OPA544 ® High-Voltage, High-Current OPERATIONAL AMPLIFIER FEATURES DESCRIPTION ● HIGH OUTPUT CURRENT: 2A min The OPA544 is a high-voltage/high-current operational amplifier suitable for driving a wide variety of high power loads. High performance FET op amp circuitry and high power output stage are combined on a single monolithic chip. ● WIDE POWER SUPPLY RANGE: ±10 to ±35V ● SLEW RATE: 8V/µs ● INTERNAL CURRENT LIMIT ● THERMAL SHUTDOWN PROTECTION ● FET INPUT: IB = 100pA max ● 5-LEAD TO-220 PLASTIC PACKAGE ● 5-LEAD SURFACE MOUNT PACKAGE APPLICATIONS The OPA544 is protected by internal current limit and thermal shutdown circuits. The OPA544 is available in industry-standard 5-lead TO-220 and 5-lead surface-mount power packages. Its copper tab allows easy mounting to a heat sink for excellent thermal performance. It is specified for operation over the extended industrial temperature range, –40°C to +85°C. ● MOTOR DRIVER ● PROGRAMMABLE POWER SUPPLY ● SERVO AMPLIFIER ● VALVES, ACTUATOR DRIVER ● MAGNETIC DEFLECTION COIL DRIVER ● AUDIO AMPLIFIER Tab is connected to V– supply. Tab is connected to V– supply. 5-Lead Surface Mount 5-Lead TO-220 and Stagger-Formed TO-220 1 2 3 4 5 1 2 3 4 5 + VIN V– V+ – VIN VO + VIN V– V+ – VIN VO International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 ©1994 Burr-Brown Corporation SBOS038 PDS-1250B Printed in U.S.A. September, 1995 SPECIFICATIONS At TCASE = +25°C, VS = ±35V, unless otherwise noted. OPA544T OPA544T-1 OPA544F PARAMETER CONDITION OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply INPUT BIAS CURRENT(1) Input Bias Current vs Temperature Input Offset Current MIN Specified Temperature Range VS = ±10V to ±35V VCM = 0V Linear Operation Linear Operation VCM = ±VS –6V (V+) –6 (V–) +6 90 INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain FREQUENCY RESPONSE Gain Bandwidth Product Slew Rate Full-Power Bandwidth Settling Time 0.1% Total Harmonic Distortion OUTPUT Voltage Output, Positive Negative Positive Negative Current Output Short-Circuit Current POWER SUPPLY Specified Operating Voltage Operating Voltage Range Quiescent Current TEMPERATURE RANGE Operating Storage Thermal Resistance, θJC Thermal Resistance, θJC Thermal Resistance, θJA MAX UNITS ±1 ±10 ±10 ±5 ±100 mV µV/°C µV/V ±100 pA ±100 pA ±15 See Typical Curve ±10 VCM = 0V NOISE Input Voltage Noise Noise Density, f = 1kHz Current Noise Density, f = 1kHz INPUT VOLTAGE RANGE Common-Mode Input Range, Positive Negative Common-Mode Rejection TYP VO = ±30V, RL = 1kΩ 90 RL = 15Ω 60Vp-p, RL = 15Ω 5 G = –10, 60V Step IO = 2A IO = 2A IO = 0.5A IO = 0.5A (V+) –5 (V–) +5 (V+) –4.2 (V–) +4 ±10 IO = 0 36 3 nV/√Hz fA/√Hz (V+) –4 (V–) +4 106 V V dB 1012 || 8 1012 || 10 Ω || pF Ω || pF 103 dB 1.4 8 See Typical Curve 25 See Typical Curve MHz V/µs (V+) –4.4 (V–) +3.8 (V+) –3.8 (V–) +3.1 See SOA Curves 4 V V V V ±35 ±12 –40 –40 f > 50Hz DC No Heat Sink µs A ±35 ±15 +85 +125 2.7 3 65 V V mA °C °C °C/W °C/W °C/W NOTES: (1) High-speed test at TJ = 25°C. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® OPA544 2 CONNECTION DIAGRAMS PACKAGE/ORDERING INFORMATION Top View Tab is connected to V– supply. Tab is connected to V– supply. 5-Lead Surface Mount 5-Lead TO-220 and Stagger-Formed TO-220 PRODUCT PACKAGE PACKAGE DRAWING NUMBER(1) OPA544T 5-Lead TO-220 315 OPA544T-1 5-Lead Stagger-Formed TO-220 323 OPA544F 325 5-Lead Surface-Mount NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. 1 2 3 4 5 1 2 3 4 5 + VIN V– V+ – VIN VO ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. + VIN V– V+ – VIN VO ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS Supply Voltage, V+ to V– ................................................................... 70V Output Current ................................................................. See SOA Curve Input Voltage .................................................... (V–) –0.7V to (V+) +0.7V Operating Temperature ................................................. –40°C to +125°C Storage Temperature ..................................................... –40°C to +125°C Junction Temperature ...................................................................... 150°C Lead Temperature (soldering –10s)(1) ............................................................... 300°C NOTE: (1) Vapor-phase or IR reflow techniques are recommended for soldering the OPA544F surface mount package. Wave soldering is not recommended due to excessive thermal shock and “shadowing” of nearby devices. ® 3 OPA544 TYPICAL PERFORMANCE CURVES At TCASE = +25°C, VS = ±35V, unless otherwise noted. OPEN-LOOP GAIN AND PHASE vs FREQUENCY INPUT BIAS CURRENT vs TEMPERATURE 120 10n 100 RL = 15Ω 60 –45 –90 40 –135 20 –180 Phase (°) Gain (dB) 80 Input Bias Current (A) 0 1n IB 100p IOS 10p 0 –20 1p 1 10 100 1k 10k 100k 1M 10M –75 –50 –25 Frequency (Hz) CURRENT LIMIT vs TEMPERATURE 50 75 100 125 13 Quiescent Current (mA) 4 Limit Current (A) 25 QUIESCENT CURRENT vs TEMPERATURE 5 3 2 1 12 VS = ±35V 11 VS = ±10V 10 9 0 –75 –50 –25 0 25 50 75 100 125 –75 –50 –25 Temperature (°C) 0 25 50 75 100 125 Temperature (°C) COMMON-MODE REJECTION vs FREQUENCY VOLTAGE NOISE DENSITY vs FREQUENCY 110 100 Common-Mode Rejection (dB) 80 Voltage Noise (nV/√Hz) 0 Temperature (°C) 60 40 20 100 90 80 70 60 50 40 10 1 10 100 1k 10k 100 100k ® OPA544 1k 10k Frequency (Hz) Frequency (Hz) 4 100k 1M TYPICAL PERFORMANCE CURVES (CONT) At TCASE = +25°C, VS = ±35V, unless otherwise noted. GAIN-BANDWIDTH PRODUCT AND SLEW RATE vs TEMPERATURE POWER SUPPLY REJECTION vs FREQUENCY 2.5 100 V+ Supply 80 V– Supply 60 40 GBW 2.0 SR+ 8 1.5 SR– 7 1.0 0.5 20 1 10 100 1k 10k 100k –75 1M –50 –25 0 25 50 75 100 6 125 Temperature (°C) Frequency (Hz) TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 10 35 Clipping RL = 15Ω 30 100mW 2W 1 25 Slew Rate Limited 20 THD + N (%) Output Voltage (V) 9 Slew Rate (V/µS) Gain-Bandwidth Product (MHz) Power Supply Rejection (dB) 120 15 10 0.1 30W 0.01 5 0.001 0 20k 100k 20 200k 100 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT OUTPUT VOLTAGE SWING vs TEMPERATURE 5 6 (V+) – VO IO = +2A 5 3 |VSUPPLY| – |VOUT| (V) 4 |VSUPPLY| – |VOUT| (V) 10k 20k 1k Frequency (Hz) Frequency (Hz) |(V–) –VO| 2 1 IO = –2A 4 3 IO = +0.5A IO = –0.5A 2 1 0 0 0 1 2 3 –75 Output Current (A) –50 –25 0 25 50 75 100 125 Temperature (°C) ® 5 OPA544 TYPICAL PERFORMANCE CURVES (CONT) At TCASE = +25°C, VS = ±35V, unless otherwise noted. SMALL SIGNAL RESPONSE G = 3, CL = 1nF 5V/div 200MV/div 2µs/div The safe output current decreases as VS–VO increases. Output short-circuits are a very demanding case for SOA. A short-circuit to ground forces the full power supply voltage (V+ or V–) across the conducting transistor. With VS = ±35V the safe output current is 1.5A (at 25˚C). The short-circuit current is approximately 4A which exceeds the SOA. This situation will activate the thermal shutdown circuit in the OPA544. For further insight on SOA, consult Application Bulletin AB-039. APPLICATIONS INFORMATION Figure 1 shows the OPA544 connected as a basic noninverting amplifier. The OPA544 can be used in virtually any op amp configuration. Power supply terminals should be bypassed with low series impedance capacitors. The technique shown, using a ceramic and tantalum type in parallel is recommended. Power supply wiring should have low series impedance and inductance. SAFE OPERATING AREA 10 +35V V+ R2 =3 R1 Output Current (A) G = 1+ + 0.1µF R1 5kΩ R2 10kΩ OPA544 VIN Current-Limited 4 10µF 0.1µF TC = 25°C Output current may be limited to less than 4A—see text. 1 TC = 85°C 0.4 VO TC = 125°C ZL 0.1 1 5 10 20 50 100 |VS – VO| (V) 10µF + FIGURE 2. Safe Operating Area. V– –35V CURRENT LIMIT The OPA544 has an internal current limit set for approximately 4A. This current limit decreases with increasing junction temperature as shown in the typical curve, Current Limit vs Temperature. This, in combination with the thermal shutdown circuit, provides protection from many types of overload. It may not, however, protect for short-circuit to ground, depending on the power supply voltage, ambient temperature, heat sink and signal conditions. FIGURE 1. Basic Circuit Connections. SAFE OPERATING AREA Stress on the output transistors is determined by the output current and the voltage across the conducting output transistor, VS–VO. The power dissipated by the output transistor is equal to the product of the output current and the voltage across the conducting transistor, VS–VO. The Safe Operating Area (SOA curve, Figure 2) shows the permissible range of voltage and current. ® OPA544 2 6 POWER DISSIPATION Power dissipation depends on power supply, signal and load conditions. For dc signals, power dissipation is equal to the product of output current times the voltage across the conducting output transistor. Power dissipation can be minimized by using the lowest possible power supply voltage necessary to assure the required output voltage swing. Depending on load and signal conditions, the thermal protection circuit may produce a duty-cycle modulated output signal. This limits the dissipation in the amplifier, but the rapidly varying output waveform may be damaging to some loads. The thermal protection may behave differently depending on whether internal dissipation is produced by sourcing or sinking output current. For resistive loads, the maximum power dissipation occurs at a dc output voltage of one-half the power supply voltage. Dissipation with ac signals is lower. Application Bulletin AB-039 explains how to calculate or measure power dissipation with unusual signals and loads. OUTPUT STAGE COMPENSATION The complex load impedances common in power op amp applications can cause output stage instability. Figure 3 shows an output series R/C compensation network (1Ω in series with 0.01µF) which generally provides excellent stability. Some variation in circuit values may be required with certain loads. HEATSINKING Most applications require a heat sink to assure that the maximum junction temperature is not exceeded. The heat sink required depends on the power dissipated and on ambient conditions. Consult Application Bulletin AB-038 for information on determining heat sink requirements. UNBALANCED POWER SUPPLIES Some applications do not require equal positive and negative output voltage swing. The power supply voltages of the OPA544 do not need to be equal. For example, a –6V negative power supply voltage assures that the inputs of the OPA544 are operated within their linear common-mode range, and that the output can swing to 0V. The V+ power supply could range from 15V to 65V. The total voltage (V– to V+) can range from 20V to 70V. With a 65V positive supply voltage, the device may not be protected from damage during short-circuits because of the larger VCE during this condition. The mounting tab of the surface-mount package version should be soldered to a circuit board copper area for good heat dissipation. Figure 3 shows typical thermal resistance from junction to ambient as a function of the copper area. THERMAL PROTECTION The OPA544 has thermal shutdown that protects the amplifier from damage. Any tendency to activate the thermal shutdown circuit during normal operation is indication of excessive power dissipation or an inadequate heat sink. OUTPUT PROTECTION Reactive and EMF-generating loads can return load current to the amplifier, causing the output voltage to exceed the power supply voltage. This damaging condition can be avoided with clamp diodes from the output terminal to the power supplies as shown in Figure 4. Fast-recovery rectifier diodes with a 4A or greater continuous rating are recommended. The thermal protection activates at a junction temperature of approximately 155˚C. For reliable operation, junction temperature should be limited to 150˚C, maximum. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is activated. Use worst-case load and signal conditions. For good reliability, the thermal protection should trigger more than 25˚C above the maximum expected ambient condition of your application. This produces a junction temperature of 125˚C at the maximum expected ambient condition. THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA Thermal Resistance, θJA (°C/W) 50 Circuit Board Copper Area OPA544F Surface Mount Package 1oz copper 40 30 20 10 OPA544 Surface Mount Package 0 0 1 2 3 4 5 Copper Area (inches2) FIGURE 3. Thermal Resistance vs Circuit Board Copper Area. ® 7 OPA544 V+ R1 5kΩ R2 20kΩ R2 = –4 R1 G=– VIN D1 OPA544 D2 1Ω Motor 0.01µF V– D1, D2 : Motorola MUR420 Fast Recovery Rectifier. FIGURE 4. Motor Drive Circuit. +30V +30V REF102 10V 20kΩ +5V 20pF 8-bit data port (8 + 4 bits) 40kΩ 0-1mA 10kΩ 10Ω 10kΩ OPA602 OPA544 4.7kΩ DAC7801 12-bit M-DAC 1µH 1Ω 470pF 0.01µF –30V FIGURE 5. Digitally Programmable Power Supply. ® OPA544 Output series L/R network helps assure stability with very high capacitance loads. 8 VO ±20V at 2A PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty OPA544F OBSOLETE DDPAK/ TO-263 KTT 5 OPA544F/500 ACTIVE DDPAK/ TO-263 KTT 5 OPA544F/500G3 ACTIVE DDPAK/ TO-263 KTT OPA544FKTTT ACTIVE DDPAK/ TO-263 OPA544FKTTTG3 ACTIVE OPA544T Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) TBD Call TI Call TI 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR OPA544F 5 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR OPA544F KTT 5 50 TBD Call TI Call TI OPA544F DDPAK/ TO-263 KTT 5 50 TBD Call TI Call TI OPA544F ACTIVE TO-220 KC 5 49 TBD Call TI Call TI OPA544T-1 OBSOLETE TO-220 KC 5 TBD Call TI Call TI OPA544TG3 ACTIVE TO-220 KC 5 TBD Call TI Call TI 49 -40 to 85 OPA544T -40 to 85 OPA544T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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