HSMC HSB857J Pnp epitaxial planar transistor Datasheet

HI-SINCERITY
Spec. No. : HJ200101
Issued Date : 2001.09.01
Revised Date : 2005.07.14
Page No. : 1/4
MICROELECTRONICS CORP.
HSB857J
PNP EPITAXIAL PLANAR TRANSISTOR
Description
Low frequency power amplifier.
TO-252
Absolute Maximum Ratings (TA=25°C)
• Maximum Temperatures
Storage Temperature ............................................................................................................................. -50~+150 °C
Junction Temperature ................................................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (TC=25°C) ..................................................................................................................... 20 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage......................................................................................................................... -60 V
BVCEO Collector to Emitter Voltage..................................................................................................................... -50 V
BVEBO Emitter to Base Voltage............................................................................................................................. -5 V
IC Collector Current .............................................................................................................................................. -3 A
IC Collector Current (IC Peak)............................................................................................................................ -4.5 A
Electrical Characteristics (TA=25°C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
-60
-
-
V
IC=-50uA
BVCEO
-50
-
-
V
IC=-1mA
BVEBO
-5
-
-
V
IE=-50uA
ICBO
-
-
-1
uA
VCB=-50V
ICEO
-
-
-1
uA
VCE=-40V
IEBO
-
-
-1
uA
VEB=-4V
*VCE(sat)
-
-0.3
-1
V
IC=-2A, IB=-0.2A
*VBE(sat)
-
-
-1.5
V
IC=-2A, IB=-0.2A
*hFE
170
-
400
fT
-
15
-
IC=-500mA, VCE=-3V
MHz
VCE=-5V, IC=-500mA, f=100MHz
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HSB857J
HSMC Product Specification
HI-SINCERITY
Spec. No. : HJ200101
Issued Date : 2001.09.01
Revised Date : 2005.07.14
Page No. : 2/4
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
10000
Saturation Volltage (mV)
hFE @ VCE=4V
hFE
hFE @ VCE=3V
100
VBE(s at) @ IC=10IB
1000
100
VCE(sat) @ IC=10IB
10
10
1
10
100
1000
1
10000
Collector Current-IC (mA)
10
100
1000
10000
Collector Current-IC (mA)
Cutoff Frequency & Collector Current
Capacitance & Reverse-Biased Voltage
1000
Capacitance (pF)
Cutoff Frequency (MHZ)
1000
100
fT @ VCE=5V
Cob
100
10
1
10
100
Collector Current-IC (mA)
1
10
100
Reverse Biased Voltage (V)
Safe Operating Area
Collector Current (A)
10
1
PT=1ms
PT=100ms
PT=1s
0.1
1
10
100
1000
Forward Voltage-VCE (V)
HSB857J
HSMC Product Specification
HI-SINCERITY
Spec. No. : HJ200101
Issued Date : 2001.09.01
Revised Date : 2005.07.14
Page No. : 3/4
MICROELECTRONICS CORP.
TO-252 Dimension
A
DIM
A
C
F
G
H
L
M
N
a1
a2
a5
Marking:
M
a1
Pb Free Mark
Pb-Free: " . " (Note)
H
Normal: None
F
J
SB 8 5 7
C
Date Code
Control Code
Note: Green label is used for pb-free packing
G
Pin Style: 1.Base 2.Collector 3.Emitter
2
1
N
3
H
a5
Max.
6.80
5.50
1.70
6.25
3.00
0.90
2.40
1.50
0.65
*2.30
1.05
*: Typical, Unit: mm
a1
a2
L
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
Min.
6.35
4.80
1.30
5.40
2.20
0.40
2.20
0.90
0.40
0.65
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
M
F
Pb Free Mark
Pb-Free: " . " (Note)
H
Normal: None
a1
y1
E
y1
Pin Style: 1.Base 2.Collector 3.Emitter
y1
H
N
L
a2
a1
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
O
a2
y2
Control Code
Note: Green label is used for pb-free packing
GI
J
J
SB 8 5 7
Date Code
K
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
a1
a2
y1
y2
Marking:
A
B
C
D
a1
y2
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
Min.
6.40
5.04
0.40
0.50
5.90
2.50
9.20
0.60
0.66
2.20
0.70
0.82
0.40
2.10
-
Max.
6.80
6.00
5.64
*4.34
0.80
0.90
6.30
2.90
9.80
1.00
0.96
0.86
2.40
1.10
1.22
0.60
2.50
5o
3o
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSB857J
HSMC Product Specification
HI-SINCERITY
Spec. No. : HJ200101
Issued Date : 2001.09.01
Revised Date : 2005.07.14
Page No. : 4/4
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
<3 C/sec
<3oC/sec
- Temperature Min (Tsmin)
100oC
150oC
- Temperature Max (Tsmax)
150oC
200oC
60~120 sec
60~180 sec
<3oC/sec
<3oC/sec
183oC
217oC
Average ramp-up rate (TL to TP)
o
Preheat
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
60~150 sec
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
o
o
60~150 sec
240 C +0/-5 C
260oC +0/-5oC
10~30 sec
20~40 sec
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
Peak temperature
Dipping time
245 C ±5 C
5sec ±1sec
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
HSB857J
o
o
o
o
260 C +0/-5 C
5sec ±1sec
HSMC Product Specification
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