Shoulder HDBF09620A21 Saw filter Datasheet

规格书编号
SPEC NO :
产品规格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDBF09620A21 SMD-21
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2008-6-17
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
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Tel:0755-82916880
Fax:0755-82916881
E-mail:[email protected]
Page 1 of 8
SAW FILTER
HDBF09620A21
SMD-21
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Spec. No.
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Page 2 of 8
SAW FILTER
HDBF09620A21
SMD-21
1. SCOPE
This specification shall cover the characteristics of SAW filter with
the page system.
HDBF09620A21 used for
2. ELECTRICAL SPECIFICATION
Maximum incident power in passband
Max.DC voltage between any 2 terminals
Storage temperature range
Operation temperature range
Max.soldering profile
+10dBm
30VDC
-40℃ to +85℃
-40℃ to +85℃
265℃ for 10s
Electronic Characteristics
Item
Requirement
Nominal center Frequency
Insertion loss (86.0MHz~106.0MHz)
Passband Bandwidth
Relative attenuation
0MHz ~68.4MHz
76.8MHz
123.6MHz~162.8MHz
162.8MHz~1000MHz
Amplitude ripple (86.0MHz~106.0MHz)
Amplitude ripple @25℃
(86.0MHz~106.0MHz)
Group delay ripple (86.0MHz~106.0MHz)
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Unit
Min.
Typical.
Max.
20
96
9
-
12
-
MHz
dB
MHz
-
dB
1.6
dB
51
40
56
35
57
45
65
40
0.9
1.2
120
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dB
150
ns
Page 3 of 8
SAW FILTER
HDBF09620A21
SMD-21
Typical frequency response
3. TEST CIRCUIT
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Page 4 of 8
SAW FILTER
HDBF09620A21
SMD-21
4.DIMENSION
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30 Minutes.
Then release the device into the room conditions for 1 to 2 hours prior to the measurement.
It shall meet the
specifications in table 1.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in table 1.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in table 1.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in table 1.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude
of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1.
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Page 5 of 8
SAW FILTER
HDBF09620A21
SMD-21
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction
of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
7.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
(2) Label
Device Name
User Product Name
Quantity
Lot No.
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Page 6 of 8
SAW FILTER
HDBF09620A21
SMD-21
(3) Leader part and vacant position specifications.
8. TAPE SPECIFICATIONS
8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
(3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
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Page 7 of 8
SAW FILTER
HDBF09620A21
SMD-21
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.00
±0.30
7.50
±0.10
1.75
±0.10
4.00
±0.10
8.00
±0.10
2.00
±0.10
Ø1.50
Ø1.5
±0.25
0.25
±0.05
2.20
±0.10
5.30
±0.10
7.30
±0.10
[Figure 2]
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
±1.0
Ø100
±0.5
Ø13
±0.5
Ø21
±0.8
2
±0.5
16.8
±0.3
3
max.
1.0
max.
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Page 8 of 8
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