ILSI ILCX18-BHDF18-20.000 4 pad ceramic package, 2 mm x 2.5 mm Datasheet

4 Pad Ceramic Package, 2 mm x 2.5 mm
Product Features:
ILCX18 Series
Applications:
SMD Package
Small package Foot Print
Supplied in Tape and Reel
Compatible with Leadfree Processing
PCMCIA Cards
Storage
PC’s
Wireless Lan
USB
GSM Cell Phone
2.5
+/-0.1
4
3
1
2
1
2
4
3
2.0
+/-0.1
Frequency
12 MHz to 60 MHz*
0.55
+/-0.1
ESR (Equivalent Series Resistance)
12 MHz – 19.9 MHz
20 MHz – 29.9 MHz
30 MHz – 39.9 MHz
40 MHz – 60.0 MHz
100  Max.
80  Max.
60  Max.
40  Max.
Shunt Capacitance (C0)
3.5 pF Max.
Frequency Tolerance @ 25 C
30 ppm Standard (see Part Number Guide for more options)
Frequency Stability over
Temperature
50 ppm Standard (see Part Number Guide for more options)
Crystal Cut
AT Cut
Load Capacitance
18 pF Standard (see Part Number Guide for more options)
Drive Level
100 µW Max.
Aging
5 ppm Max. / Year Standard
Connection diagram
4
3
1
2
Recommended pad layout
0.9
0.8
1.25
Temperature
1.65
0 C to +70 C Standard (see Part Number Guide for more
options)
Operating
Dimension Units: mm
Storage
-40 C to +85 C Standard
Part Number Guide
Package
ILCX18 -
Sample Part Number:
ILCX18 - FB1F18 - 20.000
Tolerance
(ppm) at Room
Temperature
Stability
(ppm) over Operating
Temperature
Operating
Temperature Range
B = ±50 ppm
B = ±50 ppm
0 = 0°C to +50°C
F = ±30 ppm
F = ±30 ppm
1 = 0°C to +70°C
G = ±25 ppm
G = ±25 ppm
2 = -10°C to +60°C
H = ±20 ppm
H = ±20 ppm
3 = -20°C to +70°C
I = ±15 ppm
I = ±15 ppm**
5 = -40°C to +85°C
J = ±10 ppm*
J = ±10 ppm**
Mode
(overtone)
F = Fundamental
Load
Capacitance
(pF)
18 pF Standard
Or Specify
9 = -10°C to +50°C
D = -10°C to +105°C*
E = -40°C to +105°C*
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
7/23/12_D
Specifications subject to change without notice
Page 1
Frequency
- 20.000 MHz
4 Pad Ceramic Package, 2 mm x 2.5 mm
ILCX18 Series
Pb Free Solder Reflow Profile:
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I-Date Code(yww)
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
7/23/12_D
Specifications subject to change without notice
Page 2
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