VIL
Input LOW Voltage
VH
Input
Hysteresis[6]
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=–18 mA
IIH
Input HIGH Current
IIL
Min.
Typ.[5]
2.0
Max.
Unit
5.5
V
0.8
V
100
–0.7
mV
–1.2
V
VCC=Max., VI=5.5
±1
µA
Input LOW Current
VCC=Max., VI=GND
±1
µA
IOZH
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=5.5V
±1
µA
IOZL
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=GND
±1
µA
IOS
Short Circuit Current[7]
VCC=Max., VOUT=GND
–240
mA
IOFF
Power-Off Disable
VCC=0V, VOUT≤4.5V
±100
µA
ICC
Quiescent Power Supply Current
VIN≤0.2V,
VIN>VCC–0.2V
VCC=Max.
0.1
10
µA
∆ICC
Quiescent Power Supply Current
(TTL inputs HIGH)
VIN=VCC–0.6V[8]
VCC=Max.
2.0
30
µA
–60
–135
Notes:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance.
= LOW-to-HIGH Transition.
2. On the CY74FCT163H374, these pins have “bus hold.”
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature
range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground
5. Typical values are at VCC=3.3V, TA = +25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
8. Per TTL driven input; all other inputs at VCC or GND.
2
CY74FCT163374
CY74FCT163H374
Electrical Characteristics For Bus Hold Devices Over the Operating Range VCC=2.7V to 3.6V
Parameter
Description
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Test Conditions
All Inputs
Min.
Typ.[5]
2.0
[6]
VH
Input Hysteresis
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=–18 mA
IIH
Input HIGH Current
VCC=Max., VI=VCC
IIL
Input LOW Current
Max.
Unit
VCC
V
0.8
V
100
[9]
VCC=Min.
mV
–0.7
– 1.2
V
±100
µA
±100
µA
VI=2.0V
–50
µA
VI=0.8V
+50
µA
IBBH
IBBL
Bus Hold Sustain Current on Bus Hold Input
IBHHO
IBHLO
Bus Hold Overdrive Current on Bus Hold Input[9]
VCC=Max., VI=1.5V
IOZH
High Impedance Output Current
(Three-State Output pins)
IOZL
±500
µA
VCC=Max., VOUT=VCC
±1
µA
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=GND
±1
µA
IOS
Short Circuit Current[7]
VCC=Max., VOUT=GND
–240
mA
IOFF
Power-Off Disable
VCC=0V, VOUT≤4.5V
±100
µA
ICC
Quiescent Power Supply Current
VIN<0.2V
VCC=Max.
+40
µA
VCC=Max.
+350
µA
∆ICC
Quiescent Power supply Current
(TTL inputs HIGH)
VIN=VCC
–0.6V[8]
–60
–135
Electrical Characteristics For Balanced Drive Devices Over the Operating Range VCC=2.7V to 3.6V
Parameter
Description
Test Conditions
IODL
Output LOW Dynamic
Current[7]
VCC=3.3V, VIN=VIH
or VIL, VOUT=1.5V
IODH
Output HIGH Dynamic Current[7]
VCC=3.3V, VIN=VIH
or VIL, VOUT=1.5V
VOH
Output HIGH Voltage
VCC=Min., IOH= –0.1 mA
VOL
Output LOW Voltage
Min.
Typ.[5]
Max.
Unit
45
110
mA
–45
–110
mA
VCC–0.2
V
VCC=Min., IOH= –8 mA
2.4[10]
3.0
V
VCC=3.0V, IOH= –24 mA
2.0
3.0
V
VCC=Min., IOL= 0.1mA
0.2
VCC=Min., IOL= 24 mA
0.3
V
0.55
Notes:
9. Pins with bus hold are described in Pin Description.
10. VOH=VCC–0.6V at rated current.
Capacitance[6](TA = +25˚C, f = 1.0 MHz)
Parameter
Description
Test Conditions
Typ.[5]
Max.
Unit
CIN
Input Capacitance
VIN = 0V
4.5
6.0
pF
COUT
Output Capacitance
VOUT = 0V
5.5
8.0
pF
3
CY74FCT163374
CY74FCT163H374
Power Supply Characteristics
Parameter
Description
Test Conditions
Typ.[5]
Max.
Unit
ICCD
Dynamic Power Supply
Current[11]
VCC=Max., One Input Toggling, VIN=VCC or
50% Duty Cycle,
VIN=GND
Outputs Open, OE=GND
50
75
µA/MHz
IC
Total Power Supply
Current[12]
VCC=Max., f1=10 MHz, 50%
VIN=VCC or
Duty Cycle, Outputs Open, One VIN=GND
Bit Toggling, OE=GND
VIN=VCC–0.6V or
VIN=GND
0.5
0.8
mA
0.5
0.8
mA
VCC=Max., f1=2.5 MHz, 50%
VIN=VCC or
Duty Cycle, Outputs Open, Six- VIN=GND
teen Bits Toggling, OE=GND
VIN=VCC–0.6V or
VIN=GND
2.0
3.0[13]
mA
2.0
3.3[13]
mA
Switching Characteristics Over the Operating Range VCC=3.0V to 3.6V[14,15]
CY74FCT163374A
CY74FCT163H374A
CY74FCT163374C
CY74FCT163H374C
Description
Min.
Max.
Min.
Max.
Unit
Fig. No.[16]
tPLH
tPHL
Propagation Delay Clock to
Output
1.5
6.5
1.5
5.2
ns
1, 3
tPZH
tPZL
Output Enable Time
1.5
6.5
1.5
5.5
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1.5
5.5
1.5
5.0
ns
1, 7, 8
tSU
Input Setup time
2.0
tH
Input Hold time
1.5
Parameter
tSK(O)
Output
2.0
-
Skew[17]
0.5
1.5
ns
1, 4
-
ns
1. 4
0.5
ns
—
Notes:
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
12. IC
= IQUIESCENT + IINPUTS + IDYNAMIC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
DH = Duty Cycle for TTL inputs HIGH
NT = Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
N1 = Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
14. Minimum limits are specified but not tested on Propagation Delays.
15. For VCC =2.7, propagation delay, output enable and output disable times should be degraded by 20%.
16. See “Parameter Measurement Information” in the General Information section.
17. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
4
CY74FCT163374
CY74FCT163H374
Switching Characteristics Over the Operating Range VCC=3.0V to 3.6V[14,15]
CY74FCT163LD374[18]
CY74FCT163LDH374
CY74FCT163LD374A[18]
CY74FCT163LDH374A
Description
Min.
Max.
Min.
Max.
Unit
Fig. No.[16]
tPLH
tPHL
Propagation Delay Clock to
Q Output
1.5
10
1.5
6.5
ns
1, 3
tPZH
tPZL
Output Enable Time
1.5
12.5
1.5
6.5
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1.5
8.0
1.5
5.5
ns
1, 7, 8
tSU
Input Setup time
2.0
2.0
ns
1, 4
tH
Input Hold time
1.5
1.5
ns
1, 4
ns
—
Parameter
tSK(O)
Output
Skew[17]
0.5
0.5
Note:
18. For Lite Drive devices the load capacitance is 30 pF. For all others it is 50 pF.
Ordering Information CY74FCT163374
Speed
(ns)
5.2
6.5
Ordering Code
Package
Name
Package Type
CY74FCT163374CPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT163374CPVC/PVCT
O48
48-Lead (300-Mil) SSOP
CY74FCT163374APACT
Z48
48-Lead (240-Mil) TSSOP
Operating
Range
Industrial
Industrial
Ordering Information CY74FCT163H374
Speed
(ns)
5.2
Ordering Code
Package
Name
Package Type
74FCT163H374CPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT163H374CPVC
O48
48-Lead (300-Mil) SSOP
74FCT163H374CPVCT
O48
48-Lead (300-Mil) SSOP
5
Operating
Range
Industrial
CY74FCT163374
CY74FCT163H374
D
Package Diagrams
48-Lead Shrunk Small Outline Package O48
48-Lead Thin Shrunk Small Outline Package Z48
6
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74FCT163H374CPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
74FCT163H374CPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
CY74FCT163374APAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
CY74FCT163374APACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
CY74FCT163374CPAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
CY74FCT163374CPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
CY74FCT163374CPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
CY74FCT163374CPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
CY74FCT163H374CPAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
CY74FCT163H374CPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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