AD ADG919BCP Wideband, 43db isolation 1ghz, cmos 1.65 v to 2.75v, 2:1 mux/spdt switch Datasheet

PRELIMINARY TECHNICAL DATA
Wideband, 43dB Isolation @ 1GHz,
CMOS 1.65 V to 2.75V, 2:1 Mux/SPDT Switches
ADG918/ADG919
Preliminary Technical Data
a
FEATURES
Wideband DC to 2GHz
ADG918/ADG919 Absorptive/Reflective Switches
High Off Isolation (43 dB @ 1 GHz)
Low Insertion Loss (1 dB DC to 900 MHz)
Single 1.65 to 2.75 V power supply
CMOS/LVTTL Control Logic
8 Lead MSOP & Tiny 3 x 3mm CSP Packages
µA)
Low Power Consumption (5µ
FUNCTIONAL BLOCK DIAGRAM
ADG918
RF1
RF COMMON
50Ω
RF2
CONTROL
50Ω
APPLICATIONS
Wireless Communications
General Purpose RF switching
Dual Band Applications
Filter Selection
Antenna Switch
Digital Transceiver Front-End Switch
IF Switching
ADG919
RF1
RF COMMON
RF2
CONTROL
GENERAL DESCRIPTION
The ADG918/ADG919 are wideband switches using a
CMOS process to provide high isolation and low insertion
loss to 1GHz. The ADG918 is an absorptive switch
having 50 ohm terminated shunt legs, while the ADG919
is a reflective switch. These devices are designed such that
the isolation is high over the DC to 1GHz frequency
range. They have on board CMOS control logic, thus
eliminating the need for external controlling circuitry.
The control inputs are both CMOS and LVTTL
compatible. The low power consumption of these CMOS
devices makes them ideally suited to wireless applications
and general purpose high frequency switching.
Figure 1. Isolation vs Frequency
Table 1. Truth Table
Control
Signal Path
0
1
RF2 to RF Common
RF1 to RF Common
Figure 2. Loss vs Frequency
REV. PrC Sept 2002
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
Analog Devices, Inc., 2002
PRELIMINARY TECHNICAL DATA
1
ADG918/ADG919–SPECIFICATIONS
(V = +1.65 V to +2.75 V, GND = 0 V, All specifications T to T unless otherwise noted)
DD
MIN
MAX
Parameter
Symbol
Conditions
AC ELECTRICAL CHARACTERISTICS
Operating Frequency
Insertion Loss
S21, S12
Isolation- RF to RF1/RF2
S21, S12
Isolation - RF1 to RF2
S21, S12
Return Loss (On Channel)
S11, S22
On switching Time
Off Switching Time
1 dB Compression
Third Order Intermodulation intercept
tON
t OFF
P-1dB
IP3
VINH
VINH
VINL
VINL
II
VDD = 2.3 V to 2.75 V
VDD = 1.65 V to 1.95 V
VDD = 2.3 V to 2.75 V
VDD = 1.65 V to 1.95 V
0 ⱕ VIN ⱕ 2.75 V
CAPACITANCE3
RF1/RF2, RF Port On Capacitance
Control Input Capacitance
CRF ON
C IN
f = 1 MHz
f = 1 MHz
POWER REQUIREMENTS
VDD
Quiescent Power Supply Current
IDD
Digital Inputs = 0 V or VDD
Input Low Voltage
Input Leakage Current
B Version
Typ 2
DC
DC - 100 MHz
500 MHz
900 MHz
1 MHz
100 MHz
500 MHz
1000 MHz
1 MHz
100 MHz
500 MHz
1000 MHz
DC - 100 MHz
500 MHz
1000 MHz
50% Control to 90% RF
50% Control to 10% RF
DC to 1000 MHz
900MHz, 5dBm
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
Min
Max
Units
2
GHz
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
ns
dBm
dBm
0.4
0.65
1.0
100
55
43
100
55
30
26
23
5
4
20
35
1.7
0.65VCC
0.7
0.35VCC
±1
2
2
1.65
1
V
V
V
V
µA
pF
pF
2.75
5
V
µA
NOTES
1
Temperature range is as follows: B Version: –40°C to +85°C.
2
Typical values are at +25°C unless otherwise stated.
3
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
REV. PrC
PRELIMINARY TECHNICAL DATA
ADG918/ADG919
ABSOLUTE MAXIMUM RATINGS 1
PIN CONFIGURATION
(T A = +25°C unless otherwise noted)
VDD to GND
-0.5 V to +4 V
Inputs to GND
-0.5 V to VDD + 0.3V
Input Power
TBD dBm
Operating Temperature Range
Industrial (B Version)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
+150°C
MSOP Package
206°C/W
θJA Thermal Impedance
CSP Package
TBD°C/W
θJA Thermal Impedance
Lead Temperature, Soldering (10seconds)
300°C
IR Reflow, Peak Temperature (<20 seconds)
+235°C
8-Lead MSOP (RM-8)
3x3mm CSP (CP-8)
1
VDD
CONTROL 2
GND 3
RFCommon 4
8
ADG918/
ADG919
TOP VIEW
(Not to Scale)
RF1
7
GND
6
GND
5
RF2
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Only one absolute maximum rating may
be applied at any one time.
ORDERING GUIDE
Model
Temperature Range
Package Descriptions
ADG918BRM
ADG918BCP
ADG919BRM
ADG919BCP
–40°C
–40°C
–40°C
–40°C
MSOP (Micro Small Outline Package)
Chip Scale Package
MSOP (Micro Small Outline Package)
Chip Scale Package
to
to
to
to
+85°C
+85°C
+85°C
+85°C
Branding
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG919 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. PrC
–3–
Package Options
RM-8
CP-8
RM-8
CP-8
PRELIMINARY TECHNICAL DATA
ADG918/ADG919
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
MSOP
(RM-8)
0.122 (3.10)
0.114 (2.90)
8
5
0.199 (5.05)
0.187 (4.75)
0.122 (3.10)
0.114 (2.90)
1
4
PIN 1
0.0256 (0.65) BSC
0.120 (3.05)
0.112 (2.84)
0.120 (3.05)
0.112 (2.84)
0.043 (1.09)
0.037 (0.94)
0.006 (0.15)
0.002 (0.05)
0.018 (0.46)
SEATING 0.008 (0.20)
PLANE
0.011 (0.28)
0.003 (0.08)
33
27
0.028 (0.71)
0.016 (0.41)
Chip Scale Package
(CP-8)
3 x 3mm
TBD
–4–
REV. PrC
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