ON NL17SG32P5T5G Single 2-input or gate Datasheet

NL17SG32
Single 2-Input OR Gate
The NL17SG32 MiniGatet is an advanced high−speed CMOS
2−input OR gate in ultra−small footprint.
The NL17SG32 input structures provides protection when voltages
up to 4.6 V are applied.
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Features
•
•
•
•
•
•
Wide Operating VCC Range: 0.9 V to 3.6 V
MARKING
DIAGRAM
High Speed: tPD = 2.4 ns (Typ) at VCC = 3.0 V, CL = 15 pF
Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C
4.6 V Overvoltage Tolerant (OVT) Input Pins
SOT−953
CASE 527AE
Ultra−Small Packages
3M
1
These are Pb−Free and Halide−Free Devices
3
M
= Specific Device Code
= Month Code
PIN ASSIGNMENT
1
IN A
VCC
5
2
GND
4
3
IN B
1
IN A
2
GND
3
IN B
4
OUT Y
5
VCC
OUT Y
FUNCTION TABLE
Inputs
Figure 1. Pinout (Top View)
IN A
IN B
≥1
OUT Y
Output
A
B
Y
L
L
H
H
L
H
L
H
L
H
H
H
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
January, 2013 − Rev. 2
1
Publication Order Number:
NL17SG32/D
NL17SG32
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
IIK
DC Input Diode Current
Value
Unit
−0.5 to +5.5
V
−0.5 to +4.6
V
−0.5 to VCC +0.5
−0.5 to +4.6
V
VIN < GND
−20
mA
VOUT < GND
Output at High or Low State
Power−Down Mode (VCC = 0 V)
IOK
DC Output Diode Current
−20
mA
IOUT
DC Output Source/Sink Current
±20
mA
ICC
DC Supply Current per Supply Pin
±20
mA
IGND
DC Ground Current per Ground Pin
±20
mA
TSTG
Storage Temperature Range
−65 to +150
°C
260
°C
+150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILATCHUP
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Latchup Performance
Above VCC and Below GND at 125°C (Note 4)
>2000
>200
V
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
Positive DC Supply Voltage
0.9
4.6
V
VIN
Digital Input Voltage
0.0
4.6
V
0.0
0.0
VCC
3.6
V
−55
+125
°C
0
10
ns/V
VOUT
TA
Dt / DV
Output Voltage
Output at High or Low State
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
Input Transition Rise or Fail Rate
VCC = 3.3 V ± 0.3 V
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2
NL17SG32
DC ELECTRICAL CHARACTERISTICS
TA = 255C
Symbol
Parameter
VIH
High-Level Input
Voltage
VIL
VOH
VOL
Conditions
Low-Level Input
Voltage
High-Level
Output Voltage
Low-Level
Output Voltage
VIN =
VIH or
VIL
VIN =
VIH or
VIL
Min
VCC (V)
Max
TA =
-555C to +1255C
Min
0.9
VCC
VCC
1.1 to 1.3
0.7xVCC
0.7xVCC
1.4 to 1.6
0.65xVCC
0.65xVCC
1.65 to 1.95
0.65xVCC
0.65xVCC
2.3 to 2.7
1.7
1.7
3.0 to 3.6
2.0
2.0
Max
Unit
V
0.9
GND
GND
1.1 to 1.3
0.3xVCC
0.3xVCC
1.4 to 1.6
0.35xVCC
0.35xVCC
1.65 to 1.95
0.35xVCC
0.35xVCC
2.3 to 2.7
0.7
0.7
3.0 to 3.6
0.8
0.8
V
V
IOH = −20 mA
0.9
0.75
0.75
IOH = -0.3 mA
1.1 to 1.3
0.75xVCC
0.75xVCC
IOH = -1.7 mA
1.4 to 1.6
0.75xVCC
0.75xVCC
IOH = -3.0 mA
1.65 to 1.95
Vcc-0.45
Vcc-0.45
IOH = -4.0 mA
2.3 to 2.7
2.0
2.0
IOH = -8.0 mA
3.0 to 3.6
2.48
2.48
IOL = 20 mA
0.9 to 3.6
0.1
0.1
IOL = 1.1 mA
1.1 to 1.3
0.25xVCC
0.25xVCC
IOL = 1.7 mA
1.4 to 1.6
0.25xVCC
0.25xVCC
IOL = 3.0 mA
1.65 to 1.95
0.45
0.45
IOL = 4.0 mA
2.3 to 2.7
0.4
0.4
IOL = 8.0 mA
3.0 to 3.6
0.4
0.4
V
IIN
Input Leakage
Current
0 ≤ VIN ≤ 3.6 V
0 to 3.6
$0.1
$1.0
mA
ICC
Quiescent
Supply Current
VIN = VCC or GND
3.6
0.5
10.0
mA
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3
NL17SG32
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
A or B to Y
Test Condition
CL = 10 pF,
RL = 1 MW
CL = 15 pF,
RL = 1 MW
CL = 30 pF,
RL = 1 MW
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance (Note 5)
Min
Typ
Max
Min
Max
Unit
0.9
-
12.2
14.4
-
18.0
ns
1.1 to 1.3
-
8.8
12.4
-
16.2
1.4 to 1.6
-
5.0
8.5
-
10.0
1.65 to 1.95
-
3.6
6.2
-
6.7
2.3 to 2.7
-
2.7
3.9
-
4.4
3.0 to 3.6
-
2.1
3.1
-
3.7
0.9
-
13.0
16.0
-
18.0
1.1 to 1.3
-
7.8
12.0
-
16.0
1.4 to 1.6
-
5.9
9.3
-
11.2
1.65 to 1.95
-
4.5
6.9
-
7.1
2.3 to 2.7
-
3.0
4.4
-
5.0
3.0 to 3.6
-
2.4
3.4
-
3.9
0.9
-
14.0
17.2
-
20.0
1.1 to 1.3
-
11.0
14.1
-
17.8
1.4 to 1.6
-
8.0
12.1
-
15.9
1.65 to 1.95
-
6.0
9.2
-
9.6
2.3 to 2.7
-
3.9
5.7
-
6.1
3.0 to 3.6
-
3.0
4.4
-
4.8
3
-
-
-
pF
4
-
-
-
pF
0 to 3.6
f = 10 MHz
TA =
-555C to +1255C
TA = 255 C
VCC (V)
0.9 to 3.6
-
ns
ns
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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4
NL17SG32
Input A or B
50%
50% VCC
GND
tPLH
Output Y
tPHL
VOH
50% VCC
VOL
Figure 3. Switching Waveforms
VCC
OUTPUT
INPUT
CL*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended
for propagation delay tests.
Figure 4. Test Circuit
ORDERING INFORMATION
Device
NL17SG32P5T5G
Package
Shipping†
SOT−953
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NL17SG32
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
Y
PIN ONE
INDICATOR
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
4
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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NL17SG32/D
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