Bourns CG0402MLE-18G Mle series varistor esd clamp protector Datasheet

Features
■
■
■
■
■
0402 and 0603 package options
Rated for IEC 61000-4-2, for applications requiring up to 18 V DC
Withstands multiple ESD strikes
Low capacitance and leakage currents for invisible load protection
Tape and reel packaging
ChipGuard® MLE Series Varistor ESD Clamp Protectors
Description
The ChipGuard® CG0402MLE and CG0603MLE Series has been designed to provide high frequency attenuation, thereby providing
suppression and filtering in a single device. The MLE family also offers protection to ESD standards such as IEC61000-4-2 for applications
requiring up to 18 V DC and is available in the industry standard 0603 and 0402 type leadless surface mount packaging.
Electrical Characteristics @ 25 °C (unless otherwise noted)
Continuous
Operating
Voltage
Vrms
Model
VDC
(V)
(V)
Max.
Clamping Voltage
Typ.
Off-state Current
VCLAMP
(V)
Max.
Capacitance
IL
(uA)
Typ.
CP
(pF)
Max.
Max.
8 kV
Contact
15 kV
Air
1A
@ 8/20 µs
3.5 V
5.5 V
9V
12 V
18 V
1 Vrms
@ 1 MHz
CG0402MLE-18G
8.5
12
18
100
120
50
0.3
0.4
0.5
1
10
9
CG0603MLE-18E
8.5
12
18
40
60
60
0.3
0.4
0.5
1
10
50
Environmental Characteristics
Surge Withstand Ratings
Operating Temperature ..-55 °C to +125 °C
Storage Temperature......-55 °C to +125 °C
Response Time ..................................<1 ns
Standard..................IEC 61000-4-2 Level 4
Peak Current
8/20 µs
(Max.)
Peak Current
@ 8 kV
(Max.)
CG0402MLE-18G
15 A
30 A
CG0603MLE-18E
20 A
45 A
Model
Device Symbol
Voltage-Current Characteristics
V
How to Order
10 2
CG 0402 MLE - 18 G
CG0402MLE-18G
ChipGuard®
Product Designator
CG0603MLE-18E
Package Option
0402 = 0402 Package
0603 = 0603 Package
Operating Voltage
18 = 18 V
Tape & Reel Packaging
E = 4,000 pcs. per reel (0603 package)
G = 10,000 pcs. per reel (0402 package)
Voltage (Volts)
Multilayer Series Designator
CG0402MLE-18G
CG0603MLE-18E
10 1
Ni barrier terminations are standard on all
ChipGuard® part numbers.
10 0
10-8
10-7
10-6
10-5
SOURCE = DC
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
10-4
10-3
10-2
10-1
10 0
10 1
10 2
SOURCE = 8/20 µs PULSE, IPEAK
I Current (Amps)
10 3
10 4
ChipGuard® MLE Series Varistor ESD Clamp Protectors
Recommended Pad Layout
Product Dimensions
A
A
W
B
L
DIMENSIONS =
B
C
MM
(INCHES)
D
Dimension
CG0402MLE
Series
CG0603MLE
Series
Dim.
CG0402MLE
Series
CG0603MLE
Series
L
1.00 ± 0.15
(0.04 ± 0.006)
1.60 ± 0.20
(0.064 ± 0.008)
A
0.51
(0.020)
0.76
(0.030)
W
0.50 ± 0.10
(0.02 ± 0.004)
0.80 ± 0.20
(0.032 ± 0.008)
B
0.61
(0.024)
1.02
(0.040)
A
0.50 ± 0.10
(0.02 ± 0.004)
0.80 ± 0.20
(0.032 ± 0.008)
C
0.51
(0.020)
0.50
(0.020)
B
0.25 ± 0.15
(0.010 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
D
1.70
(0.067)
2.54
(0.100)
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
200
B
Stage 2 Preheat 140 °C to 160 °C
150
C
Stage 3 Preheat Preheat to 200 °C
20 s to 40 s
100
D
Main Heating
200
210
220
230
240
60
55
50
40
30
E
Cooling
200 °C to 100 °C
Temperature (°C)
250
50
0
110 sec. (min.)
30-70
sec.
120 sec. (min.)
°C
°C
°C
°C
°C
60 s to 120 s
s
s
s
s
s
to
to
to
to
to
70
65
60
50
40
s
s
s
s
s
1 °C/s to 4 °C/s
Time (seconds)
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling
recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under
30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
ChipGuard® MLE Series Varistor ESD Clamp Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
(0.06 ± 0.004)
62.0 ± 1.50
(2.48 ± 0.06)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
W
21.0 ± 0.80
(0.84 ± 0.032)
D
180.8 ± 2.0
(7.12 ± 0.08)
3.50 ± 0.05
(0.14 ± 0.002)
NOTES: TAPE MATERIAL IS PAPER.
0.60 ± 0.05
TAPE THICKNESS IS
(0.024 ± 0.002)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
9.0 ± 0.50
(0.36 ± 0.02)
Dimension
CG0402MLE
Series
CG0603MLE
Series
C
1.75 ± 0.05
(0.04 ± 0.002)
1.75 ± 0.10
(0.04 ± 0.004)
D
2.00 ± 0.02
(0.08 ± 0.0008)
2.00 ± 0.05
(0.08 ± 0.002)
L
1.12 ± 0.03
(0.045 ± 0.0012)
1.80 ± 0.20
(0.072 ± 0.008)
W
0.62 ± 0.03
(0.025 ± 0.0012)
0.90 ± 0.20
(0.036 ± 0.008)
G
2.0 ± 0.05
(0.08 ± 0.002)
Reliable Electronic Solutions
Asia-Pacific:
TEL +886-2 25624117 • FAX +886-2 25624116
Europe:
TEL +41-41 7685555 • FAX +41-41 7685510
North America:
TEL +1-951 781-5500 • FAX +1-951 781-5700
www.bourns.com
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
REV. C
“ChipGuard” is a registered trademark of Bourns, Inc.
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