MC74VHC1GT50 Noninverting Buffer / CMOS Logic Level Shifter with TTL-Compatible Inputs The MC74VHC1GT50 is a single gate noninverting buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The device input is compatible with TTL- type input thresholds and the output has a full 5 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic- level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high- voltage power supply. The MC74VHC1GT50 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the MC74VHC1GT50 to be used to interface high voltage to low voltage circuits. The output structures also provide protection when VCC = 0 V. These input and output structures help prevent device destruction caused by supply voltage - input/output voltage mismatch, battery backup, hot insertion, etc. • • • • • • • • • http://onsemi.com MARKING DIAGRAMS SC-88A / SOT-353/SC-70 DF SUFFIX CASE 419A VLd Pin 1 d = Date Code TSOP-5/SOT-23/SC-59 DT SUFFIX CASE 483 VLd Pin 1 d = Date Code Designed for 1.65 V to 5.5 VCC Operation High Speed: tPD = 3.5 ns (Typ) at VCC = 5 V Low Power Dissipation: ICC = 1 A (Max) at TA = 25°C PIN ASSIGNMENT TTL-Compatible Inputs: VIL = 0.8 V; VIH = 2.0 V, VCC = 5 V 1 NC CMOS- Compatible Outputs: VOH > 0.8 VCC; VOL < 0.1 VCC @Load 2 IN A Power Down Protection Provided on Inputs and Outputs 3 GND Balanced Propagation Delays 4 OUT Y Pin and Function Compatible with Other Standard Logic Families 5 VCC Chip Complexity: FETs = 104; Equivalent Gates = 26 FUNCTION TABLE NC 1 IN A 2 GND 3 5 VCC 4 OUT Y A Input Y Output L H L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Figure 1. Pinout (Top View) IN A 1 OUT Y Figure 2. Logic Symbol Semiconductor Components Industries, LLC, 2003 March, 2003 - Rev. 11 1 Publication Order Number: MC74VHC1GT50/D MC74VHC1GT50 MAXIMUM RATINGS (Note 1) Symbol Value Unit VCC DC Supply Voltage Characteristics -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V VOUT DC Output Voltage -0.5 to 7.0 -0.5 to VCC + 0.5 V IIK Input Diode Current IOK Output Diode Current IOUT VCC = 0 High or Low State -20 mA +20 mA DC Output Current, per Pin +25 mA ICC DC Supply Current, VCC and GND +50 mA PD Power dissipation in still air SC-88A, TSOP-5 200 mW JA Thermal resistance SC- 88A, TSOP- 5 333 °C/W TL Lead temperature, 1 mm from case for 10 s 260 °C TJ Junction temperature under bias +150 °C Tstg Storage temperature -65 to +150 °C VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V ILatch- Up Latch-Up Performance Above VCC and Below GND at 125°C (Note 5) ±500 mA VOUT < GND; VOUT > VCC 1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22-A114-A 3. Tested to EIA/JESD22-A115-A 4. Tested to JESD22-C101-A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC DC Supply Voltage 1.65 5.5 V VIN DC Input Voltage 0.0 5.5 V VOUT DC Output Voltage 0.0 0.0 5.5 VCC V TA Operating Temperature Range -55 +125 °C tr , tf Input Rise and Fall Time 0 0 100 20 ns/V VCC = 0 High or Low State VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V 117.8 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80 ° C 1,032,200 90 TJ = 90 ° C 80 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 100 ° C Time, Years TJ = 110° C Time, Hours TJ = 120° C Junction Temperature °C TJ = 130 ° C NORMALIZED FAILURE RATE Device Junction Temperature versus Time to 0.1% Bond Failures 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 MC74VHC1GT50 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter VIH Minimum High-Level Input Voltage VIL VOH Test Conditions Maximum Low-Level Input Voltage Minimum High-Level Output Voltage VIN = VIH IOH = -50 A VIN = VIH IOH = -4 mA IOH = -8 mA VOL Maximum Low-Level Output Voltage VIN = VIL IOL = 50 A VIN = VIL IOL = 4 mA IOL = 8 mA TA ≤ 85°C TA = 25°C Typ Max Min Max -55 ≤ TA ≤ 125°C (V) Min Min 1.65 to 2.29 0.50 VCC 0.50 VCC 0.50 VCC 2.3 to 2.99 0.45 VCC 0.45 VCC 0.45 VCC 3.0 4.5 5.5 1.4 2.0 2.0 1.4 2.0 2.0 1.4 2.0 2.0 Max V 1.65 to 2.29 0.10 VCC 0.10 VCC 0.10 VCC 2.3 to 2.99 0.15 VCC 0.15 VCC 0.15 VCC 3.0 4.5 5.5 0.53 0.8 0.8 0.53 0.8 0.8 0.53 0.8 0.8 1.65 to 2.99 VCC - 0.1 3.0 4.5 2.9 4.4 3.0 4.5 2.58 3.94 3.0 4.5 VCC - 0.1 VCC - 0.1 2.9 4.4 2.9 4.4 2.48 3.80 2.34 3.66 Unit V V V 1.65 to 2.99 0.0 0.1 0.1 0.1 3.0 4.5 0.0 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V V IIN Maximum Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 0.1 1.0 1.0 A ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 1.0 20 40 A ICCT Quiescent Supply Current Input: VIN = 3.4 V 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5 V 0.0 0.5 5.0 10 A http://onsemi.com 3 MC74VHC1GT50 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr = tf = 3.0 ns TA ≤ 85°C TA = 25°C Symbol tPLH, tPHL Parameter Maximum Propagation D l I t A tto Y Delay, Input CIN Min Test Conditions Typ Max Min Max -55 ≤ TA ≤ 125°C Min Max Unit VCC = 1.8 ± 0.15 V CL = 15 pF 16.6 18.0 22.0 ns VCC = 2.5 ± 0.2 V CL = 15 pF CL = 50 pF 13.3 19.5 14.5 22.0 17.5 25.5 ns ns VCC = 3.3 ± 0.3 V CL = 15 pF CL = 50 pF 4.5 6.3 10.0 13.5 11.0 15.0 13.0 17.5 VCC = 5.0 ± 0.5 V CL = 15 pF CL = 50 pF 3.5 4.3 6.7 7.7 7.5 8.5 8.5 9.5 5 10 10 10 Maximum Input Capacitance pF Typical @ 25°C, VCC = 5.0 V CPD 12 Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. TEST POINT VCC A OUTPUT 50% DEVICE UNDER TEST GND tPLH tPHL CL * VOH Y 50% VCC VOL *Includes all probe and jig capacitance Figure 4. Switching Waveforms Figure 5. Test Circuit http://onsemi.com 4 MC74VHC1GT50 DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number Circuit Indicator Temp Range Identifier MC74VHC1GT50DFT1 MC MC74VHC1GT50DFT2 MC74VHC1GT50DTT1 CAVITY TAPE TOP TAPE Technology Device Function Package Suffix Tape & Reel Suffix Package Type (Name/SOT#/ Common Name) Tape and Reel Size 74 VHC1G T50 DF T1 SC-88A / SOT-353 / SC-70 178 mm (7”) 3000 Unit MC 74 VHC1G T50 DF T2 SC-88A / SOT-353 / SC-70 178 mm (7”) 3000 Unit MC 74 VHC1G T50 DT T1 TSOP-5 / SOT-23 / SC-59 178 mm (7”) 3000 Unit TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS DIRECTION OF FEED Figure 6. Tape Ends for Finished Goods “T1” Pin One Toward Sprocket Hole (3k Reel) “T2” Pin One Opposing Sprocket Hole (3k Reel) Figure 7. SC-88A/SOT-353/SC-70-5 DFT1 and DFT2 Reel Configuration/Orientation “T1” Pin One Opposing Sprocket Hole (3k Reel) Figure 8. TSOP-5/SC59-5/SOT23-5 DTT1 Reel Configuration/Orientation http://onsemi.com 5 TAPE LEADER NO COMPONENTS 400 mm MIN MC74VHC1GT50 t MAX 1.5 mm MIN (0.06 in) A 13.0 mm 0.2 mm (0.512 in 0.008 in) 50 mm MIN (1.969 in) 20.2 mm MIN (0.795 in) FULL RADIUS G Figure 9. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm T1, T2 178 mm (7 in) 8.4 mm, + 1.5 mm, -0.0 (0.33 in + 0.059 in, -0.00) 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET Figure 10. Reel Winding Direction http://onsemi.com 6 HOLE MC74VHC1GT50 PACKAGE DIMENSIONS SC-88A / SOT-353 / SC-70 DF SUFFIX 5-LEAD PACKAGE CASE 419A-02 ISSUE F A G 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. DIM A B C D G H J K N S 4 -B- S 1 2 3 D 5 PL 0.2 (0.008) B M M INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 N J C K H 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 http://onsemi.com 7 SCALE 20:1 mm inches MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 MC74VHC1GT50 PACKAGE DIMENSIONS TSOP-5 / SOT-23 / SC-59 DT SUFFIX 5-LEAD PACKAGE CASE 483-01 ISSUE B D S 5 4 1 2 3 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L DIM A B C D G H J K L M S G A J C 0.05 (0.002) H M K MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0 10 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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