ONSEMI 2N5195

ON Semiconductor 2N5194
2N5195*
Silicon PNP Power Transistors
. . . for use in power amplifier and switching circuits, — excellent
safe area limits. Complement to NPN 2N5191, 2N5192
*ON Semiconductor Preferred Device
4 AMPERE
POWER TRANSISTORS
SILICON PNP
60–80 VOLTS
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*MAXIMUM RATINGS
Rating
Symbol
2N5194
2N5195
Unit
VCEO
60
80
Vdc
Collector–Base Voltage
VCB
60
80
Vdc
Emitter–Base Voltage
VEB
5.0
Vdc
Collector Current
IC
4.0
Adc
Base Current
IB
1.0
Adc
Total Power Dissipation @ TC = 25C
Derate above 25C
PD
40
320
Watts
mW/C
TJ, Tstg
–65 to +150
C/W
Symbol
Max
Unit
θJC
3.12
C/W
Collector–Emitter Voltage
Operating and Storage Junction
Temperature Range
3 2
1
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
CASE 77–09
TO–225AA TYPE
*ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)
Characteristic
Symbol
Min
Max
60
80
—
—
—
—
1.0
1.0
—
—
—
—
0.1
0.1
2.0
2.0
—
—
0.1
0.1
—
1.0
Unit
OFF CHARACTERISTICS
Collector–Emitter Sustaining Voltage (1)
(IC = 0.1 Adc, IB = 0)
VCEO(sus)
2N5194
2N5195
Collector Cutoff Current
(VCE = 60 Vdc, IB = 0)
(VCE = 80 Vdc, IB = 0)
2N5194
2N5195
Collector Cutoff Current
(VCE = 60 Vdc, VBE(off) = 1.5 Vdc)
(VCE = 80 Vdc, VBE(off) = 1.5 Vdc)
(VCE = 60 Vdc, VBE(off) = 1.5 Vdc, TC = 125C)
(VCE = 80 Vdc, VBE(off) = 1.5 Vdc, TC = 125C)
2N5194
2N5195
2N5194
2N5195
Collector Cutoff Current
(VCB = 60 Vdc, IE = 0)
(VCB = 80 Vdc, IE = 0)
2N5194
2N5195
Vdc
ICEO
mAdc
ICEX
mAdc
ICBO
Emitter Cutoff Current
(VBE = 5.0 Vdc, IC = 0)
IEBO
mAdc
mAdc
*Indicates JEDEC Registered Data.
(1) Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%.
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
 Semiconductor Components Industries, LLC, 2002
April, 2002 – Rev. 10
1
Publication Order Number:
2N5194/D
2N5194 2N5195
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*ELECTRICAL CHARACTERISTICS — continued (TC = 25C unless otherwise noted)
Characteristic
Symbol
Min
Max
25
20
10
7.0
100
80
—
—
—
—
0.6
1.4
Unit
ON CHARACTERISTICS
DC Current Gain (2)
(IC = 1.5 Adc, VCE = 2.0 Vdc)
hFE
—
2N5194
2N5195
2N5194
2N5195
(IC = 4.0 Adc, VCE = 2.0 Vdc)
Collector–Emitter Saturation Voltage (2)
(IC = 1.5 Adc, IB = 0.15 Adc)
(IC = 4.0 Adc, IB = 1.0 Adc)
VCE(sat)
Vdc
Base–Emitter On Voltage (2)
(IC = 1.5 Adc, VCE = 2.0 Vdc)
VBE(on)
—
1.2
Vdc
fT
2.0
—
MHz
DYNAMIC CHARACTERISTICS
Current–Gain — Bandwidth Product
(IC = 1.0 Adc, VCE = 10 Vdc, f = 1.0 MHz)
*Indicates JEDEC Registered Data.
(2) Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%.
hFE , DC CURRENT GAIN (NORMALIZED)
10
7.0
5.0
TJ = 150°C
VCE = 2.0 V
VCE = 10 V
3.0
2.0
1.0
0.7
0.5
25°C
-55°C
0.3
0.2
0.1
0.004
0.007 0.01
0.02
0.03
0.05
0.1
0.2
0.3
IC, COLLECTOR CURRENT (AMP)
0.5
1.0
2.0
3.0 4.0
Figure 1. DC Current Gain
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
2.0
1.6
1.2
IC = 10 mA
100 mA
1.0 A
3.0 A
0.8
TJ = 25°C
0.4
0
0.05 0.07 0.1
0.2
0.3
0.5 0.7
1.0
2.0
3.0
5.0 7.0 10
IB, BASE CURRENT (mA)
20
Figure 2. Collector Saturation Region
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2
30
50
70
100
200
300
500
2.0
TJ = 25°C
1.2
0.8
VBE(sat) @ IC/IB = 10
VBE @ VCE = 2.0 V
0.4
VCE(sat) @ IC/IB = 10
0
0.005 0.01 0.02 0.03 0.05 0.1
0.2 0.3 0.5
103
1.0
2.0 3.0 4.0
IC, COLLECTOR CURRENT (A)
µ
10-1
REVERSE
FORWARD
25°C
10-2
+1.0
+0.5
*θVC for VCE(sat)
0
-0.5
-1.0
θVB for VBE
-1.5
-2.0
-2.5
0.005 0.01 0.020.03 0.05
10-3
+0.4 +0.3 +0.2 +0.1
ICES
0
-0.1 -0.2
-0.3
-0.4 -0.5 -0.6
VBE, BASE-EMITTER VOLTAGE (VOLTS)
TURN-ON PULSE
VCC
Vin
t1
t2
Vin
APPROX
-11 V
1.0
2.0 3.0 4.0
VCE = 30 V
106
IC = 10 x ICES
105
IC = 2 x ICES
104
(TYPICAL ICES VALUES
OBTAINED FROM FIGURE 5)
103
102
20
t3
TURN-OFF PULSE
60
80
100
120
140
160
500
TJ = 25°C
SCOPE
300
Cjd<<Ceb
APPROX
+9.0 V
40
Figure 6. Effects of Base–Emitter Resistance
RC
RB
IC ≈ ICES
TJ, JUNCTION TEMPERATURE (°C)
CAPACITANCE (pF)
APPROX
-11 V
0.2 0.3 0.5
107
Figure 5. Collector Cut–Off Region
VBE(off)
Vin 0
0.1
Figure 4. Temperature Coefficients
100°C
100
+1.5
IC, COLLECTOR CURRENT (AMP)
TJ = 150°C
101
*APPLIES FOR IC/IB ≤ hFE @ VCE
TJ = -65°C to +150°C
+2.0
Figure 3. “On” Voltage
VCE = 30 Vdc
102
+2.5
IC, COLLECTOR CURRENT (AMP)
RBE , EXTERNAL BASE-EMITTER RESISTANCE (OHMS)
VOLTAGE (VOLTS)
1.6
θV, TEMPERATURE COEFFICIENTS (mV/°C)
2N5194 2N5195
+4.0 V
RB AND RC VARIED
TO OBTAIN DESIRED
CURRENT LEVELS
200
Ceb
100
Ccb
70
t1 ≤ 7.0 ns
100 < t2 < 500 µs
t3 < 15 ns
DUTY CYCLE ≈ 2.0%
50
0.1
0.2 0.3
0.5
1.0
2.0 3.0
5.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Switching Time Equivalent Test Circuit
Figure 8. Capacitance
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3
10
20 30 40
2N5194 2N5195
2.0
2.0
IC/IB = 10
TJ = 25°C
1.0
0.7
0.5
tr @ VCC = 30 V
t, TIME (s)
µ
t, TIME (s)
µ
0.7
0.5
0.3
0.2
tr @ VCC = 10 V
0.1
0.07
0.05
2.0
tf @ VCC = 30 V
0.3
0.2
0.1
0.07
0.05
td @ VBE(off) = 2.0 V
0.03
0.02
0.2 0.3
0.5 0.7 1.0
0.05 0.07 0.1
IC, COLLECTOR CURRENT (AMP)
IB1 = IB2
IC/IB = 10
ts′ = ts - 1/8 tf
TJ = 25°C
ts′
1.0
tf @ VCC = 10 V
0.03
0.02
0.05 0.07 0.1
3.0 4.0
Figure 9. Turn–On Time
0.5 0.7 1.0
0.2 0.3
IC, COLLECTOR CURRENT (AMP)
2.0 3.0 4.0
Figure 10. Turn–Off Time
Note 1:
10
IC, COLLECTOR CURRENT (AMP)
5.0
100 µs
TJ = 150°C
2.0
1.0
There are two limitations on the power handling ability of
a transistor; average junction temperature and second
breakdown. Safe operating area curves indicate I C – V CE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 11 is based on TJ(pk) = 150C. T C is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T J(pk)
150C. At high–case temperatures, thermal limitations
will reduce the power that can be handled to values less than
the limitations imposed by second breakdown.
1.0 ms
5.0 ms
dc
SECONDARY BREAKDOWN LIMIT
THERMAL LIMIT @ TC = 25°C
BONDING WIRE LIMIT
CURVES APPLY BELOW RATED VCEO
0.5
0.2
2N5194
0.1
1.0
2N5195
2.0
5.0
10
20
50
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
100
r(t), EFFECTIVE TRANSIENT
THERMAL RESISTANCE (NORMALIZED)
Figure 11. Rating and Thermal Data
Active–Region Safe Operating Area
1.0
0.7
0.5
D = 0.5
0.3
0.2
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.01
θJC(max) = 3.12°C/W
0.1
0.05
0.02
SINGLE PULSE
0.02 0.03
0.01
0.05
0.1
0.2 0.3
0.5
1.0
2.0 3.0 5.0
10
t, TIME OR PULSE WIDTH (ms)
Figure 12. Thermal Response
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20
30
50
100
200 300
500
1000
2N5194 2N5195
DESIGN NOTE: USE OF TRANSIENT THERMAL RESISTANCE DATA
A train of periodical power pulses can be represented by
the model shown in Figure 13. Using the model and the
device thermal response, the normalized effective transient
thermal resistance of Figure 12 was calculated for various
duty cycles.
To find θJC(t), multiply the value obtained from Figure 12
by the steady state value θJC.
Example:
The 2N5193 is dissipating 50 watts under the following
conditions: t1 = 0.1 ms, tp = 0.5 ms. (D = 0.2).
Using Figure 12, at a pulse width of 0.1 ms and D = 0.2,
the reading of r(t1, D) is 0.27.
The peak rise in junction temperature is therefore:
tP
PP
PP
t1
1/f
t1
tP
PEAK PULSE POWER = PP
DUTY CYCLE, D = t1 f =
Figure 13.
∆T = r(t) x PP x θJC = 0.27 x 50 x 3.12 = 42.2C
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2N5194 2N5195
PACKAGE DIMENSIONS
TO–225AA
CASE 77–09
ISSUE W
–B–
U
F
Q
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
M
1 2 3
H
K
J
V
G
S
R
0.25 (0.010)
A
M
M
B
M
D 2 PL
0.25 (0.010)
M
A
M
B
M
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
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6
DIM
A
B
C
D
F
G
H
J
K
M
Q
R
S
U
V
INCHES
MIN
MAX
0.425
0.435
0.295
0.305
0.095
0.105
0.020
0.026
0.115
0.130
0.094 BSC
0.050
0.095
0.015
0.025
0.575
0.655
5 TYP
0.148
0.158
0.045
0.065
0.025
0.035
0.145
0.155
0.040
---
MILLIMETERS
MIN
MAX
10.80
11.04
7.50
7.74
2.42
2.66
0.51
0.66
2.93
3.30
2.39 BSC
1.27
2.41
0.39
0.63
14.61
16.63
5 TYP
3.76
4.01
1.15
1.65
0.64
0.88
3.69
3.93
1.02
---
2N5194 2N5195
Notes
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2N5194 2N5195
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2N5194/D