ATMEL AT24CM01 I2c-compatible (2-wire) serial eeprom 1-mbit (131,072 x 8) Datasheet

Atmel AT24CM01
I2C-Compatible (2-wire) Serial EEPROM
1-Mbit (131,072 x 8)
DATASHEET
Features
 Low voltage and standard voltage operation available


1.7V (VCC = 1.7V to 5.5V)
2.5V (VCC = 2.5V to 5.5V)
 Internally organized 131,072 x 8
 2-wire serial interface
 Schmitt Triggers, filtered inputs for noise suppression
 Bidirectional data transfer protocol
 400kHz (1.7V) and 1MHz (5V, 2.5V) compatibility
 Write Protect pin for hardware data protection
 256-byte Page Write mode

Partial page writes allowed
 Random and Sequential Read modes
 Self-timed write cycle (5ms max)
 High reliability


Endurance: 1,000,000 write cycles
Data retention: 40 years
 Green package options (Pb/Halide-free/RoHS Compliant)

8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, and 8-ball WLCSP
 Die sale options: wafer form and tape and reel available
Description
The Atmel® AT24CM01 provides 1,048,576 bits of Serial Electrically Erasable and
Programmable Read-Only Memory (EEPROM) organized as 131,072 words of eight
bits each. The device’s cascadable feature allows up to four devices to share a
common 2-wire bus. The device is optimized for use in many industrial and commercial
applications where low power and low voltage operation are essential. The devices are
available in space-saving 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, and
8-ball WLCSP. In addition, the entire family is available in 1.7V (1.7V to 5.5V) and 2.5V
(2.5V to 5.5V) versions.
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
1.
Pin Configurations and Pinouts
Pin Name
Function
NC
No Connect
A1
Address Input
A2
Address Input
GND
Ground
SDA
Serial Data
SCL
Serial Clock Input
WP
Write Protect
VCC
Power Supply
8-lead SOIC
8-lead TSSOP
NC
1
8
VCC
A1
2
7
WP
A2
3
6
SCL
GND
4
5
NC
A1
A2
GND
SDA
Top View
1
8
2
7
3
6
4
5
VCC
WP
SCL
SDA
Top View
8-ball WLCSP
VCC
SDA
SCL
A2
WP
A1
NC
GND
Bottom View
Note:
2.
Drawings are not to scale.
Absolute Maximum Ratings*
Operating Temperature . . . . . . . . . . .–55C to +125C
Storage Temperature . . . . . . . . . . . .–65C to +150C
Voltage on any pin
with respect to ground . . . . . . . . . . . . . –1.0V to +7.0V
Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V
DC Output Current. . . . . . . . . . . . . . . . . . . . . . . 5.0mA
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only
and functional operation of the device at these or
any other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
2
3.
Block Diagram
VCC
GND
WP
Start
Stop
Logic
Serial
Control
Logic
LOAD
H.V. Pump/Timing
COMP
Device
Address
Comparator
A2
A1
EN
LOAD
R/W
Data Recovery
INC
Data Word
Addr/counter
Y DEC
X DEC
SCL
SDA
EEPROM
Serial MUX
DOUT/ACK
Logic
DIN
DOUT
4.
Pin Description
Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge
clock data out of each device.
Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open drain driven and may be
wire-ORed with any number of other open drain or open collector devices.
Device Addresses (A2 and A1): The A2 and A1 pins are device address inputs that can be hardwired or left not
connected for hardware compatibility with other Atmel AT24Cxx devices. When the A2 and A1 pins are hardwired, as
many as four 1-Mbit devices may be addressed on a single bus system (See “Device Addressing” on page 9 for more
details). If the A2 and A1 pins are left floating, the A2 and A1 pin will be internally pulled down to GND if the capacitive
coupling to the circuit board VCC plane is <3pF. If coupling is >3pF, Atmel recommends connecting the A2 and A1 pin to
GND.
Write Protect (WP): The Write Protect input, when connected to GND, allows normal write operations. When WP is
connected high to VCC, all write operations to the memory are inhibited. If the pin is left floating, the WP pin will be
internally pulled down to GND if the capacitive coupling to the circuit board VCC plane is <3pF. If coupling is >3pF, Atmel
recommends connecting the pin to GND. Switching WP to VCC prior to a write operation creates a software write protect
function.
Table 4-1.
WP Pin
Status
Write Protect
Part of the Array Protected
AT24CM01
At VCC
Full Array
At GND
Normal Read/Write Operations
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
3
5.
Memory Organization
AT24CM01, 1-Mbit Serial EEPROM: The 1-Mbit is internally organized as 512 pages of 256 bytes each. Random word
addressing requires a 17-bit data word address.
Table 5-1.
Pin Capacitance(1)
Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = 5.5V
Symbol
Test Condition
CI/O
CIN
Note:
1.
Table 5-2.
Max
Units
Conditions
Input/Output Capacitance (SDA)
8
pF
VI/O = 0V
Input Capacitance (A2, A1, SCL)
6
pF
VIN = 0V
This parameter is characterized and is not 100% tested.
DC Characteristics
Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = 1.7V to 5.5V (unless otherwise noted)
Symbol
Parameter
Test Condition
VCC1
Supply Voltage,
1.7V Option
VCC2
Supply Voltage,
2.5V Option
ICC
Supply Current
VCC = 5.0V
ICC
Supply Current
VCC = 5.0V
VCC = 1.7V
ISB
Standby Current
VCC = 2.5V
VCC = 3.6V
VCC = 5.5V
Min
Typ
Max
Units
1.7
5.5
V
2.5
5.5
V
Read at 400kHz
2.0
mA
Write at 400kHz
3.0
mA
1.0
μA
2.0
μA
3.0
μA
6.0
μA
VIN = VCC or VSS
VIN = VCC or VSS
ILI
Input Leakage Current
VIN = VCC or VSS
0.10
3.0
μA
ILO
Output Leakage
Current
VOUT = VCC or VSS
0.05
3.0
μA
VIL
Input Low Level(1)
–0.6
VCC x 0.3
V
VIH
Input High Level(1)
VCC x 0.7
VCC + 0.5
V
VOL1
Output Low Level
VCC = 1.7V
IOL = 0.15mA
0.2
V
VOL2
Output Low Level
VCC = 3.0V
IOL = 2.1mA
0.4
V
Note:
1.
VIL min and VIH max are reference only and are not tested.
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
4
Table 5-3.
AC Characteristics
Applicable over recommended operating range from TAI = -40C to +85C, VCC = 1.7V to 5.5V (where applicable),
CL = 100pF (unless otherwise noted). Test conditions are listed in Note 2.
1.7V
Symbol
Parameter
Min
fSCL
Clock Frequency, SCL
tLOW
Clock Pulse Width Low
tHIGH
Clock Pulse Width High
2.5V, 5.0V
Max
Min
400
Max
Units
1000
kHz
1300
400
ns
600
400
ns
(1)
tI
Noise Suppression Time
100
tAA
Clock Low to Data Out Valid
tBUF
Time the bus must be free before a new
transmission can start(1)
1300
500
ns
tHD.STA
Start Hold Time
600
250
ns
tSU.STA
Start Set-up Time
600
250
ns
tHD.DAT
Data In Hold Time
0
0
ns
tSU.DAT
Data In Set-up Time
100
100
ns
50
(1)
900
50
50
ns
550
ns
tR
Inputs Rise Time
tF
Inputs Fall Time(1)
tSU.STO
Stop Set-up Time
600
250
ns
tDH
Data Out Hold Time
50
50
ns
tWR
Write Cycle Time
Endurance(1)
25°C, Page Mode, 3.3V
Notes: 1.
2.
300
300
ns
300
100
ns
5
1,000,000
5
ms
Write Cycles
This parameter is ensured by characterization only.
AC measurement conditions:

RL (connects to VCC): 1.3 k (2.5V, 5V), 10 k (1.7V)

Input pulse voltages: 0.3 VCC to 0.7 VCC

Input rise and fall times:  50ns

Input and output timing reference voltages: 0.5 VCC
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
5
6.
Device Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin may
change only during SCL low time periods (see Figure 6-4 on page 8). Data changes during SCL high periods will indicate
a Start or Stop condition as defined below.
Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any other
command (see Figure 6-5 on page 8).
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the Stop
command will place the EEPROM in a standby power mode (see Figure 6-5 on page 8).
Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in eight bit words. The
EEPROM sends a zero during the ninth clock cycle to acknowledge that it has received each word (see Figure 6-6 on
page 8).
Standby Mode: The AT24CM01 features a low power standby mode which is enabled:

Upon power-up

After the receipt of the stop bit and the completion of any internal operations
Software Reset: After an interruption in protocol, power loss, or system reset, any 2-wire part can be protocol reset by
following these steps:
1.
Create a start bit condition
2.
Clock nine cycles
3.
Create another start bit followed by stop bit condition as in Figure 6-1.
The device is ready for the next communication after above steps have been completed.
Figure 6-1. Software Reset
Dummy Clock Cycles
SCL
1
Start
Bit
2
3
8
9
Start
Bit
Stop
Bit
SDA
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
6
Figure 6-2. Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O
tHIGH
tF
tR
tLOW
SCL
tSU.STA
tLOW
tHD.STA
tHD.DAT
tSU.DAT
tSU.STO
SDA IN
tAA
tDH
tBUF
SDA OUT
Figure 6-3. Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
SCL
SDA
8th Bit
ACK
WORDN
(1)
tWR
Stop
Condition
Notes: 1.
Start
Condition
The write cycle time tWR is the time from a valid Stop condition of a write sequence to the end of the internal
clear/write cycle.
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
7
Figure 6-4. Data Validity
SDA
SCL
Data Stable
Data Stable
Data
Change
Figure 6-5. Start and Stop Definition
SDA
SCL
Start
Stop
Figure 6-6. Output Acknowledge
1
SCL
8
9
Data In
Data Out
Start
Acknowledge
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
8
7.
Device Addressing
The 1-Mbit EEPROM requires an 8-bit device address word following a Start condition to enable the chip for a read or
write operation (see Figure 7-1 below). The device address word consists of a mandatory ‘1010’ sequence for the first
four most significant bits. This is common to all 2-wire EEPROM devices.
The 1-Mbit uses the two device address bits, A2 and A1, to allow up to four devices on the same bus. These A2 and A1
bits must compare to the corresponding hardwired input pins, A2 and A1. The A2 and A1 pins uses an internal proprietary
circuit that biases it to a logic low condition if the pin is allowed to float.
The seventh bit (P0) of the device address is a memory page address bit. This memory page address bit is the most
significant bit of the data word address that follows. The eighth bit of the device address is the read/write operation select
bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a valid compare is not made, the device will
return to a standby state.
Figure 7-1. Device Address
1
0
1
0
A2
A1
MSB
8.
P0 R/W
LSB
Write Operations
Byte Write: To select a data word in the 1-Mbit memory requires a 17-bit word address. The word address field consists
of the P0 bit in the device address byte, then the most significant word address followed by the least significant word
address (see Figure 8-1).
A write operation requires the P0 bit and two 8-bit data word addresses following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then the part is to
receive the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero. The addressing
device, such as a microcontroller, then must terminate the write sequence with a Stop condition. At this time the
EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write
cycle and the EEPROM will not respond until the write is complete (see Figure 8-1).
Figure 8-1. Byte Write
S
T
A
R
T
Device
Address
W
R
I
T
E
First Word
Address
Second Word
Address
S
T
O
P
Data
SDA LINE
M
S
B
P R A
0 / C
W K
L A
S C
B K
L A
S C
B K
A
C
K
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
9
Page Write: The 1-Mbit EEPROM is capable of a 256-byte Page Write.
A Page Write is initiated the same way as a Byte Write, but the microcontroller does not send a Stop condition after the
first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller
can transmit up to 255 more data words. The EEPROM will respond with an acknowledge after each data word is
received. The microcontroller must terminate the page write sequence with a Stop condition (see Figure 8-2) and the
internally timed write cycle will begin.
The data word address lower 8 bits are internally incremented following the receipt of each data word. The higher data
word address bits are not incremented, retaining the memory page row location. When the internally generated word
address, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than
256 data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be
overwritten. The address “rollover” during write is from the last byte of the current page to the first byte of the same page.
Figure 8-2. Page Write
S
T
A
R
T
Device
Address
W
R
I
T
E
First Word
Address
Second Word
Address
Data (n)
S
T
O
P
Data (n + x)
SDA LINE
M
S
B
P R A
0 / C
W K
L A
S C
B K
L A
S C
B K
A
C
K
A
C
K
Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled,
Acknowledge Polling can be initiated. This involves sending a Start condition followed by the device address word. The
read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM
respond with a zero, allowing a new read or write sequence to be initiated.
Data Security: The AT24CM01 has a hardware data protection scheme that allows the user to write protect the entire
memory when the WP pin is at VCC.
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
10
9.
Read Operations
Read operations are initiated the same way as write operations with the exception that the read/write select bit in the
device address word is set to one. There are three read operations: Current Address Read, Random Address Read, and
Sequential Read.
Current Address Read: The internal data word address counter maintains the last address accessed during the last
read or write operation, incremented by one. This address stays valid between operations as long as the VCC to the part
is maintained. The address “rollover” during read is from the last byte of the last page, to the first byte of the first page of
the memory.
Once the device address with the read/write select bit set to one is input and acknowledged by the EEPROM, the current
address data word is serially clocked out on the SDA line. The microcontroller does not respond with a zero but does
generate a following Stop condition (see Figure 9-1).
Figure 9-1. Current Address Read
S
T
A
R
T
Device
Address
R
E
A
D
S
T
O
P
Data
SDA LINE
M
S
B
P R A
0 / C
W K
N
O
A
C
K
Random Read: A Random Read requires an initial byte write sequence to load in the data word address. This is known
as a “dummy write” operation. Once the device address word and data word address are clocked in and acknowledged
by the EEPROM, the microcontroller must generate another Start condition. The microcontroller now initiates a current
address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word on the SDA line. The microcontroller does not respond with a zero but does
generate a following Stop condition (see Figure 9-2).
Figure 9-2. Random Read
S
T
A
R
T
Device
Address
W
R
I
T
E
First Word
Address
S
T
A
R
T
Second Word
Address
Device
Address
R
E
A
D
S
T
O
P
Data (n)
SDA LINE
M
S
B
P R A
0 / C
W K
A
C
K
Dummy Write
L A
S C
B K
P R A
0 / C
WK
N
O
A
C
K
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
11
Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Read. After the
microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an
acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the
memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The
Sequential Read operation is terminated when the microcontroller does not respond with a zero, but does generate a
following Stop condition (see Figure 9-3).
Figure 9-3. Sequential Read
S
T
A
R
T
Device
Address
W
R
I
T
E
First Word
Address
Second Word
Address
...
SDA LINE
PR A
0 / C
W K
M
S
B
L A
S C
B K
A
C
K
Dummy Write
S
T
A
R
T
Device
Address
R
E
A
D
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + x)
...
P R A
0 / C
K
W
A
C
K
A
C
K
A
C
K
N
O
A
C
K
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
12
10.
Ordering Code Detail
AT2 4 C M 0 1 - S S H M - B
Atmel Designator
Shipping Carrier Option
B or blank = Bulk (tubes)
T = Tape and reel
Product Family
24C = Standard I2C Serial EEPROM
Device Density
M = Megabit Family
01 = 1 Megabit
Operating Voltage
M = 1.7V to 5.5V
D = 2.5V to 5.5V
Package Device Grade or
Wafer/Die Thickness
H = Green, NiPdAu lead finish
Industrial Temperature range
(-40°C to +85°C)
U = Green, matte Sn lead finish
Industrial Temperature range
(-40°C to +85°C)
11 = 11mil wafer thickness
Package Option
SS = JEDEC SOIC
S
= EIAJ SOIC
X
= TSSOP
U
= 3x5 Grid Array, WLCSP
WWU = Wafer unsawn
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
13
11.
Part Markings
AT24CM01: Package Marking Information
8-lead EIAJ
8-lead SOIC
ATMLHYWW
##%
@
AAAAAAAA
ATMLHYWW
##%
@
AAAAAAAA
8-lead TSSOP
8-ball WLCSP
ATHYWW
##% @
AAAAAAA
Note 1:
%U
##
YXX
designates pin 1
Note 2: Package drawings are not to scale
Catalog Number Truncation
AT24CM01
Truncation Code ##: 2G
Date Codes
Y = Year
2: 2012
3: 2013
4: 2014
5: 2015
Voltages
WW = Work Week of Assembly
02: Week 2
04: Week 4
...
52: Week 52
6: 2016
7: 2017
8: 2018
9: 2019
Country of Assembly
Lot Number
@ = Country of Assembly
AAA...A = Atmel Wafer Lot Number
% = Minimum Voltage
M: 1.7V min
D: 2.5V min
Grade/Lead Finish Material
H: Industrial/NiPdAu
U: Industrial/Matte Tin
Atmel Truncation
AT: Atmel
ATML: Atmel
3/21/2013
TITLE
Package Mark Contact:
[email protected]
24CM01SM, AT24CM01 Package Marking Information
DRAWING NO.
REV.
24CM01SM
F
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
14
12.
Ordering Information
Atmel Ordering Code
Lead Finish
Package
Voltage
Operation Range
AT24CM01-SSHM-B(1)
1.7V to 5.5V
AT24CM01-SSHM-T(2)
8S1
AT24CM01-SSHD-B(1)
2.5V to 5.5V
AT24CM01-SSHD-T(2)
AT24CM01-SHM-B(1)
1.7V to 5.5V
AT24CM01-SHM-T(2)
NiPdAu
(Lead-free/Halogen-free)
AT24CM01-SHD-B(1)
8S2
2.5V to 5.5V
AT24CM01-SHD-T(2)
Industrial Temperature
(–40C to 85C)
AT24CM01-XHM-B(1)
1.7V to 5.5V
AT24CM01-XHM-T(2)
8X
AT24CM01-XHD-B(1)
2.5V to 5.5V
AT24CM01-XHD-T(2)
AT24CM01-UUM-T
AT24CM01-WWU11M
Notes: 1.
3.
8U-6
—
Wafer Sale
(3)
1.7V to 5.5V
B = Bulk delivery in tubes:

2.
SnAgCu
(Lead-free/Halogen-free)
SOIC and TSSOP = 100 per tube
T = Tape and reel delivery:

JEDEC SOIC = 4K units per reel

EIAJ SOIC = 2K units per reel

TSSOP and WLCSP = 5K units per reel
For wafer sales, please contact Atmel Sales.
Package Type
8S1
8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2
8-lead, 0.208” wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8X
8-lead, 4.4mm body, Plastic Thin Shrink Small Outline (TSSOP)
8U-6
8-ball, 3x5 Grid Array, Wafer Level Chip Scale (WLCSP)
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
15
13.
Packaging Information
13.1
8S1 — 8-lead JEDEC SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
A1
D
SIDE VIEW
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
SYMBOL MIN
A
1.35
NOM
MAX
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.05
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
Ø
0°
–
8°
6/22/11
Package Drawing Contact:
[email protected]
TITLE
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
GPC
SWB
DRAWING NO.
REV.
8S1
G
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
16
13.2
8S2 — 8-lead EIAJ SOIC
C
1
E
E1
L
N
q
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
SYMBOL
A1
D
SIDE VIEW
A
MAX
NOM
NOTE
2.16
A1
0.05
0.25
b
0.35
0.48
4
C
0.15
0.35
4
D
5.13
5.35
E1
5.18
5.40
E
7.70
8.26
L
0.51
0.85
q
0°
8°
e
Notes: 1.
2.
3.
4.
MIN
1.70
1.27 BSC
2
3
This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
Mismatch of the upper and lower dies and resin burrs aren't included.
Determines the true geometric position.
Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.
Package Drawing Contact:
[email protected]
TITLE
8S2, 8-lead, 0.208” Body, Plastic Small
Outline Package (EIAJ)
GPC
STN
4/15/08
DRAWING NO. REV.
8S2
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
F
17
13.3
8X — 8-lead TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
H
N
L
Top View
End View
A
b
A1
e
A2
MIN
NOM
MAX
A
-
-
1.20
A1
0.05
-
0.15
A2
0.80
1.00
1.05
D
2.90
3.00
3.10
2, 5
SYMBOL
D
Side View
Notes:
COMMON DIMENSIONS
(Unit of Measure = mm)
1. This drawing is for general information only. Refer to JEDEC
Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
E
NOTE
6.40 BSC
E1
4.30
4.40
4.50
3, 5
b
0.19
–
0.30
4
e
0.65 BSC
L
0.45
L1
C
0.60
0.75
1.00 REF
0.09
-
0.20
12/8/11
TITLE
Package Drawing Contact:
[email protected]
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
GPC
TNR
DRAWING NO.
8X
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
REV.
E
18
13.4
8U-6 — 8-ball WLCSP
—
d 0.015 C
4X
d 0.075 C
A
C
D
Pin 1
A
B
C
D
j n 0.015 m C
j n 0.05 m C A B
A1
E
Øb
E
D
C
B
A
Pin 1
1
1
E
2
2
e
3
3
A2
e2
d2
d
A
TOP VIEW
SIDE VIEW
BALL SIDE
* Dimensions are NOT to scale.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
1
VCC
C
D
SDA
E
NC
WP
SCL
2
3
B
A1
A2
TYP
A
PIN ASSIGNMENT MATRIX
A
MIN
GND
MAX
0.538
A1
0.164
-
0.224
A2
0.280
0.305
0.330
E
Contact Atmel for details
e
0.866
e2
0.500
d
1.000
d2
D
b
NOTE
0.500
Contact Atmel for details
0.239
0.269
0.299
3/15/2013
Package Drawing Contact:
[email protected]
TITLE
8U-6, 8-ball Wafer Level Chip Scale Package
(WLCSP)
GPC
DRAWING NO.
REV.
GHZ
8U-6
B
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
19
14.
Revision History
Doc. No.
Date
Comments
Update document status from preliminary to complete.
8821E
03/2013
Correct WLCSP pinout.
Update footers and disclaimer page.
8812D
01/2013
Correct TSSOP pin label 7 to WP.
Add WLCSP package.
Update part markings.
8812C
12/2012
Update pinout diagram.
Update part markings.
Correct Byte Write figure from second typo error to first word address.
Update Sequential Read figure.
8812B
07/2012
Correct ordering code:
- AT24CM01-WWU-11, Die Sale to AT24CM01-WWU11M, Wafer Sale.
Update Atmel logos and disclaimer page.
8812A
05/2012
Initial document release.
Atmel AT24CM01 [DATASHEET]
Atmel-8812E-SEEPROM-AT24CM01-Datasheet_032013
20
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