Cypress CY8C20467S-24LQXI 1.8 v capsenseâ® controller with smartsenseâ ¢ auto-tuning 31 buttons, 6 sliders, proximity sensor Datasheet

CY8C20xx7/S
1.8 V CapSense® Controller with
SmartSense™ Auto-tuning
31 Buttons, 6 Sliders, Proximity Sensors
1.8 V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders, Proximity Sensors
Features
■
■
QuietZone™ Controller
❐ Patented Capacitive Sigma Delta PLUS (CSD PLUS™)
sensing algorithm for robust performance
❐ High Sensitivity (0.1 pF) and best-in-class SNR performance
to support:
• Overlay thickness of 15 mm for glass and 5 mm plastic
• Proximity Solutions
❐ Superior noise immunity performance against conducted and
radiated noise and ultra low radiated emissions
• Standardized user modules for overcoming noise
Low power CapSense® block with SmartSense Auto-tuning
❐ Low average power consumption –
• 28 µA/sensor in run time (wake-up and scan once every
125 ms)
❐ SmartSense_EMC_PLUS Auto-Tuning
• Sets and maintains optimal sensor performance during run
time
• Eliminates system tuning during development and
production
• Compensates for variations in manufacturing process
■
Driven shield available on five GPIO pins
❐ Delivers best-in class water tolerant designs
❐ Robust proximity sensing in the presence of metal objects
❐ Supports longer trace lengths
❐ Max load of 100 pF (3 MHz)
■
Powerful Harvard-architecture processor
❐ M8C CPU with a max speed of 24 MHz
■
Operating Range: 1.71 V to 5.5 V
❐ Standby Mode 1.1 μA (Typ)
❐ Deep Sleep 0.1 μA (Typ)
■
■
■
4 Clock Sources
❐ Internal main oscillator (IMO): 6/12/24 MHz
❐ Internal low-speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
❐ External 32 KHz Crystal Oscillator
❐ External Clock Input
■
Programmable pin configurations
❐ Up to 34 general-purpose I/Os (GPIOs)
❐ Dual mode GPIO (Analog and Digital)
❐ High sink current of 25 mA per GPIO
• Max sink current 120 mA for all I/Os combined
❐ Source Current
• 5 mA on ports 0 and 1
• 1 mA on ports 2,3 and 4
❐ Configurable internal pull-up, high-Z and open drain modes
❐ Selectable, regulated digital I/O on port 1
❐ Configurable input threshold on port 1
■
Versatile Analog functions
❐ Internal analog bus supports connection of multiple sensors
to form ganged proximity sensor
❐ Internal Low-Dropout voltage regulator for high power supply
rejection ratio (PSRR)
■
Additional system resources
2
❐ I C Slave:
• Selectable to 50 kHz, 100 kHz, or 400 kHz
• Selectable Clock stretch or Forced Nack Mode
• I2C wake from sleep with Hardware address match
❐ 12 MHz (Configurable) SPI master and slave
❐ Three 16-bit timers
❐ Watchdog and sleep timers
❐ Integrated supervisory circuit
❐ 10-bit incremental analog-to-digital converter (ADC) with
internal voltage reference
❐ Two general-purpose high speed, low power analog
comparators
■
Complete development tools
❐ Free development tool (PSoC Designer™)
■
Sensor and Package options
❐ 10 Sensing Inputs – 16-pin QFN, 16-pin SOIC
❐ 16 Sensing Inputs – 24-pin QFN
[1]
❐ 24 Sensing Inputs – 30-pin WLCSP
❐ 25 Sensing Inputs – 32-pin QFN
❐ 31 Sensing Inputs – 48-pin QFN
Operating Temperature range: –40 oC to +85 oC
Flexible on-chip memory
❐ 8 KB flash, 1 KB SRAM
❐ 16 KB flash, 2 KB SRAM
❐ 32 KB flash, 2 KB SRAM
❐ 50,000 flash erase/write cycles
❐ Read while Write with EEPROM emulation
❐ In-system programming simplifies manufacturing process
Note
1. Please contact your nearest sales office for additional details.
Cypress Semiconductor Corporation
Document Number: 001-69257 Rev. *I
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised May 7, 2013
CY8C20xx7/S
Logic Block Diagram
Port 4
Port 3
Port 2
Port 1
Port 0
1.8/2.5/3 V PWRSYS [2]
LDO
(Regulator)
PSoC CORE
SYSTEM BUS
Global Analog Interconnect
1K/2 K
SRAM
Supervisory ROM (SROM)
Interrupt
Controller
8K/16K/32 K Flash
Nonvolatile Memory
Sleep and
Watchdog
CPU Core(M8C)
6/12/ 24 MHz Internal Main Oscillator
( IMO)
Internal Low Speed Oscillator ( ILO)
Multiple Clock Sources
CAPSENSE
SYSTEM
Analog
Reference
CapSense
Module
Comparator #1
Analog
Mux
Comparator #2
SYSTEM BUS
I2C
Slave
Internal
Voltage
References
System
Resets
POR
and
LVD
SPI
Master/
Slave
Three 16- Bit
Programmable
Timers
Digital
Clocks
SYSTEM RESOURCES
Note
2. Internal voltage regulator for internal circuitry
Document Number: 001-69257 Rev. *I
Page 2 of 43
CY8C20xx7/S
Contents
PSoC® Functional Overview ............................................ 4
PSoC Core .................................................................. 4
CapSense System ....................................................... 4
Additional System Resources ..................................... 5
Getting Started .................................................................. 5
Application Notes/Design Guides ................................ 5
Development Kits ........................................................ 5
Training ....................................................................... 5
CYPros Consultants .................................................... 5
Solutions Library .......................................................... 5
Technical Support ....................................................... 5
Designing with PSoC Designer ....................................... 6
Select Components ..................................................... 6
Configure Components ............................................... 6
Organize and Connect ................................................ 6
Generate, Verify, and Debug ....................................... 6
Pinouts .............................................................................. 7
16-pin SOIC (10 Sensing Inputs) ................................ 7
16-pin QFN (10 Sensing Inputs)[7] ............................. 8
24-pin QFN (16 Sensing Inputs)[11] ........................... 9
30-ball WLCSP (24 Sensing Inputs) .......................... 10
32-pin QFN (25 Sensing Inputs)[18] .......................... 11
48-pin QFN (31 Sensing Inputs)[22] .......................... 12
Electrical Specifications ................................................ 13
Absolute Maximum Ratings ....................................... 13
Operating Temperature ............................................. 13
DC Chip-Level Specifications .................................... 14
DC GPIO Specifications ............................................ 15
DC Analog Mux Bus Specifications ........................... 17
DC Low Power Comparator Specifications ............... 17
Comparator User Module Electrical Specifications ... 18
ADC Electrical Specifications .................................... 18
DC POR and LVD Specifications .............................. 19
DC Programming Specifications ............................... 19
DC I2C Specifications ............................................... 20
Shield Driver DC Specifications ................................ 20
DC IDAC Specifications ............................................ 20
Document Number: 001-69257 Rev. *I
AC Chip-Level Specifications .................................... 21
AC General Purpose I/O Specifications .................... 22
AC Comparator Specifications .................................. 22
AC External Clock Specifications .............................. 22
AC Programming Specifications ................................ 23
AC I2C Specifications ................................................ 24
Packaging Information ................................................... 27
Thermal Impedances ................................................. 30
Capacitance on Crystal Pins ..................................... 30
Solder Reflow Peak Temperature ............................. 30
Development Tool Selection ......................................... 31
Software .................................................................... 31
Development Kits ...................................................... 31
Evaluation Tools ........................................................ 31
Device Programmers ................................................. 31
Accessories (Emulation and Programming) .............. 32
Third Party Tools ....................................................... 32
Build a PSoC Emulator into Your Board .................... 32
Ordering Information ...................................................... 33
Ordering Code Definitions ......................................... 34
Acronyms ........................................................................ 35
Reference Documents .................................................... 35
Document Conventions ............................................. 35
Units of Measure ....................................................... 35
Numeric Naming ........................................................ 36
Glossary .......................................................................... 36
Appendix: Silicon Errata for the
CY8C20xx7/S Family ...................................................... 37
CY8C20xx7/S Qualification Status ............................ 37
CY8C20xx7/S Errata Summary ................................. 37
Document History Page ................................................. 41
Sales, Solutions, and Legal Information ...................... 43
Worldwide Sales and Design Support ....................... 43
Products .................................................................... 43
PSoC Solutions ......................................................... 43
Page 3 of 43
CY8C20xx7/S
PSoC® Functional Overview
Figure 1. CapSense System Block Diagram
The PSoC family consists of many devices with on-chip
controllers. These devices are designed to replace multiple
traditional MCU-based system components with one low-cost
single-chip programmable component. A PSoC device includes
configurable blocks of analog and digital logic, and
programmable interconnect. This architecture makes it possible
for you to create customized peripheral configurations, to match
the requirements of each individual application. Additionally, a
fast central processing unit (CPU), flash program memory,
SRAM data memory, and configurable I/O are included in a
range of convenient pinouts.
CS1
IDAC
The core
■
CapSense analog system
■
System resources
Analog Global Bus
Reference
Buffer
Comparator
Mux
Each CY8C20x37/47/67/S PSoC device includes a dedicated
CapSense block that provides sensing and scanning control
circuitry for capacitive sensing applications. Depending on the
PSoC package, up to 34 GPIOs are also included. The GPIOs
provide access to the MCU and analog mux.
The analog system contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware
performs capacitive sensing and scanning without requiring
external components. The analog system is composed of the
CapSense PSoC block and an internal 1 V or 1.2 V analog
reference, which together support capacitive sensing of up to 31
inputs[3]. Capacitive sensing is configurable on each GPIO pin.
Scanning of enabled CapSense pins is completed quickly and
easily across multiple ports.
SmartSense™ Auto-tuning
Refs
Cap Sense Counters
CSCLK
PSoC Core
CapSense System
Cexternal (P0[1]
or P0[3])
Mux
A common, versatile bus allows connection between I/O and the
analog system.
The PSoC core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and IMO and
ILO. The CPU core, called the M8C, is a powerful processor with
speeds up to 24 MHz. The M8C is a 4-million instructions per
second (MIPS), 8-bit Harvard-architecture microprocessor.
CSN
Vr
The architecture for this device family, as shown in the Logic
Block Diagram on page 2, consists of three main areas:
■
CS2
IMO
CapSense
Clock Select
Oscillator
Analog Multiplexer System
The analog mux bus can connect to every GPIO pin. Pins are
connected to the bus individually or in any combination. The bus
also connects to the analog system for analysis with the
CapSense block comparator.
Switch-control logic enables selected pins to precharge
continuously under hardware control. This enables capacitive
measurement for applications such as touch sensing. Other
multiplexer applications include:
■
Complex capacitive sensing interfaces, such as sliders and
touchpads.
■
Chip-wide mux that allows analog input from any I/O pin.
■
Crosspoint connection between any I/O pin combinations.
SmartSense auto-tuning is an innovative solution from Cypress
that removes manual tuning of CapSense applications. This
solution is easy to use and provides robust noise immunity. It is
the only auto-tuning solution that establishes, monitors, and
maintains all required tuning parameters of each sensor during
run time. SmartSense auto-tuning allows engineers to go from
prototyping to mass production without retuning for
manufacturing variations in PCB and/or overlay material
properties.
Note
3. 34 GPIOs = 31 pins for capacitive sensing+2 pins for I2C + 1 pin for modulator capacitor.
Document Number: 001-69257 Rev. *I
Page 4 of 43
CY8C20xx7/S
Additional System Resources
System resources provide additional capability, such as
configurable I2C slave, SPI master/slave communication
interface, three 16-bit programmable timers, various system
resets supported by the M8C low voltage detection and poweron reset. The merits of each system resource are listed here:
■
■
■
The I2C slave/SPI master-slave module provides 50/100/
400 kHz communication over two wires. SPI communication
over three or four wires runs at speeds of 46.9 kHz to 3 MHz
(lower for a slower system clock).
The I2C hardware address recognition feature reduces the
already low power consumption by eliminating the need for
CPU intervention until a packet addressed to the target device
is received.
2
The I C enhanced slave interface appears as a 32-byte RAM
buffer to the external I2C master. Using a simple predefined
protocol, the master controls the read and write pointers into
the RAM. When this method is enabled, the slave does not stall
the bus when receiving data bytes in active mode. For usage
details, see the application note I2C Enhanced Slave Operation
- AN56007.
■
Low-voltage detection (LVD) interrupts can signal the
application of falling voltage levels, while the advanced poweron reset (POR) circuit eliminates the need for a system
supervisor.
■
An internal reference provides an absolute reference for
capacitive sensing.
■
A register-controlled bypass mode allows the user to disable
the LDO regulator.
Getting Started
The quickest way to understand PSoC silicon is to read this
datasheet and then use the PSoC Designer Integrated
Development Environment (IDE). This datasheet is an overview
of the PSoC integrated circuit and presents specific pin, register,
and electrical specifications.
For in depth information, along with detailed programming
details, see the Technical Reference Manual for the CY8C20x37/
47/67/S PSoC devices.
For up-to-date ordering, packaging, and electrical specification
information, see the latest PSoC device datasheets on the web
at www.cypress.com/psoc.
Application Notes/Design Guides
Application notes and design guides are an excellent
introduction to the wide variety of possible PSoC designs. They
are located at www.cypress.com/gocapsense. Select
Application Notes under the Related Documentation tab.
Development Kits
PSoC Development Kits are available online from Cypress at
www.cypress.com/shop and through a growing number of
regional and global distributors, which include Arrow, Avnet, DigiKey, Farnell, Future Electronics, and Newark. See Development
Kits on page 31.
Training
Free PSoC and CapSense technical training (on demand,
webinars, and workshops) is available online at
www.cypress.com/training. The training covers a wide variety of
topics and skill levels to assist you in your designs.
CYPros Consultants
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant go to www.cypress.com/cypros.
Solutions Library
Visit our growing library of solution focused designs at
www.cypress.com/solutions. Here you can find various
application designs that include firmware and hardware design
files that enable you to complete your designs quickly.
Technical Support
For assistance with technical issues, search KnowledgeBase
articles and forums at www.cypress.com/support. If you cannot
find an answer to your question, create a technical support case
or call technical support at 1-800-541-4736.
Document Number: 001-69257 Rev. *I
Page 5 of 43
CY8C20xx7/S
Designing with PSoC Designer
Organize and Connect
The PSoC development process can be summarized in the
following four steps:
1. Select User Modules
2. Configure User Modules
3. Organize and Connect
4. Generate and Verify
You build signal chains at the chip level by interconnecting user
modules to each other and the I/O pins. You perform the
selection, configuration, and routing so that you have complete
control over all on-chip resources.
Select Components
PSoC Designer provides a library of pre-built, pre-tested
hardware peripheral components called “user modules”. User
modules make selecting and implementing peripheral devices,
both analog and digital, simple.
Configure Components
Each of the User Modules you select establishes the basic
register settings that implement the selected function. They also
provide parameters and properties that allow you to tailor their
precise configuration to your particular application. The user
module parameters permit you to establish the pulse width and
duty cycle. Configure the parameters and properties to
correspond to your chosen application. Enter values directly or
by selecting values from drop-down menus. All the user modules
are documented in datasheets that may be viewed directly in
PSoC Designer or on the Cypress website. These user module
datasheets explain the internal operation of the User Module and
provide performance specifications. Each datasheet describes
the use of each user module parameter, and other information
you may need to successfully implement your design.
Document Number: 001-69257 Rev. *I
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move
on to developing code for the project, you perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system. The
generated code provides application programming interfaces
(APIs) with high-level functions to control and respond to
hardware events at run time and interrupt service routines that
you can adapt as needed.
A complete code development environment allows you to
develop and customize your applications in C, assembly
language, or both.
Page 6 of 43
CY8C20xx7/S
Pinouts
The CY8C20x37/47/67/S PSoC device is available in a variety of packages, which are listed and illustrated in the following tables.
Every port pin (labeled with a “P”) is capable of digital I/O and connection to the common analog bus. However, VSS, VDD, and XRES
are not capable of digital I/O.
16-pin SOIC (10 Sensing Inputs)
Table 1. Pin Definitions – CY8C20237-24SXI, CY8C20247/S-24SXI [4]
Type
Pin
No.
Digital
Analog
1
I/O
I
P0[3] Integrating Input
2
I/O
I
P0[1] Integrating Input
3
I/O
I
P2[5] Crystal output (XOut)
4
I/O
I
P2[3] Crystal input (XIn)
5
I/O
I
P1[7] I2C SCL, SPI SS
6
I/O
I
P1[5] I2C SDA, SPI MISO
7
I/O
I
P1[3]
8
I/O
I
P1[1] ISSP CLK[5], I2C SCL, SPI
MOSI
9
Power
Name
VSS
Description
I/O
I
P1[0] ISSP DATA[5], I2C SDA, SPI
CLK[6]
11
I/O
I
P1[2] Driven Shield Output (optional)
12
I/O
I
P1[4] Optional external clock
(EXTCLK)
14
INPUT
I/O
15
16
1
2
3
4
5
6
7
8
SOIC
16
15
14
13
12
11
10
9
P0[7], AI
VDD
P0[4], AI
XRES
P1[4], EXTCLK
P1[2], AI
P1[0], ISSP DATA, I2C SDA, SPI CLK, AI
VSS
XRES Active high external reset with
internal pull-down
I
Power
I/O
AI, P0[3]
AI, P0[1]
AI, P2[5]
AI, P2[3]
AI, P1[7]
AI, P1[5]
AI, P1[3]
2
AI, ISSP CLK, I C SCL, SPI MOSI, P1[1]
Ground connection
10
13
Figure 2. CY8C20237-24SXI, CY8C20247/S-24SXI
Device
P0[4]
VDD
I
Supply voltage
P0[7]
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
4. 13 GPIOs = 10 pins for capacitive sensing+2 pins for I2C + 1 pin for modulator capacitor.
5. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
6. Alternate SPI clock.
Document Number: 001-69257 Rev. *I
Page 7 of 43
CY8C20xx7/S
16-pin QFN (10 Sensing Inputs)[7]
Table 2. Pin Definitions – CY8C20237, CY8C20247/S [8]
I/O
I
P2[5] Crystal output (XOut)
2
I/O
I
P2[3] Crystal input (XIn)
3
IOHR
I
P1[7] I2C SCL, SPI SS
2
4
IOHR
I
P1[5] I C SDA, SPI MISO
5
IOHR
I
P1[3] SPI CLK
6
IOHR
I
P1[1] ISSP CLK[9], I2C SCL, SPI
MOSI
7
Power
VSS
IOHR
I
P1[0] ISSP DATA[9], I2C SDA, SPI
CLK[10]
9
IOHR
I
P1[2] Driven Shield Output (optional)
10
IOHR
I
P1[4] Optional external clock
(EXTCLK)
12
13
Input
IOH
P0[1], AI
P0[3], AI
P0[7], AI
VDD
AI , XOut, P2[5]
AI , XIn, P2[3]
AI , I2 C SCL, SPI SS, P1[7]
AI , I2 C SDA, SPI MISO, P1[5]
Ground connection
8
11
Figure 3. CY8C20237, CY8C20247/S Device
Description
XRES Active high external reset with
internal pull-down
I
P0[4]
Power
VDD
1
2
14
13
1
Name
16
15
Analog
12
11
(Top View)
10
3
9
4
QFN
5
6
7
8
Digital
P0[4] , AI
XRES
P1[4] , EXTCLK, AI
P1[2] , AI
AI, SPI CLK , P1[3]
AI, ISSP CLK, SPI MOSI, P1[1]
VSS
AI, ISSP DATA , I2C SDA, SPI CLK , P1[0]
Type
Pin
No.
Supply voltage
14
IOH
I
P0[7]
15
IOH
I
P0[3] Integrating input
16
IOH
I
P0[1] Integrating input
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
7. No center pad.
8. 13 GPIOs = 10 pins for capacitive sensing+2 pins for I2C + 1 pin for modulator capacitor.
9. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
10. Alternate SPI clock.
Document Number: 001-69257 Rev. *I
Page 8 of 43
CY8C20xx7/S
24-pin QFN (16 Sensing Inputs)[11]
Table 3. Pin Definitions – CY8C20337, CY8C20347/S [12]
4
IOHR
I
P1[7]
I C SCL, SPI SS
5
IOHR
I
P1[5]
I2C SDA, SPI MISO
6
IOHR
I
P1[3]
SPI CLK
7
IOHR
I
P1[1]
ISSP CLK[13], I2C SCL, SPI
MOSI
NC
No connection
8
9
Power
VSS
Ground connection
10
IOHR
I
P1[0]
ISSP DATA[13], I2C SDA, SPI
CLK[14]
11
IOHR
I
P1[2]
Driven Shield Output
(optional)
12
IOHR
I
P1[4]
Optional external clock input
(EXTCLK)
13
IOHR
I
P1[6]
14
Input
I/O
I
P2[2]
Driven Shield Output
(optional)
16
I/O
I
P2[4]
Driven Shield Output
(optional)
17
IOH
I
P0[0]
Driven Shield Output
(optional)
18
IOH
I
P0[2]
Driven Shield Output
(optional)
19
IOH
I
P0[4]
Power
VDD
IOH
I
P0[7]
22
IOH
I
P0[3]
Integrating input
VSS
Ground connection
P0[1]
Integrating input
VSS
Center pad must be
connected to ground
24
CP
Power
IOH
Power
19
21
20
18
17
2
3
QFN
16
4
(Top View)
15
5
14
6
13
P0[2], AI
P0[0], AI
P2[4], AI
P2[2], AI
XRES
P1[6], AI
Supply voltage
21
23
AI, P2[1]
AI, I2C SCL, SPI SS, P1[7]
AI, I2C SDA, SPI MISO, P1[5]
AI, SPI CLK, P1[3]
1
XRES Active high external reset
with internal pull-down
15
20
AI, XOut, P2[5]
AI, XIn, P2[3]
2
11
12
P2[1]
AI, P1[2]
AI, EXTCLK, P1[4]
I
22
I/O
9
3
10
Crystal input (XIn)
AI, ISSP DATA2, I2C SDA, SPI CLK, P1[0]
Crystal output (XOut)
P2[3]
P0[1], AI
VSS
P0[3], AI
P0[7], AI
VDD
P0[4], AI
P2[5]
I
24
I
I/O
23
I/O
2
8
1
Figure 4. CY8C20337, CY8C20347/S Device
7
Description
AI, ISSP CLK2, I2C SCL
SPI MOSI, P1[1]
NC
VSS
Type
Pin
No. Digital Analog Name
I
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
11. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
12. 19 GPIOs = 16 pins for capacitive sensing+2 pins for I2C + 1 pin for modulator capacitor.
13. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
14. Alternate SPI clock.
Document Number: 001-69257 Rev. *I
Page 9 of 43
CY8C20xx7/S
30-ball WLCSP (24 Sensing Inputs)
Table 4. Pin Definitions – CY8C20767, CY8C20747 30-ball Part Pinout (WLCSP) [15]
Type
Pin No.
Name
Description
Figure 5. CY8C20767, CY8C20747 30-ball
WLCSP
I
P0[2]
Driven Shield Output (optional)
Bottom View
I
P0[6]
Digital
Analog
A1
IOH
A2
IOH
A3
Power
5
VDD
Supply voltage
Integrating Input
A4
IOH
I
P0[1]
A5
I/O
I
P2[7]
B1
I/O
I
P4[2]
B2
IOH
I
P0[0]
B3
IOH
I
P0[4]
B4
IOH
I
P0[3]
Integrating Input
B5
I/O
I
P2[5]
Crystal Output (Xout)
C1
I/O
I
P2[2]
Driven Shield Output (optional)
C2
I/O
I
P2[4]
Driven Shield Output (optional)
C3
I/O
I
P0[7]
C4
IOH
I
P3[2]
C5
I/O
I
P2[3]
D1
I/O
I
P2[0]
D2
I/O
I
P3[0]
D3
I/O
I
P3[1]
D4
I/O
I
P3[3]
D5
I/O
I
P2[1]
E1
Input
XRES
1
A
C
D
E
F
Top View
1
Crystal Input (Xin)
2
3
4
5
A
B
C
Active high external reset with
internal pull-down
IOHR
I
P1[6]
IOHR
I
P1[4]
Optional external clock input
(EXT CLK)
E4
IOHR
I
P1[7]
I2C SCL, SPI SS
E5
IOHR
I
P1[5]
I2C SDA, SPI MISO
F1
IOHR
I
P1[2]
Driven Shield Output (optional)
F2
IOHR
I
P1[0]
ISSP DATA[16], I2C SDA, SPI
CLK[17]
VSS
2
Driven Shield Output (optional)
E3
Power
3
B
E2
F3
4
D
E
F
Supply ground
F4
IOHR
I
P1[1]
ISSP CLK[16], I2C SCL, SPI
MOSI
F5
IOHR
I
P1[3]
SPI CLK
LEGEND: A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output
Notes
15. 27 GPIOs = 24 pins for capacitive sensing+2 pins for I2C + 1 pin for modulator capacitor.
16. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
17. Alternate SPI clock.
Document Number: 001-69257 Rev. *I
Page 10 of 43
CY8C20xx7/S
32-pin QFN (25 Sensing Inputs)[18]
Table 5. Pin Definitions – CY8C20437, CY8C20447/S, CY8C20467/S [19]
I
I
I
I
I
I
I
I
I
I
I
Power
IOH
IOH
I
I
Power
Power
P0[2], AI
P0[0], AI
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IOH
IOH
IOH
IOH
Input
P0[4], AI
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
CP
P1[6]
XRES Active high external reset with
internal pull-down
P3[0]
P3[2]
P4[0]
P4[2]
P2[0]
P2[2] Driven Shield Output (optional)
P2[4] Driven Shield Output (optional)
P0[0] Driven Shield Output (optional)
P0[2] Driven Shield Output (optional)
P0[4]
P0[6]
VDD
P0[7]
P0[3] Integrating input
VSS
Ground connection
VSS
Center pad must be connected to
ground
26
25
I
15
16
IOHR
AI, E XTCLK, P1[4]
AI, P1[6]
16
17
28
27
P1[2]
P1[4]
QFN
(Top View)
24
23
22
21
20
19
18
17
13
14
I
I
1
2
3
4
5
6
7
8
30
29
IOHR
IOHR
AI , XOut ,P0[1]
AI , XIn ,P2[5]
AI ,P2[3]
AI ,P2[1]
AI ,P4[3]
AI ,P3[3]
AI ,P3[1]
AI ,I2 C SCL, SPI SS,P1[7]
A I,ISSP CLK , I2C SCL, SPI MOSI, P1[1]
Vss
AI , ISSP DATA , I2C SDA, SPI CLK, P1[0]
AI, P1[2]
14
15
Vss
P0[3], AI
P0[7], AI
VDD
P0[6], AI
VSS
P1[0]
I2C SCL, SPI SS
I2C SDA, SPI MISO
SPI CLK.
ISSP CLK[20], I2C SCL, SPI
MOSI.
Ground connection
ISSP DATA[20], I2C SDA,
SPI CLK[21]
Driven Shield Output (optional)
Optional external clock input
(EXTCLK)
32
31
Power
IOHR
I
Integrating input
Crystal output (XOut)
Crystal input (XIn)
Figure 6. CY8C20437, CY8C20447/S, CY8C20467/S Device
9
12
13
Description
10
11
12
P0[1]
P2[5]
P2[3]
P2[1]
P4[3]
P3[3]
P3[1]
P1[7]
P1[5]
P1[3]
P1[1]
Name
AI, I2C SDA, SPI MI SO, P1[5]
AI, SPI CLK, P1[3]
1
2
3
4
5
6
7
8
9
10
11
Type
Digital Analog
IOH
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
IOHR
I
IOHR
I
IOHR
I
IOHR
I
Pin
No.
P2[4] , AI
P2[2] , AI
P2[0] , AI
P4[2] , AI
P4[0] , AI
P3[2] , AI
P3[0] , AI
XRES
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
18. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
19. 28 GPIOs = 25 pins for capacitive sensing+2 pins for I2C + 1 pin for modulator capacitor.
20. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
21. Alternate SPI clock.
Document Number: 001-69257 Rev. *I
Page 11 of 43
CY8C20xx7/S
48-pin QFN (31 Sensing Inputs)[22]
I
I
I
P3[0]
P3[2]
P3[4]
30
31
32
33
34
35
36
37
38
39
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
P3[6]
P4[0]
P4[2]
P2[0]
P2[2]
P2[4]
NC
P0[0]
P0[2]
P0[4]
IOH
IOH
IOH
I
I
I
P0[1], AI
Vss
P0[3], AI
NC ,
P0[7], AI
NC
NC
Vdd
P0[6], AI
P0[4], AI
P0[2], AI
P0[0], AI
48
47
46
45
44
43
42
41
40
39
38
37
QFN
(Top View)
13
14
15
16
17
18
19
20
21
22
23
24
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
NC
P2[4],AI
P2[2],AI
P2[0],AI
P4[2],AI
P4[0],AI
P3[6],AI
P3[4], AI
P3[2],AI
P3[0], AI
XRES
P1[6], AI
Active high external reset with
internal pull-down
Driven Shield Output (optional)
Driven Shield Output (optional)
No connection
Driven Shield Output (optional)
Driven Shield Output (optional)
40
41
42
43
44
45
46
47
48
CP
IOH
I
Power
IOH
I
IOH
I
Power
IOH
I
Power
Description
I/O
I/O
I/O
I2C SCL, SPI SS
I2C SDA, SPI MISO
No connection
No connection
SPI CLK
ISSP CLK[24], I2C SCL, SPI MOSI
Ground connection
No connection
No connection
Supply voltage
ISSP DATA[24], I2C SDA, SPI CLK[25]
Driven Shield Output (optional)
Optional external clock input
(EXTCLK)
Pin No.
27
28
29
Crystal output (XOut)
Crystal input (XIn)
1
2
3
4
5
6
I2C SDA, SPI MISO, A I, P1[5]
NC
NC
SPI CLK, AI, P1[3]
AI, ISSP CLK, I2C SCL, SPI MOSI, P1[1]
Vss
NC
NC
Vdd
AI, ISSP DATA1 , I2C SDA, SPI CLK, P1[0]
AI, P 1[2]
AI, EXTCLK, P1[4]
P1[6]
XRES
NC
AI ,P2[7]
AI , XOut,P2[5]
AI , XIn ,P2[3]
AI ,P2[1]
AI ,P4[3]
AI ,P4[1]
AI ,P3[7]
AI ,P3[5]
AI ,P3[3]
AI P3[1]
AI ,I2 C SCL, SPI SS,P1[7]
Name
IOHR
I
Input
No connection
Analog
Power
IOHR
I
IOHR
I
IOHR
I
NC
P2[7]
P2[5]
P2[3]
P2[1]
P4[3]
P4[1]
P3[7]
P3[5]
P3[3]
P3[1]
P1[7]
P1[5]
NC
NC
P1[3]
P1[1]
VSS
NC
NC
VDD
P1[0]
P1[2]
P1[4]
IOHR
I
IOHR
I
Power
Description
I
I
I
I
I
I
I
I
I
I
I
I
Name
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IOHR
IOHR
Figure 7. CY8C20637, CY8C20647/S, CY8C20667/S Device
Digital
25
26
Analog
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Digital
Pin No.
Table 6. Pin Definitions – CY8C20637, CY8C20647/S, CY8C20667/S [23]
P0[6]
VDD
NC
NC
P0[7]
NC
P0[3]
VSS
P0[1]
VSS
Supply voltage
No connection
No connection
No connection
Integrating input
Ground connection
Integrating input
Center pad must be connected to ground
LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive, R = Regulated Output.
Notes
22. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
23. 34 GPIOs = 31 pins for capacitive sensing+2 pins for I2C + 1 pin for modulator capacitor.
24. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
25. Alternate SPI clock.
Document Number: 001-69257 Rev. *I
Page 12 of 43
CY8C20xx7/S
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C20x37/47/67/S PSoC devices. For the latest electrical
specifications, confirm that you have the most recent datasheet by visiting the web at http://www.cypress.com/psoc.
Figure 8. Voltage versus CPU Frequency
5.5 V
VDD Voltage
li d ng
Va rati n
e io
Op Reg
1.71 V
750 kHz
3 MHz
CPU
24 MHz
Frequency
Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested.
Table 7. Absolute Maximum Ratings
Symbol
Description
Conditions
Min
Typ
Max
Units
TSTG
Storage temperature
Higher storage temperatures reduce data
retention time. Recommended Storage
Temperature is +25 °C ± 25 °C. Extended
duration storage temperatures above 85 °C
degrades reliability.
–55
+25
+125
°C
VDD
Supply voltage relative to VSS
–
–0.5
–
+6.0
V
VIO
DC input voltage
–
VSS – 0.5
–
VDD + 0.5
V
VIOZ
DC voltage applied to tristate
–
VSS – 0.5
–
VDD + 0.5
V
IMIO
Maximum current into any port pin
–
–25
–
+50
mA
ESD
Electro static discharge voltage
Human body model ESD
2000
–
–
V
LU
Latch up current
In accordance with JESD78 standard
–
–
200
mA
Min
Typ
Max
Units
–
+85
°C
70
°C
+100
°C
Operating Temperature
Table 8. Operating Temperature
Symbol
Description
Conditions
TA
Ambient temperature
–
–40
TC
Commercial temperature range
–
0
TJ
Operational die temperature
The temperature rise from ambient to junction
is package specific. See the Thermal Impedances on page 30. The user must limit the
power consumption to comply with this
requirement.
Document Number: 001-69257 Rev. *I
–40
–
Page 13 of 43
CY8C20xx7/S
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 9. DC Chip-Level Specifications
Symbol
VDD
[26, 27, 28]
Description
Supply voltage
Conditions
Min
Typ
Max
Units
See table DC POR and LVD Specifications on
page 19
1.71
–
5.50
V
IDD24
Supply current, IMO = 24 MHz Conditions are VDD  3.0 V, TA = 25 °C,
CPU = 24 MHz. CapSense running at 12 MHz,
no I/O sourcing current
–
2.88
4.00
mA
IDD12
Supply current, IMO = 12 MHz Conditions are VDD  3.0 V, TA = 25 °C,
CPU = 12 MHz. CapSense running at
12 MHz, no I/O sourcing current
–
1.71
2.60
mA
IDD6
Supply current, IMO = 6 MHz
Conditions are VDD  3.0 V, TA = 25 °C,
CPU = 6 MHz. CapSense running at 6 MHz,
no I/O sourcing current
–
1.16
1.80
mA
ISB0
Deep sleep current
VDD  3.0 V, TA = 25 °C, I/O regulator turned off
–
0.10
1.1
A
ISB1
Standby current with POR, LVD VDD  3.0 V, TA = 25 °C, I/O regulator turned off
and sleep timer
–
1.07
1.50
A
ISBI2C
Standby current with I2C
enabled
–
1.64
–
A
Conditions are VDD = 3.3 V, TA = 25 °C and
CPU = 24 MHz
Notes
26. When VDD remains in the range from 1.71 V to 1.9 V for more than 50 µs, the slew rate when moving from the 1.71 V to 1.9 V range to greater than 2 V must be
slower than 1 V/500 µs to avoid triggering POR. The only other restriction on slew rates for any other voltage range or transition is the SRPOWER_UP parameter.
27. If powering down in standby sleep mode, to properly detect and recover from a VDD brown out condition any of the following actions must be taken:
a. Bring the device out of sleep before powering down.
b. Assure that VDD falls below 100 mV before powering back up.
c. Set the No Buzz bit in the OSC_CR0 register to keep the voltage monitoring circuit powered during sleep.
d. Increase the buzz rate to assure that the falling edge of VDD is captured. The rate is configured through the PSSDC bits in the SLP_CFG register. For the referenced
registers, refer to the Technical Reference Manual. In deep sleep/standby sleep mode, additional low power voltage monitoring circuitry allows VDD brown out
conditions to be detected and resets the device when VDD goes lower than 1.1 V at edge rates slower than 1 V/ms.
28. For proper CapSense block functionality, if the drop in VDD exceeds 5% of the base VDD, the rate at which VDD drops should not exceed 200 mV/s. Base VDD can
be between 1.8 V and 5.5 V.
Document Number: 001-69257 Rev. *I
Page 14 of 43
CY8C20xx7/S
DC GPIO Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and
–40 °C  TA  85 °C, 2.4 V to 3.0 V and –40 °C  TA  85 °C, or 1.71 V to 2.4 V and –40 °C  TA  85 °C, respectively. Typical
parameters apply to 5 V and 3.3 V at 25 °C and are for design guidance only.
Table 10. 3.0 V to 5.5 V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ Max Units
RPU
Pull-up resistor
–
4
5.60
8
k
VOH1
High output voltage
Port 2 or 3 pins
IOH < 10 A, maximum of 10 mA source
current in all I/Os
VDD – 0.20
–
–
V
VOH2
High output voltage
Port 2 or 3 Pins
IOH = 1 mA, maximum of 20 mA source
current in all I/Os
VDD – 0.90
–
–
V
VOH3
High output voltage
IOH < 10 A, maximum of 10 mA source
Port 0 or 1 pins with LDO regulator Disabled current in all I/Os
for port 1
VDD – 0.20
–
–
V
VOH4
High output voltage
IOH = 5 mA, maximum of 20 mA source
Port 0 or 1 pins with LDO regulator Disabled current in all I/Os
for port 1
VDD – 0.90
–
–
V
VOH5
IOH < 10 A, VDD > 3.1 V, maximum of
High output voltage
Port 1 Pins with LDO Regulator Enabled for 4 I/Os all sourcing 5 mA
3 V out
2.85
VOH6
High output voltage
IOH = 5 mA, VDD > 3.1 V, maximum of 20 mA
Port 1 pins with LDO regulator enabled for source current in all I/Os
3 V out
2.20
VOH7
High output voltage
IOH < 10 A, VDD > 2.7 V, maximum of 20 mA
Port 1 pins with LDO enabled for 2.5 V out source current in all I/Os
2.35
VOH8
High output voltage
IOH = 2 mA, VDD > 2.7 V, maximum of 20 mA
Port 1 pins with LDO enabled for 2.5 V out source current in all I/Os
1.90
VOH9
High output voltage
IOH < 10 A, VDD > 2.7 V, maximum of 20 mA
Port 1 pins with LDO enabled for 1.8 V out source current in all I/Os
1.60
VOH10
High output voltage
IOH = 1 mA, VDD > 2.7 V, maximum of 20 mA
Port 1 pins with LDO enabled for 1.8 V out source current in all I/Os
1.20
–
–
V
VOL
Low output voltage
IOL = 25 mA, VDD > 3.3 V, maximum of 60 mA
sink current on even port pins (for example,
P0[2] and P1[4]) and 60 mA sink current on
odd port pins (for example, P0[3] and P1[5])
–
–
0.75
V
VIL
Input low voltage
–
–
–
0.80
V
3.00 3.30
–
–
2.50 2.75
–
–
1.80 2.10
V
V
V
V
V
VIH
Input high voltage
–
2.00
–
–
V
VH
Input hysteresis voltage
–
–
80
–
mV
IIL
Input leakage (Absolute Value)
–
–
0.00
1
1
A
CPIN
Pin capacitance
Package and pin dependent
Temp = 25 °C
0.50
1.70
7
pF
VILLVT3.3 Input Low Voltage with low threshold enable Bit3 of IO_CFG1 set to enable low threshold
set, Enable for Port1
voltage of Port1 input
0.8
V
–
–
VIHLVT3.3 Input High Voltage with low threshold enable Bit3 of IO_CFG1 set to enable low threshold
set, Enable for Port1
voltage of Port1 input
1.4
–
–
V
VILLVT5.5 Input Low Voltage with low threshold enable Bit3 of IO_CFG1 set to enable low threshold
set, Enable for Port1
voltage of Port1 input
0.8
V
–
–
VIHLVT5.5 Input High Voltage with low threshold enable Bit3 of IO_CFG1 set to enable low threshold
set, Enable for Port1
voltage of Port1 input
1.7
–
–
V
Document Number: 001-69257 Rev. *I
Page 15 of 43
CY8C20xx7/S
Table 11. 2.4 V to 3.0 V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
4
5.60
8
k
IOH < 10 A, maximum of 10 mA source VDD - 0.20
current in all I/Os
–
–
V
High output voltage
Port 2 or 3 Pins
IOH = 0.2 mA, maximum of 10 mA
source current in all I/Os
VDD - 0.40
–
–
V
VOH3
High output voltage
Port 0 or 1 pins with LDO regulator
Disabled for port 1
IOH < 10 A, maximum of 10 mA source VDD - 0.20
current in all I/Os
–
–
V
VOH4
High output voltage
Port 0 or 1 pins with LDO regulator
Disabled for Port 1
IOH = 2 mA, maximum of 10 mA source VDD - 0.50
current in all I/Os
–
–
V
VOH5A
IOH < 10 A, VDD > 2.4 V, maximum of
High output voltage
Port 1 pins with LDO enabled for 1.8 V 20 mA source current in all I/Os
out
1.50
1.80
2.10
V
VOH6A
High output voltage
IOH = 1 mA, VDD > 2.4 V, maximum of
Port 1 pins with LDO enabled for 1.8 V 20 mA source current in all I/Os
out
1.20
–
–
V
VOL
Low output voltage
IOL = 10 mA, maximum of 30 mA sink
current on even port pins (for example,
P0[2] and P1[4]) and 30 mA sink
current on odd port pins (for example,
P0[3] and P1[5])
–
–
0.75
V
VIL
Input low voltage
–
–
–
0.72
V
VIH
Input high voltage
–
1.40
–
VH
Input hysteresis voltage
–
–
80
–
mV
IIL
Input leakage (absolute value)
–
–
1
1000
nA
CPIN
Capacitive load on pins
Package and pin dependent
Temp = 25 C
0.50
1.70
7
pF
VILLVT2.5
Input Low Voltage with low threshold
enable set, Enable for Port1
Bit3 of IO_CFG1 set to enable low
threshold voltage of Port1 input
0.7
V
–
VIHLVT2.5 Input High Voltage with low threshold
enable set, Enable for Port1
Bit3 of IO_CFG1 set to enable low
threshold voltage of Port1 input
1.2
RPU
Pull-up resistor
–
VOH1
High output voltage
Port 2 or 3 pins
VOH2
V
–
V
Table 12. 1.71 V to 2.4 V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
4
5.60
8
k
IOH = 10 A, maximum of 10 mA VDD – 0.20
source current in all I/Os
–
–
V
High output voltage
Port 2 or 3 pins
IOH = 0.5 mA, maximum of 10 mA VDD – 0.50
source current in all I/Os
–
–
V
VOH3
High output voltage
Port 0 or 1 pins with LDO regulator
Disabled for Port 1
IOH = 100 A, maximum of 10 mA VDD – 0.20
source current in all I/Os
–
–
V
VOH4
High output voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
IOH = 2 mA, maximum of 10 mA source VDD – 0.50
current in all I/Os
–
–
V
RPU
Pull-up resistor
–
VOH1
High output voltage
Port 2 or 3 pins
VOH2
Document Number: 001-69257 Rev. *I
Page 16 of 43
CY8C20xx7/S
Table 12. 1.71 V to 2.4 V DC GPIO Specifications (continued)
Symbol
Description
Conditions
Min
Typ
Max
Units
VOL
Low output voltage
IOL = 5 mA, maximum of 20 mA sink
current on even port pins (for example,
P0[2] and P1[4]) and 30 mA sink
current on odd port pins (for example,
P0[3] and P1[5])
–
–
0.40
V
VIL
Input low voltage
–
–
–
0.30 × VDD
V
VIH
Input high voltage
–
0.65 × VDD
–
–
V
VH
Input hysteresis voltage
–
–
80
–
mV
IIL
Input leakage (absolute value)
–
–
1
1000
nA
CPIN
Capacitive load on pins
Package and pin dependent
temp = 25 C
0.50
1.70
7
pF
Table 13. GPIO Current Sink and Source Specifications
Supply
Voltage
1.71–2.4
2.4–3.0
3.0–5.0
Mode
Port 0/1 per I/O
(max)
Port 2/3/4 per
I/O (max)
Total Current Even
Pins (max)
Total Current Odd
Pins (max)
Units
20
30
mA
Sink
5
5
Source
2
0.5
Sink
10
10
Source
2
0.2
Sink
25
25
Source
5
1
10[29]
mA
30
30
mA
10[29]
mA
60
60
mA
20[29]
mA
DC Analog Mux Bus Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 14. DC Analog Mux Bus Specifications
Min
Typ
Max
Units
RSW
Symbol
Switch resistance to common analog
bus
Description
–
Conditions
–
–
800

RGND
Resistance of initialization switch to
VSS
–
–
–
800

The maximum pin voltage for measuring RSW and RGND is 1.8 V
DC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 15. DC Comparator Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
0.2
–
1.8
V
VLPC
Low power comparator (LPC) common Maximum voltage limited to VDD
mode
ILPC
LPC supply current
–
–
10
80
A
VOSLPC
LPC voltage offset
–
–
2.5
30
mV
Note
29. Total current (odd + even ports)
Document Number: 001-69257 Rev. *I
Page 17 of 43
CY8C20xx7/S
Comparator User Module Electrical Specifications
The following table lists the guaranteed maximum and minimum specifications. Unless stated otherwise, the specifications are for the
entire device voltage and temperature operating range: –40 °C  TA  85 °C, 1.71 V  VDD  5.5 V.
Table 16. Comparator User Module Electrical Specifications
Symbol
Min
Typ
Max
Units
50 mV overdrive
–
70
100
ns
Offset
Valid from 0.2 V to 1.5 V
–
2.5
30
mV
Current
Average DC current, 50 mV
overdrive
–
20
80
µA
Supply voltage > 2 V
Power supply rejection ratio
–
80
–
dB
Supply voltage < 2 V
Power supply rejection ratio
–
40
TCOMP
PSRR
Description
Comparator response time
Input range
Conditions
–
0.2
–
dB
1.5
V
ADC Electrical Specifications
Table 17. ADC User Module Electrical Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
0
–
VREFADC
V
Input
VIN
Input voltage range
CIIN
Input capacitance
–
RIN
Input resistance
Equivalent switched cap input
resistance for 8-, 9-, or 10-bit
resolution
ADC reference voltage
FCLK
–
–
–
5
pF
1/(500fF ×
data clock)
1/(400fF ×
data clock)
1/(300fF ×
data clock)

–
1.14
–
1.26
V
Data clock
Source is chip’s internal main
oscillator. See AC Chip-Level
Specifications on page 21 for
accuracy
2.25
–
6
MHz
S8
8-bit sample rate
Data clock set to 6 MHz.
sample rate = 0.001/
(2^Resolution/Data Clock)
–
23.43
–
ksps
S10
10-bit sample rate
Data clock set to 6 MHz.
sample rate = 0.001/
(2^resolution/data clock)
–
5.85
–
ksps
Reference
VREFADC
Conversion Rate
DC Accuracy
RES
Resolution
Can be set to 8, 9, or 10 bit
8
–
10
bits
DNL
Differential nonlinearity
–
–1
–
+2
LSB
INL
Integral nonlinearity
–
–2
–
+2
LSB
EOFFSET
Offset error
8-bit resolution
0
3.20
19.20
LSB
10-bit resolution
0
12.80
76.80
LSB
EGAIN
Gain error
For any resolution
–5
–
+5
%FSR
IADC
Operating current
–
–
2.10
2.60
mA
PSRR
Power supply rejection ratio
Power
Document Number: 001-69257 Rev. *I
PSRR (VDD > 3.0 V)
–
24
–
dB
PSRR (VDD < 3.0 V)
–
30
–
dB
Page 18 of 43
CY8C20xx7/S
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 18. DC POR and LVD Specifications
Symbol
VPOR0
Description
Conditions
Min
Typ
Max
Units
1.61
–
1.66
1.71
V
2.36
2.41
–
2.60
2.66
–
2.82
2.95
VPOR2
1.66 V selected in PSoC Designer VDD must be greater than or equal to 1.71 V
2.36 V selected in PSoC Designer during startup, reset from the XRES pin, or
reset from watchdog.
2.60 V selected in PSoC Designer
VPOR3
2.82 V selected in PSoC Designer
VLVD0
2.45 V selected in PSoC Designer –
2.40
2.45
2.51
VLVD1
2.71 V selected in PSoC Designer
2.64[30]
2.71
2.78
VLVD2
2.92 V selected in PSoC Designer
2.85[31]
2.92
2.99
VLVD3
3.02 V selected in PSoC Designer
2.95[32]
3.02
3.09
VLVD4
3.13 V selected in PSoC Designer
3.06
3.13
3.20
VLVD5
1.90 V selected in PSoC Designer
1.84
1.90
2.32
VLVD6
1.80 V selected in PSoC Designer
1.75[33]
1.80
1.84
VLVD7
4.73 V selected in PSoC Designer
4.62
4.73
4.83
VPOR1
V
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 19. DC Programming Specifications
Symbol
Description
VDDIWRITE Supply voltage for flash write
operations
IDDP
Supply current during
programming or verify
VILP
Input low voltage during
programming or verify
VIHP
Input high voltage during
programming or verify
IILP
Input current when Applying VILP
to P1[0] or P1[1] during
programming or verify
IIHP
Input current when applying VIHP
to P1[0] or P1[1] during
programming or verify
VOLP
Output low voltage during
programming or verify
VOHP
Output high voltage during
programming or verify
FlashENPB Flash write endurance
FlashDR
Flash data retention
–
Conditions
Min
1.71
Typ
–
Max
5.25
Units
V
–
–
5
25
mA
See appropriate DC GPIO Specifications
on page 15
See appropriate DC GPIO Specifications
on page 15
Driving internal pull-down resistor
–
–
VIL
V
VIH
–
–
V
–
–
0.2
mA
–
–
1.5
mA
–
–
VSS + 0.75
V
VOH
–
VDD
V
50,000
20
–
–
–
–
–
Years
Driving internal pull-down resistor
See appropriate DC GPIO Specifications
on page 15. For VDD > 3V use VOH4 in
Table 10 on page 15.
Erase/write cycles per block
Following maximum Flash write cycles;
ambient temperature of 55 °C
Notes
30. Always greater than 50 mV above VPPOR1 voltage for falling supply.
31. Always greater than 50 mV above VPPOR2 voltage for falling supply.
32. Always greater than 50 mV above VPPOR3 voltage for falling supply.
33. Always greater than 50 mV above VPPOR0 voltage for falling supply.
Document Number: 001-69257 Rev. *I
Page 19 of 43
CY8C20xx7/S
DC I2C Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and
–40 °C  TA  85 °C, 2.4 V to 3.0 V and –40 °C  TA  85 °C, or 1.71 V to 2.4 V and –40 °C  TA  85 °C, respectively. Typical
parameters apply to 5 V and 3.3 V at 25 °C and are for design guidance only.
Table 20. DC I2C Specifications[34]
Symbol
VILI2C
VIHI2C
Description
Input low level
Input high level
Conditions
3.1 V ≤ VDD ≤ 5.5 V
Min
–
Typ
–
Max
Units
0.25 × VDD
V
2.5 V ≤ VDD ≤ 3.0 V
–
–
0.3 × VDD
V
1.71 V ≤ VDD ≤ 2.4 V
–
–
0.3 × VDD
V
1.71 V ≤ VDD ≤ 5.5 V
0.65 × VDD
–
VDD +
0.7 V[35]
V
Shield Driver DC Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and
–40 °C  TA  85 °C, 2.4 V to 3.0 V and –40 °C  TA  85 °C, or 1.71 V to 2.4 V and –40 °C  TA  85 °C, respectively. Typical
parameters apply to 5 V and 3.3 V at 25 °C and are for design guidance only.
Table 21. Shield Driver DC Specifications
Symbol
VRef
Description
Reference buffer output
Conditions
1.7 V ≤ VDD ≤ 5.5 V
Min
0.942
Typ
–
Max
1.106
Units
V
VRefHi
Reference buffer output
1.7 V ≤ VDD ≤ 5.5 V
1.104
–
1.296
V
DC IDAC Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 22. DC IDAC Specifications (8-bit IDAC)
Symbol
Description
Min
Typ
Max
Units
Notes
IDAC_DNL
Differential nonlinearity
–1
–
1
LSB
IDAC_DNL
Integral nonlinearity
–2
–
2
LSB
IDAC_Current
Range = 4x
138
–
169
µA
DAC setting = 127 dec
Range = 8x
138
–
169
µA
DAC setting = 64 dec
Table 23. DC IDAC Specifications (7-bit IDAC)
Symbol
Description
Min
Typ
Max
Units
Notes
IDAC_DNL
Differential nonlinearity
–1
–
1
LSB
IDAC_DNL
Integral nonlinearity
–2
–
2
LSB
IDAC_Current
Range = 4x
137
–
168
µA
DAC setting = 127 dec
Range = 8x
138
–
169
µA
DAC setting = 64 dec
Notes
34. Pull-up resistors on I2C interface cannot be connected to a supply voltage that is more than 0.7 V higher than the CY8C20xx7/S/H/L power supply. See the CY8C20xx7
Silicon Errata document for more details.
35. Please refer to Item # 6 of the Silicon Errata for the CY8C20xx7/S Family
Document Number: 001-69257 Rev. *I
Page 20 of 43
CY8C20xx7/S
AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 24. AC Chip-Level Specifications
Min
Typ
Max
Units
FIMO24
Symbol
IMO frequency at 24 MHz Setting
Description
–
Conditions
22.8
24
25.2
MHz
FIMO12
IMO frequency at 12 MHz setting
–
11.4
12
12.6
MHz
FIMO6
IMO frequency at 6 MHz setting
–
5.7
6.0
6.3
MHz
FCPU
CPU frequency
–
0.75
–
25.20
MHz
F32K1
ILO frequency
–
15
32
50
kHz
F32K_U
ILO untrimmed frequency
–
13
32
82
kHz
DCIMO
Duty cycle of IMO
–
40
50
60
%
DCILO
ILO duty cycle
–
40
50
60
%
VDD slew rate during power-up
–
–
250
V/ms
After supply voltage is valid
1
–
–
ms
Applies after part has booted
10
–
–
s
SRPOWER_UP Power supply slew rate
tXRST
External reset pulse width at power-up
tXRST2
tJIT_IMO
External reset pulse width after
[37]
power-up[36]
6 MHz IMO cycle-to-cycle jitter (RMS)
–
–
0.7
6.7
ns
6 MHz IMO long term N cycle-to-cycle jitter
(RMS); N = 32
–
–
4.3
29.3
ns
6 MHz IMO period jitter (RMS)
–
–
0.7
3.3
ns
12 MHz IMO cycle-to-cycle jitter (RMS)
–
–
0.5
5.2
ns
12 MHz IMO long term N cycle-to-cycle jitter
(RMS); N = 32
–
––
2.3
5.6
ns
12 MHz IMO period jitter (RMS)
–
–
0.4
2.6
ns
24 MHz IMO cycle-to-cycle jitter (RMS)
–
–
1.0
8.7
ns
24 MHz IMO long term N cycle-to-cycle jitter
(RMS); N = 32
–
–
1.4
6.0
ns
24 MHz IMO period jitter (RMS)
–
–
0.6
4.0
ns
Note
36. The minimum required XRES pulse length is longer when programming the device (see Table 28 on page 23).
37. See the Cypress Jitter Specifications application note, Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 for more information.
Document Number: 001-69257 Rev. *I
Page 21 of 43
CY8C20xx7/S
AC General Purpose I/O Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 25. AC GPIO Specifications
Symbol
FGPIO
Description
GPIO operating frequency
Conditions
Normal strong mode Port 0, 1
Min
0
0
tRISE23
tRISE23L
tRISE01
tRISE01L
tFALL
tFALLL
Rise time, strong mode, Cload = 50 pF
Ports 2 or 3
Rise time, strong mode low supply,
Cload = 50 pF, Ports 2 or 3
Rise time, strong mode, Cload = 50 pF
Ports 0 or 1
Rise time, strong mode low supply,
Cload = 50 pF, Ports 0 or 1
Fall time, strong mode, Cload = 50 pF
all ports
Fall time, strong mode low supply,
Cload = 50 pF, all ports
Typ
Max
Units
– 6 MHz for
MHz
1.71 V <VDD < 2.40 V
– 12 MHz for
MHz
2.40 V < VDD< 5.50 V
–
80
ns
VDD = 3.0 to 3.6 V, 10% to 90%
15
VDD = 1.71 to 3.0 V, 10% to 90%
15
–
80
ns
VDD = 3.0 to 3.6 V, 10% to 90%
LDO enabled or disabled
VDD = 1.71 to 3.0 V, 10% to 90%
LDO enabled or disabled
VDD = 3.0 to 3.6 V, 10% to 90%
10
–
50
ns
10
–
80
ns
10
–
50
ns
VDD = 1.71 to 3.0 V, 10% to 90%
10
–
70
ns
Figure 9. GPIO Timing Diagram
90%
GPIO Pin
Output
Voltage
10%
TRise23
TRise01
TRise23L
TRise01L
TFall
TFallL
AC Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 26. AC Low Power Comparator Specifications
Symbol
tLPC
Description
Comparator response time,
50 mV overdrive
Conditions
50 mV overdrive does not include
offset voltage.
Min
Typ
Max
Units
–
–
100
ns
AC External Clock Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 27. AC External Clock Specifications
Symbol
FOSCEXT
Description
Frequency (external oscillator
frequency)
Conditions
–
Min
Typ
Max
Units
0.75
–
25.20
MHz
High period
–
20.60
–
5300
ns
Low period
–
20.60
–
–
ns
Power-up IMO to switch
–
150
–
–
s
Document Number: 001-69257 Rev. *I
Page 22 of 43
CY8C20xx7/S
AC Programming Specifications
Figure 10. AC Waveform
SCLK (P1[1])
T RSCLK
T FSCLK
SDATA (P1[0])
TSSCLK
T HSCLK
TDSCLK
The following table lists the guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 28. AC Programming Specifications
Symbol
tRSCLK
tFSCLK
tSSCLK
tHSCLK
FSCLK
tERASEB
tWRITE
tDSCLK
tDSCLK3
tDSCLK2
tXRST3
Description
Rise time of SCLK
Fall time of SCLK
Data setup time to falling edge of SCLK
Data hold time from falling edge of SCLK
Frequency of SCLK
Flash erase time (block)
Flash block write time
Data out delay from falling edge of SCLK
Data out delay from falling edge of SCLK
Data out delay from falling edge of SCLK
External reset pulse width after power-up
tXRES
tVDDWAIT[38]
tVDDXRES[38]
tPOLL
tACQ[38]
XRES pulse length
VDD stable to wait-and-poll hold off
VDD stable to XRES assertion delay
SDAT high pulse time
“Key window” time after a VDD ramp
acquire event, based on 256 ILO clocks.
“Key window” time after an XRES event,
based on 8 ILO clocks
tXRESINI[38]
Conditions
–
–
–
–
–
–
–
3.6  VDD
3.0  VDD  3.6
1.71  VDD  3.0
Required to enter programming
mode when coming out of sleep
–
–
–
–
–
–
Min
1
1
40
40
0
–
–
–
–
–
300
Typ
–
–
–
–
–
–
–
–
–
–
–
Max
20
20
–
–
8
18
25
60
85
130
–
Units
ns
ns
ns
ns
MHz
ms
ms
ns
ns
ns
s
300
0.1
14.27
0.01
3.20
–
–
–
–
–
–
1
–
200
19.60
s
ms
ms
ms
ms
98
–
615
s
Note
38. Valid from 5 to 50 °C. See the spec, CY8C20X66, CY8C20X46, CY8C20X36, CY7C643XX, CY7C604XX, CY8CTST2XX, CY8CTMG2XX, CY8C20X67,
CY8C20X47, CY8C20X37, Programming Spec for more details.
Document Number: 001-69257 Rev. *I
Page 23 of 43
CY8C20xx7/S
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 29. AC Characteristics of the I2C SDA and SCL Pins
Symbol
Description
fSCL
tHD;STA
SCL clock frequency
Hold time (repeated) START condition. After this period, the first clock pulse is
generated
tLOW
LOW period of the SCL clock
HIGH Period of the SCL clock
tHIGH
Setup time for a repeated START condition
tSU;STA
tHD;DAT[39] Data hold time
Data setup time
tSU;DAT
Setup time for STOP condition
tSU;STO
tBUF
Bus free time between a STOP and START condition
Pulse width of spikes are suppressed by the input filter
tSP
Standard
Mode
Min
Max
0
100
4.0
–
4.7
4.0
4.7
20
250
4.0
4.7
–
–
–
–
3.45
–
–
–
–
Fast Mode
Min
0
0.6
Max
400
–
1.3
–
0.6
–
0.6
–
20
0.90
100[40]
–
0.6
–
1.3
–
0
50
Units
kHz
µs
µs
µs
µs
µs
ns
µs
µs
ns
Figure 11. Definition for Timing for Fast/Standard Mode on the I2C Bus
Notes
39. To wake up from sleep using I2C hardware address match event, I2C interface needs 20 ns hold time on SDA line with respect to falling edge of SCL. See the
CY8C20xx7 Silicon Errata document for more details.
40. A Fast-Mode I2C-bus device can be used in a standard mode I2C-bus system, but the requirement tSU;DAT  250 ns must then be met. This automatically be the
case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit
to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 001-69257 Rev. *I
Page 24 of 43
CY8C20xx7/S
Table 30. SPI Master AC Specifications
Min
Typ
Max
Units
FSCLK
Symbol
SCLK clock frequency
Description
VDD 2.4 V
VDD < 2.4 V
Conditions
–
–
–
–
6
3
MHz
MHz
DC
SCLK duty cycle
–
–
50
–
%
tSETUP
MISO to SCLK setup time
VDD  2.4 V
VDD < 2.4 V
60
100
–
–
–
–
ns
ns
tHOLD
SCLK to MISO hold time
–
40
–
–
ns
tOUT_VAL
SCLK to MOSI valid time
–
–
–
40
ns
tOUT_H
MOSI high time
–
40
–
–
ns
Figure 12. SPI Master Mode 0 and 2
SPI Master, modes 0 and 2
1/FSCLK
THIGH
TLOW
SCLK
(mode 0)
SCLK
(mode 2)
TSETUP
MISO
(input)
THOLD
LSB
MSB
TOUT_SU
TOUT_H
MOSI
(output)
Figure 13. SPI Master Mode 1 and 3
SPI Master, modes 1 and 3
1/FSCLK
THIGH
TLOW
SCLK
(mode 1)
SCLK
(mode 3)
TSETUP
MISO
(input)
THOLD
TOUT_SU
MOSI
(output)
Document Number: 001-69257 Rev. *I
LSB
MSB
TOUT_H
MSB
LSB
Page 25 of 43
CY8C20xx7/S
Table 31. SPI Slave AC Specifications
Symbol
FSCLK
tLOW
tHIGH
tSETUP
tHOLD
tSS_MISO
tSCLK_MISO
tSS_HIGH
tSS_CLK
tCLK_SS
Description
SCLK clock frequency
SCLK low time
SCLK high time
MOSI to SCLK setup time
SCLK to MOSI hold time
SS high to MISO valid
SCLK to MISO valid
SS high time
Time from SS low to first SCLK
Time from last SCLK to SS high
Conditions
Min
–
42
42
30
50
–
–
50
2/SCLK
2/SCLK
–
–
–
–
–
–
–
–
–
–
Typ
–
–
–
–
–
–
–
–
–
–
Max
4
–
–
–
–
153
125
–
–
–
Units
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
Figure 14. SPI Slave Mode 0 and 2
SPI Slave, modes 0 and 2
TSS_HIGH
TCLK_SS
TSS_CLK
/SS
1/FSCLK
THIGH
TLOW
SCLK
(mode 0)
SCLK
(mode 2)
TOUT_H
TSS_MISO
MISO
(output)
TSETUP
MOSI
(input)
THOLD
LSB
MSB
Figure 15. SPI Slave Mode 1 and 3
SPI Slave, modes 1 and 3
TSS_CLK
TCLK_SS
/SS
1/FSCLK
THIGH
TLOW
SCLK
(mode 1)
SCLK
(mode 3)
TOUT_H
TSCLK_MISO
TSS_MISO
MISO
(output)
MSB
TSETUP
MOSI
(input)
Document Number: 001-69257 Rev. *I
LSB
THOLD
MSB
LSB
Page 26 of 43
CY8C20xx7/S
Packaging Information
This section illustrates the packaging specifications for the CY8C20x37/47/67 PSoC device, along with the thermal impedances for
each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Figure 16. 16-pin (150 Mil) SOIC
51-85068 *E
Figure 17. 16-pin QFN No Center Pad (3 x 3 x 0.6 mm) Package Outline (Sawn)
001-09116 *H
Document Number: 001-69257 Rev. *I
Page 27 of 43
CY8C20xx7/S
Figure 18. 24-Pin (4 × 4 × 0.6 mm) QFN
001-13937 *E
Figure 19. 32-Pin (5 × 5 × 0.6 mm) QFN
001-42168 *E
Document Number: 001-69257 Rev. *I
Page 28 of 43
CY8C20xx7/S
Figure 20. 48-Pin (6 × 6 × 0.6 mm) QFN
001-57280 *E
Important Notes
■ For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
■ Pinned vias for thermal conduction are not required for the low power PSoC device.
Document Number: 001-69257 Rev. *I
Page 29 of 43
CY8C20xx7/S
Thermal Impedances
Table 32. Thermal Impedances per Package
Package
Typical JA [41]
16-Pin SOIC
95 C/W
16-Pin QFN
33 C/W
24-Pin
QFN[42]
21 C/W
32-Pin
QFN[42]
20 C/W
48-Pin
QFN[42]
18 C/W
30-Ball WLCSP
54 C/W
Capacitance on Crystal Pins
Table 33. Typical Package Capacitance on Crystal Pins
Package
Package Capacitance
32-Pin QFN
3.2 pF
48-Pin QFN
3.3 pF
Solder Reflow Peak Temperature
Table 34 shows the solder reflow temperature limits that must not be exceeded.
Table 34. Solder Reflow Peak Temperature
Package
Maximum Peak Temperature (TC)
Maximum Time above TC – 5 C
16-pin SOIC
260 C
30 seconds
16-pin QFN
260 C
30 seconds
24-pin QFN
260 C
30 seconds
32-pin QFN
260 C
30 seconds
48-pin QFN
260 C
30 seconds
30-ball WLCSP
260 C
30 seconds
Notes
41. TJ = TA + Power × JA.
42. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
Document Number: 001-69257 Rev. *I
Page 30 of 43
CY8C20xx7/S
Development Tool Selection
Software
PSoC Designer™
At the core of the PSoC development software suite is
PSoC Designer, used to generate PSoC firmware applications.
PSoC Designer is a Microsoft® Windows-based, integrated
development environment for the Programmable System-onChip (PSoC) devices. The PSoC Designer IDE and application
runs on Windows XP and Windows Vista.
This system provides design database management by project,
in-system programming support, and built-in support for thirdparty assemblers and C compilers. PSoC Designer also
supports C language compilers developed specifically for the
devices in the PSoC family. PSoC Designer is available free of
charge at
http://www.cypress.com/psocdesigner and includes a free C
compiler.
PSoC Designer Software Subsystems
You choose a base device to work with and then select different
onboard analog and digital components called user modules that
use the PSoC blocks. Examples of user modules are ADCs,
DACs, Amplifiers, and Filters. You configure the user modules
for your chosen application and connect them to each other and
to the proper pins. Then you generate your project. This
prepopulates your project with APIs and libraries that you can
use to program your application.
The tool also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic
reconfiguration allows for changing configurations at run time.
Code Generation Tools PSoC Designer supports multiple thirdparty C compilers and assemblers. The code generation tools
work seamlessly within the PSoC Designer interface and have
been tested with a full range of debugging tools. The choice is
yours.
Assemblers. The assemblers allow assembly code to be
merged seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and linked
with other software modules to get absolute addressing.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices. The
optimizing C compilers provide all the features of C tailored to
the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
PSoC Programmer
PSoC Programmer is flexible enough and is used on the bench
in development and is also suitable for factory programming.
PSoC Programmer works either as a standalone programming
application or operates directly from PSoC Designer. PSoC
Programmer software is compatible with both PSoC ICE Cube
in-circuit Emulator and PSoC MiniProg. PSoC programmer is
available free of cost at
http://www.cypress.com/psocprogrammer.
Document Number: 001-69257 Rev. *I
Development Kits
All development kits are sold at the Cypress Online Store.
Evaluation Tools
All evaluation tools are sold at the Cypress Online Store.
CY3210-MiniProg1
The CY3210-MiniProg1 kit allows you to program PSoC devices
through the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
through a provided USB 2.0 cable. The kit includes:
■
MiniProg programming unit
■
MiniEval socket programming and evaluation board
■
28-pin CY8C29466-24PXI PDIP PSoC device sample
■
28-pin CY8C27443-24PXI PDIP PSoC device sample
■
PSoC Designer software CD
■
Getting Started guide
■
USB 2.0 cable
CY3210-PSoCEval1
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
■
Evaluation board with LCD module
■
MiniProg programming unit
■
Two 28-pin CY8C29466-24PXI PDIP PSoC device samples
■
PSoC Designer software CD
■
Getting Started guide
■
USB 2.0 cable
Device Programmers
All device programmers are purchased from the Cypress Online
Store.
CY3216 Modular Programmer
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
■
Modular programmer base
■
Three programming module cards
■
MiniProg programming unit
■
PSoC Designer software CD
■
Getting Started guide
■
USB 2.0 cable
Page 31 of 43
CY8C20xx7/S
CY3207ISSP In-System Serial Programmer (ISSP)
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
Note CY3207ISSP needs special software and is not compatible
with PSoC Programmer. The kit includes:
■
CY3207 programmer unit
■
PSoC ISSP software CD
■
110 ~ 240 V power supply, Euro-Plug adapter
■
USB 2.0 cable
Accessories (Emulation and Programming)
Table 35. Emulation and Programming Accessories
Part Number
Pin Package
Flex-Pod Kit[43]
Foot Kit[44]
Adapter[45]
CY8C20237-24LKXI
16 QFN
CY3250-20246QFN
CY3250-20246QFN-POD
See note 42
CY8C20247-24LKXI
16 QFN
CY3250-20246QFN
CY3250-20246QFN-POD
See note 45
CY8C20337-24LQXI
24 QFN
CY3250-20346QFN
CY3250-20346QFN-POD
See note 42
CY8C20347-24LQXI
24 QFN
CY3250-20346QFN
CY3250-20346QFN-POD
See note 45
CY8C20437-24LQXI
32 QFN
CY3250-20466QFN
CY3250-20466QFN-POD
See note 42
CY8C20447-24LQXI
32 QFN
CY3250-20466QFN
CY3250-20466QFN-POD
See note 45
CY8C20467-24LQXI
32 QFN
CY3250-20466QFN
CY3250-20466QFN-POD
See note 45
CY8C20637-24LQXI
48 QFN
CY3250-20666QFN
CY3250-20666QFN-POD
See note 45
CY8C20647-24LQXI
48 QFN
CY3250-20666QFN
CY3250-20666QFN-POD
See note 45
CY8C20667-24LQXI
48 QFN
CY3250-20666QFN
CY3250-20666QFN-POD
See note 45
Third Party Tools
Several tools have been specially designed by the following third-party vendors to accompany PSoC devices during development and
production. Specific details for each of these tools can be found at http://www.cypress.com under Documentation > Evaluation Boards.
Build a PSoC Emulator into Your Board
For details on how to emulate your circuit before going to volume production using an on-chip debug (OCD) non-production PSoC
device, see the Application Note Debugging - Build a PSoC Emulator into Your Board – AN2323.
Notes
43. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
44. Foot kit includes surface mount feet that can be soldered to the target PCB.
45. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters can be found at
http://www.emulation.com.
Document Number: 001-69257 Rev. *I
Page 32 of 43
CY8C20xx7/S
Ordering Information
The following table lists the CY8C20x37/47/67/S PSoC devices' key package features and ordering codes.
Table 36. PSoC Device Key Features and Ordering Information
Ordering Code
Package
Flash SRAM CapSense Digital I/O
Analog XRES ADC
(Bytes) (Bytes) Sensors
Pins
Inputs [46] Pin
CY8C20237-24SXI
16-pin SOIC
8K
1K
10
13
13
Yes
Yes
CY8C20247/S-24SXI
16-pin SOIC
16 K
2K
10
13
13
Yes
Yes
CY8C20247S-24SXI
16-pin SOIC
16 K
2K
10
13
13
Yes
Yes
CY8C20237-24LKXI
16-pin QFN
8K
1K
10
13
13
Yes
Yes
CY8C20237-24LKXIT
16-pin QFN (Tape and Reel)
8K
1K
10
13
13
Yes
Yes
CY8C20247/S-24LKXI
16-pin QFN
16 K
2K
10
13
13
Yes
Yes
CY8C20247/S-24LKXIT
16-pin QFN (Tape and Reel)
16 K
2K
10
13
13
Yes
Yes
CY8C20247S-24LKXI
16-pin QFN
16 K
2K
10
13
13
Yes
Yes
CY8C20247S-24LKXIT
16-pin QFN (Tape and Reel)
16 K
2K
10
13
13
Yes
Yes
CY8C20337-24LQXI
24-pin QFN
8K
1K
16
19
19
Yes
Yes
CY8C20337-24LQXIT
24-pin QFN (Tape and Reel)
8K
1K
16
19
19
Yes
Yes
CY8C20347-24LQXI
24-pin QFN
16 K
2K
16
19
19
Yes
Yes
CY8C20347-24LQXIT
24-pin QFN (Tape and Reel)
16 K
2K
16
19
19
Yes
Yes
CY8C20347S-24LQXI
24-pin QFN
16 K
2K
16
19
19
Yes
Yes
CY8C20347S-24LQXIT
24-pin QFN (Tape and Reel)
16 K
2K
16
19
19
Yes
Yes
CY8C20437-24LQXI
32-pin QFN
8K
1K
25
28
28
Yes
Yes
CY8C20437-24LQXIT
32-pin QFN (Tape and Reel)
8K
1K
25
28
28
Yes
Yes
CY8C20447-24LQXI
32-pin QFN
16 K
2K
25
28
28
Yes
Yes
CY8C20447-24LQXIT
32-pin QFN (Tape and Reel)
16 K
2K
25
28
28
Yes
Yes
CY8C20447S-24LQXI
32-pin QFN
16 K
2K
25
28
28
Yes
Yes
CY8C20447S-24LQXIT
32-pin QFN (Tape and Reel)
16 K
2K
25
28
28
Yes
Yes
CY8C20467-24LQXI
32-pin QFN
32 K
2K
25
28
28
Yes
Yes
CY8C20467-24LQXIT
32-pin QFN (Tape and Reel)
32 K
2K
25
28
28
Yes
Yes
CY8C20467S-24LQXI
32-pin QFN
32 K
2K
25
28
28
Yes
Yes
CY8C20467S-24LQXIT
32-pin QFN (Tape and Reel)
32 K
2K
25
28
28
Yes
Yes
CY8C20637-24LQXI
48-pin QFN
8K
1K
31
34
34
Yes
Yes
CY8C20637-24LQXIT
48-pin QFN (Tape and Reel)
8K
1K
31
34
34
Yes
Yes
CY8C20647-24LQXI
48-pin QFN
16 K
2K
31
34
34
Yes
Yes
CY8C20647-24LQXIT
48-pin QFN (Tape and Reel)
16 K
2K
31
34
34
Yes
Yes
CY8C20647S-24LQXI
48-pin QFN
16 K
2K
31
34
34
Yes
Yes
CY8C20647S-24LQXIT
48-pin QFN (Tape and Reel)
16 K
2K
31
34
34
Yes
Yes
CY8C20667-24LQXI
48-pin QFN
32 K
2K
31
34
34
Yes
Yes
CY8C20667-24LQXIT
48-pin QFN (Tape and Reel)
32 K
2K
31
34
34
Yes
Yes
CY8C20667S-24LQXI
48-pin QFN
32 K
2K
31
34
34
Yes
Yes
CY8C20667S-24LQXIT
48-pin QFN (Tape and Reel)
32 K
2K
31
34
34
Yes
Yes
Note
46. Dual-function
Digital I/O Pins also connect to the common analog mux.
Document Number: 001-69257 Rev. *I
Page 33 of 43
CY8C20xx7/S
Table 36. PSoC Device Key Features and Ordering Information (continued)
Ordering Code
Flash SRAM CapSense Digital I/O
Analog XRES ADC
(Bytes) (Bytes) Sensors
Pins
Inputs [46] Pin
Package
CY8C20747-24FDXC
30-pin WLCSP
16 K
1K
24
27
27
Yes
Yes
CY8C20747-24FDXCT
30-pin WLCSP (Tape and Reel)
16 K
1K
24
27
27
Yes
Yes
CY8C20767-24FDXC
30-pin WLCSP
32 K
2K
24
27
27
Yes
Yes
CY8C20767-24FDXCT
30-pin WLCSP (Tape and Reel)
32 K
2K
24
27
27
Yes
Yes
Ordering Code Definitions
CY 8 C 20 XX7 X - 24 XX X X (T)
Tape and reel
Temperature range: X = C or I
C = Commercial; I = Industrial
Pb-free
Package Types: XX = S, LK, LQ, or FD
S = 16-pin SOIC
LK = 16-pin QFN (no center pad)
LQ = 24-pin QFN, 32-pin QFN, 48-pin QFN
FD = 30-ball WLCSP
Speed grade = 24 MHz
S = SmartSense™ Auto-tuning Enabled
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = PSoC
Company ID: CY = Cypress
Document Number: 001-69257 Rev. *I
Page 34 of 43
CY8C20xx7/S
Acronyms
Reference Documents
The following table lists the acronyms that are used in this
document.
■
Technical reference manual for CY20xx7 devices
■
In-system Serial Programming (ISSP) protocol for 20xx7
■
Host Sourced Serial Programming for 20xx7 devices
Table 37. Acronyms Used in this Document
Acronym
AC
ADC
API
CMOS
CPU
DAC
DC
ESD
FSR
GPIO
I 2C
ICE
ILO
IMO
I/O
ISSP
LCD
LDO
LED
LPC
LSB
LVD
MCU
MIPS
MISO
MOSI
MSB
OCD
PCB
POR
PSRR
PWRSYS
PSoC
QFN
SCLK
SDA
SDATA
SOIC
SPI
SRAM
SS
USB
WLCSP
Description
alternating current
analog-to-digital converter
application programming interface
complementary metal oxide semiconductor
central processing unit
digital-to-analog converter
direct current
electrostatic discharge
full scale range
general purpose input/output
inter-integrated circuit
in-circuit emulator
internal low speed oscillator
internal main oscillator
input/output
in-system serial programming
liquid crystal display
low dropout (regulator)
light-emitting diode
low power comparator
least-significant bit
low voltage detect
micro-controller unit
million instructions per second
master in slave out
master out slave in
most-significant bit
on-chip debug
printed circuit board
power on reset
power supply rejection ratio
power system
programmable system-on-chip
quad flat no-lead
serial I2C clock
serial I2C data
serial ISSP data
small outline integrated circuit
serial peripheral interface
static random access memory
slave select
universal serial bus
wafer level chip scale package
Document Number: 001-69257 Rev. *I
Document Conventions
Units of Measure
Table 38 lists all the abbreviations used to measure the PSoC
devices.
Table 38. Units of Measure
Symbol
°C
dB
kHz
ksps
k
MHz
A
s
mA
mm
ms
mV
nA
ns

%
pF
V
W
Unit of Measure
degree Celsius
decibel
kilohertz
kilo samples per second
kilohm
megahertz
microampere
microsecond
milliampere
millimeter
millisecond
millivolt
nanoampere
nanosecond
ohm
percent
picofarad
volt
watt
Page 35 of 43
CY8C20xx7/S
Numeric Naming
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’).
Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended
lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
Glossary
Crosspoint connection
Connection between any GPIO combination via analog multiplexer bus.
Differential non linearity
Ideally, any two adjacent digital codes correspond to output analog voltages that are exactly
one LSB apart. Differential non-linearity is a measure of the worst case deviation from the
ideal 1 LSB step.
Hold time
Hold time is the time following a clock event during which the data input to a latch or flipflop must remain stable in order to guarantee that the latched data is correct.
I2C
It is a serial multi-master bus used to connect low speed peripherals to MCU.
Integral nonlinearity
It is a term describing the maximum deviation between the ideal output of a DAC/ADC and
the actual output level.
Latch-up current
Current at which the latch-up test is conducted according to JESD78 standard (at 125
degree Celsius)
Power supply rejection ratio (PSRR)
The PSRR is defined as the ratio of the change in supply voltage to the corresponding
change in output voltage of the device.
Scan
The conversion of all sensor capacitances to digital values.
Setup time
Period required to prepare a device, machine, process, or system for it to be ready to
function.
Signal-to-noise ratio
The ratio between a capacitive finger signal and system noise.
SPI
Serial peripheral interface is a synchronous serial data link standard.
Document Number: 001-69257 Rev. *I
Page 36 of 43
CY8C20xx7/S
Appendix: Silicon Errata for the CY8C20xx7/S Family
This section describes the errata for the CY8C20xx7/S family. Details include errata trigger conditions, scope of impact, available
workarounds, and silicon revision applicability.
Contact your local Cypress Sales Representative if you have questions.
CY8C20xx7/S Qualification Status
Product Status: Production released.
CY8C20xx7/S Errata Summary
The following Errata items apply to the CY8C20xx7/S datasheet 001-69257.
1. DoubleTimer0 ISR
■ Problem Definition
When programmable timer 0 is used in “one-shot” mode by setting bit 1 of register 0,B0h (PT0_CFG), and the timer interrupt
is used to wake the device from sleep, the interrupt service routine (ISR) may be executed twice.
■
Parameters Affected
No datasheet parameters are affected.
■
Trigger Condition(S)
Triggered by enabling one-shot mode in the timer, and using the timer to wake from sleep mode.
■
Scope of Impact
The ISR may be executed twice.
■
Workaround
In the ISR, firmware should clear the one-shot bit with a statement such as “and reg[B0h], FDh”
■
Fix Status
Will not be fixed
■
Changes
None
2. Missed GPIO Interrupt
■
Problem Definition
When in sleep mode, if a GPIO interrupt happens simultaneously with a Timer0 or Sleep Timer interrupt, the GPIO interrupt
may be missed, and the corresponding GPIO ISR not run.
■
Parameters Affected
No datasheet parameters are affected.
■
Trigger Condition(S)
Triggered by enabling sleep mode, then having GPIO interrupt occur simultaneously with a Timer 0 or Sleep Timer interrupt.
■
Scope of Impact
The GPIO interrupt service routine will not be run.
■
Workaround
The system should be architected such that a missed GPIO interrupt may be detected. For example, if a GPIO is used to wake
the system to perform some function, the system should detect if the function is not performed, and re-issue the GPIO interrupt.
Alternatively, if a GPIO interrupt is required to wake the system, then firmware should disable the Sleep Timer and Timer0.
Alternatively, the ISR’s for Sleep Timer and Timer0 should manually check the state of the GPIO to determine if the host system
has attempted to generate a GPIO interrupt.
■
Fix Status
Will not be fixed
■
Changes
None
Document Number: 001-69257 Rev. *I
Page 37 of 43
CY8C20xx7/S
3. Missed Interrupt During Transition to Sleep
■
Problem Definition
If an interrupt is posted a short time (within 2.5 CPU cycles) before firmware commands the device to sleep, the interrupt will
be missed.
■
Parameters Affected
No datasheet parameters are affected.
■
Trigger Condition(S)
Triggered by enabling sleep mode just prior to an interrupt.
■
Scope of Impact
The relevant interrupt service routine will not be run.
■
Workaround
None.
■
Fix Status
Will not be fixed
■
Changes
None
4. Wakeup from sleep with analog interrupt
■
Problem Definition
Device wakes up from sleep when an analog interrupt is trigger
■
Parameters Affected
No datasheet parameters are affected.
■
Trigger Condition(S)
Triggered by enabling analog interrupt during sleep mode when device operating temperature is 50 °C or above
■
Scope of Impact
Device unexpectedly wakes up from sleep
■
Workaround
Disable the analog interrupt before entering sleep and turn it back on upon wake-up.
■
Fix Status
Will not be fixed
■
Changes
None
Document Number: 001-69257 Rev. *I
Page 38 of 43
CY8C20xx7/S
5. Wake-up from Sleep with Hardware I2C Address match on Pins P1[0], P1[1]
■
Problem Definition
I2C interface needs 20 ns hold time on SDA line with respect to falling edge of SCL, to wake-up from sleep using I2C hardware
address match event.
■
Parameters Affected
tHD;DAT increased to 20 ns from 0 ns
■
Trigger Condition(S)
This is an issue only when all these three conditions are met:
1) P1.0 and P1.1 are used as I2C pins,
2) Wakeup from sleep with hardware address match feature is enabled, and
3) I2C master does not provide 20 ns hold time on SDA with respect to falling edge of SCL.
■
Scope of Impact
These trigger conditions cause the device to never wake-up from sleep based on I2C address match event
■
Workaround
For a design that meets all of the trigger conditions, the following suggested circuit has to be implemented as a work-around.
The R and C values proposed are 100 ohm and 200 pF respectively.
■
Fix Status
Will not be fixed
■
Changes
None
Document Number: 001-69257 Rev. *I
Page 39 of 43
CY8C20xx7/S
6. I2C Port Pin Pull-up Supply Voltage
■
Problem Definition
Pull-up resistor on I2C interface cannot be connected to a supply voltage that is greater than 0.7 V of CY8C20xx7/S VDD.
■
Parameters Affected
None.
■
Trigger Condition(S)
This problem occurs only when the I2C master is powered at a higher voltage than CY8C20xx7/S.
■
Scope of Impact
This trigger condition will corrupt the I2C communication between the I2C host and the CY8C20xx7/S CapSense controller.
■
Workaround
I2C master cannot be powered at a supply voltage that is greater than 0.7 V compared to CY8C20xx7/S supply voltage.
■
Fix Status
Will not be fixed
■
Changes
None
7. Port1 Pin Voltage
■
Problem Definition
Pull-up resistor on port1 pins cannot be connected to a voltage that is greater than 0.7 V higher than CY8C20xx7/S VDD.
■
Parameters Affected
None.
■
Trigger Condition(S)
This problem occurs only when port1 pins are at voltage 0.7 V higher than VDD of CY8C20xx7/S.
■
Scope of Impact
This trigger condition will not allow CY8C20xx7/S to drive the output signal on port1 pins, input path is unaffected by this
condition.
■
Workaround
Port1 should not be connected to a higher voltage than VDD of CY8C20xx7/S
■
Fix Status
Will not be fixed
■
Changes
None
Document Number: 001-69257 Rev. *I
Page 40 of 43
CY8C20xx7/S
Document History Page
Document Title: CY8C20xx7/S, 1.8 V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders, Proximity
Sensors
Document Number: 001-69257
Revision
ECN
Orig. of
Change
Submission
Date
Description of Change
**
3276782
DST
06/27/2011
New silicon and document
*A
3327230
DST
07/28/2011
Changed 48-pin dimensions to 6 × 6 × 0.6 mm QFN
Updated pins name in Table 3 on page 9 and removed USB column and
updated dimensions for 48-pin parts in Table 36 on page 33
Updated Figure 20 on page 29
Removed ICE and Debugger sections.
Removed CY3215 Development Kit and CY3280-20x66 UCC sections.
Updated Ordering Information.
*B
3403111
YVA
10/12/2011
Moved status from Advance to Preliminary.
Updated Ordering Information
Removed the row named “48-Pin (6 × 6 mm) QFN (OCD)”.
Changed all 48-pin ordering code column from CY8C20XXX-24LTxx to
CY8C20XXX-24LQxx.
Updated 16-pin SOIC and 16-pin QFN package drawings.
*C
3473317
DST
12/23/2011
Updated Features.
Updated Pinouts (Removed PSoC in captions of Figure 2, Figure 3, Figure 4,
Figure 6, and Figure 7).
Updated DC Chip-Level Specifications under Electrical Specifications
(Updated typical value of IDD24 parameter from 3.32 mA to 2.88 mA, updated
typical value of IDD12 parameter from 1.86 mA to 1.71 mA, updated typical value
of IDD6 parameter from 1.13 mA to 1.16 mA, updated maximum value of ISB0
parameter from 0.50 µA to 1.1 µA, added ISBI2C parameter and its details).
Updated DC GPIO Specifications under Electrical Specifications (Added the
parameters namely VILLVT3.3, VIHLVT3.3, VILLVT5.5, VIHLVT5.5 and their details in
Table 10, added the parameters namely VILLVT2.5, VIHLVT2.5 and their details in
Table 11).
Added the following sections namely DC I2C Specifications, Shield Driver DC
Specifications, and DC IDAC Specifications under Electrical Specifications.
Updated AC Chip-Level Specifications (Added the parameter namely tJIT_IMO
and its details).
Updated Ordering Information (updated Table 36).
*D
3510277
YVA/DST
02/16/2012
Added CY8C20x37/37S/47/47S/67/67S part numbers and changed title to “1.8
V CapSense® Controller with SmartSense™ Auto-tuning
31 Buttons, 6 Sliders”
Updated Features.
Modified comparator blocks in Logic Block Diagram.
Replaced SmartSense with SmartSense auto-tuning.
Added CY8C20xx7S part numbers in Pin Definitions.
Added footnote for Table 20.
Updated Table 21 and Table 22 and added Table 23.
Updated F32K1 min value.
Updated data hold time min values.
Updated CY8C206x7 part information in Table 35.
Updated Ordering Information.
*E
3539259
DST
03/01/2012
Changed Datasheet status from Preliminary to Final.
Updated all Pinouts to include Driven Shield Output (optional) information.
Updated Min value for VLPC Table 15.
Updated Offset and Input range in Table 16.
Document Number: 001-69257 Rev. *I
Page 41 of 43
CY8C20xx7/S
Document History Page (continued)
Document Title: CY8C20xx7/S, 1.8 V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders, Proximity
Sensors
Document Number: 001-69257
Revision
ECN
Orig. of
Change
Submission
Date
Description of Change
*F
3645807
DST/BVI
07/03/2012
Updated FSCLK parameter in the Table 31, “SPI Slave AC Specifications,” on
page 26
Changed tOUT_HIGH to tOUT_H in Table 30, “SPI Master AC Specifications,” on
page 25
Updated Features section, “Programmable pin configurations” bullet:
■ Included the following sub-bullet point 5 mA source current on port 0 and 1 and 1 mA on port 2,3 and 4
■ Changed the bullet point “High sink current of 25 mA for each GPIO” to “High
sink current of 25 mA for each GPIO. Total 120 mA maximum sink current
per chip”
®
■ Added “QuietZone™ Controller” bullet and updated “Low power CapSense
block with SmartSense™ auto-tuning” bullet.
*G
3800055
DST
11/23/2012
Changed document title.
Part named changed from CY8C20xx7 to CY8C20xx7/S
Table 20: Update to VIHI2C to match Item #6 in K2 Si Errata document (00175370)
Updated package diagrams:
51-85068 to *E
001-09116 to *G
001-13937 to *E
001-42168 to *E
001-57280 to *E
*H
3881332
SRLI
02/04/2013
Updated Features:
Added Note 1 and referred the same note in “24 Sensing Inputs – 30-pin
WLCSP”.
*I
3993458
DST
05/07/2013
Updated Electrical Specifications (Updated DC GPIO Specifications (Updated
heading of third column as “Port 0/1 per I/O (max)” for Table 13)).
Updated package diagrams 001-13937 to *D and 001-57280 to *C revisions.
Updated Packaging Information:
spec 001-09116 – Changed revision from *G to *H (Figure 17).
Added Appendix: Silicon Errata for the CY8C20xx7/S Family.
Document Number: 001-69257 Rev. *I
Page 42 of 43
CY8C20xx7/S
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
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closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2011-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-69257 Rev. *I
Revised May 7, 2013
All products and company names mentioned in this document may be the trademarks of their respective holders.
Page 43 of 43
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