STMicroelectronics EMIF04-EAR02M8 4-line ipadâ ¢ emi filter and esd protection for headset Datasheet

EMIF04-EAR02M8
4-line IPAD™ EMI filter and ESD protection for headset
Features
Lead-free package
■
High attenuation: -30 dB at 900 MHz
■
Low cut-off frequencies: 60 MHz for speaker
lines
■
High current capability: 50 mA per line
■
Very low PCB space consumption:
1.5 mm x 1.7 mm
■
Very thin package: 0.6 mm maximum
■
High efficiency in ESD suppression
IEC6 1000-4-2 level 4
■
Micro QFN 8 leads
Figure 1.
High reliability offered by monolithic integration
Complies with following standards:
■
■
MIC_P_Ext
MIC_P_Int
MIC_N_Ext
MIC_N_Int
EAR_Ext
IEC 61000-4-2 level 4 input pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Pin configuration (bottom side)
GND
■
EAR_Ext
Figure 2.
Mobile phones
EAR_Int
EAR_Int
Equivalent circuit
R
MIC
C
L_MIC
Description
The EMIF04-EAR02M8 chip is a highly integrated
device designed to suppress EMI/RFI noise for
headset mobile phone. The new LC architecture
on the speaker lines provides a high attenuation
value maintaining a very low serial resistance.
R
MIC
C
L_MIC
L
The 8-lead micro-QFN package offers the
possibility to integrate the whole function in a very
small PCB space.
EAR
C
L_EAR
Additionally, this filter includes ESD protection
circuitry, which prevents damage to the protected
device when subjected to ESD surges up 30 kV.
L
EAR
C
L_EAR
TM: IPAD is a trademark of STMicroelectronics
March 2009
Rev 1
1/12
www.st.com
12
Characteristics
1
EMIF04-EAR02M8
Characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Unit
VPP
ESD IEC 61000-4-2
air discharge
contact discharge
30
30
kV
IEAR
Maximum rms current per channel
50
mA
Operating junction temperature
-30 to 125
°C
Storage temperature range
-55 to +150
°C
Tj
Tstg
Figure 3.
Electrical symbols and parameters
VBR Breakdown voltage
VRM Stand-off voltage
IRM Leakage current @ VRM
VBR VRM
I
IRM
V
VRM VBR
IRM
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
Test conditions
VBR
IR = 1 mA
IRM
VRM = 3 V
Min.
RL
Typ.
Max.
Unit
100
nA
7
V
1.5
LEAR
Parasitic resistance of inductor LEAR
0.30
nH
0.6
Ω
54
68
82
Ω
CL_EAR
VR = 0 V DC, 1 MHz
84
105
126
pF
CL_MIC
VR = 0 V DC, 1 MHz
60
76
92
pF
Fc_EAR
Cut-off frequency earphone line:
ZSOURCE = ZLOAD = 50 Ω
60
MHz
Fc_MIC
Cut-off frequency microphone line:
ZSOURCE = ZLOAD = 50 Ω
70
MHz
RMIC
2/12
Value
EMIF04-EAR02M8
Figure 4.
0
Characteristics
S21 attenuation measurement
dB
Figure 5.
0
-5
Analog cross talk measurements
dB
-10
-10
-20
-15
-20
-30
-25
-30
-35
-40
MIC_N
MIC_P
EAR_R
EAR_L
-40
-50
MIC_N - MIC_P
EAR_L - MIC_P
-60
-45
F (Hz)
-50
F (Hz)
-70
100k
Figure 6.
1M
10M
100M
1G
ESD response to IEC 61000-4-2
(+15 kV air discharge) on one MIC
input (Vin) and on one MIC output
100k
Figure 7.
1M
10M
100M
1G
ESD response to IEC 61000-4-2
(-15 kV air discharge) on one MIC
input (Vin) and on one MIC output
5.00 V/div
IN
5.00 V/div
IN
5.00 V/div
OUT
5.00 V/div
OUT
100 ns/div
Figure 8.
100 ns/div
ESD response to IEC 61000-4-2
(+15 kV air discharge) on one EAR
input (Vin) and on one EAR output
Figure 9.
ESD response to IEC 61000-4-2
(-15 kV air discharge) on one EAR
input (Vin) and on one EAR output
5.00 V/div
IN
5.00 V/div
IN
5.00 V/div
OUT
5.00 V/div
100 ns/div
OUT
100 ns/div
3/12
Characteristics
EMIF04-EAR02M8
Figure 10. Relative line capacitance variation
versus applied voltage
Figure 11. Total harmonic distortion with
noise: MIC lines, R = 10 kΩ
C/C0
0
THD + N (dB)
1.0
MIC lines
-50
EAR lines
0.8
0.6
0
1
3
2
4
VR(V)
5
Figure 12. Total harmonic distortion with
noise: MIC lines, R = 32 Ω
0
THD + N (dB)
1k
100
10 k
Figure 13. Total harmonic distortion with
noise: EAR lines, R = 32 Ω
0
-50
F (Hz)
-100
THD + N (dB)
-50
F (Hz)
-100
F (Hz)
100
-100
1k
10 k
1k
100
Figure 14. Total harmonic distortion with noise: EAR lines, R = 8 Ω
0
THD + N (dB)
-50
F (Hz)
-100
100
4/12
1k
10 k
10 k
EMIF04-EAR02M8
2
Application information
Application information
Figure 15. Example of application scheme using EMIF04-EAR02M8
VDD
EMIF04-EAR02M8
MIC_P
MIC_P
MIC_P_Ext
MIC_P_Int
MIC_N_Ext
EAR_R
EAR_R
EAR_Ext
MIC_N_Int
EAR_Int
EAR_L
EAR_L
MIC_N
GND
MIC_N
MIC_N
MIC_P
EAR_Int
EAR_Ext
EAR_R
EAR_L
Audio sub-system
Cable
3
Headset
connector
Ordering information scheme
Figure 16. Ordering information scheme
EMIF
yy
-
xxx zz
Mx
EMI Filter
Number of lines
Information
xxx = application
zz = version
Package
Mx = Micro QFN x leads
5/12
Package information
4
EMIF04-EAR02M8
Package information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 3.
Micro QFN dimensions
Dimensions
D
Ref.
N
E
2
1
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.50
0.55
0.60
0.020 0.022 0.024
A1
0.00
0.02
0.05
0.000 0.001 0.002
b
0.15
0.18
0.25
0.006 0.007 0.001
D
1.65
1.70
1.75
0.067
D2
1.15
1.3
1.4
0.045 0.051 0.055
E
1.45
1.50
1.55
0.059
E2
0.05
0.20
0.30
0.002 0.008 0.012
A
A1
D2
1
2
L
E2
k
e
b
N
e
Figure 17. Footprint
0.40
0.40
k
0.20
L
0.25
0.016
0.008
0.30
0.35
0.010 0.012 0.014
Figure 18. Marking
Dot: Pin1 identification
XX = Marking
0.20
0.60
0.32
0.26
2.10
1.32
6/12
XX
EMIF04-EAR02M8
Package information
Figure 19. Tape and reel specification
Ø 1.55 ± 0.05
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.05
3.5 ±- 0.1
8.0 ± 0.3
1.95 ± 0.1
0.25 ± 0.05
KA
KA
1.75 ± 0.1
KA
4.0 ± 0.1
0.70 ± 0.05
All dimensions in mm
Note:
User direction of unreeling
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin 1
mark is to be used for this purpose.
7/12
Recommendation on PCB assembly
EMIF04-EAR02M8
5
Recommendation on PCB assembly
5.1
Stencil opening design
1.
General recommendation on stencil opening design
a)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 20. Stencil opening dimensions
L
T
b)
W
General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio = ----- ≥ 1.5
T
L×W
Aspect Area = ---------------------------- ≥ 0.66
2T ( L + W )
2.
Reference design
a)
Stencil opening thickness: 100 µm
b)
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c)
Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 21. Recommended stencil window position
5 µm
5 µm
15 µm
570 µm
600 µm
T=100 µm
190 µm
15 µm
200 µm
1320 µm
260 µm
160 µm
50 µm
Footprint
1080 µm
50 µm
120 µm
8/12
120 µm
Stencil window
Footprint
EMIF04-EAR02M8
5.2
5.3
5.4
Recommendation on PCB assembly
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed
4.
Solder paste with fine particles: powder particle size is 20-45 µm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
3.
Standard tolerance of ±0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
9/12
Recommendation on PCB assembly
5.5
EMIF04-EAR02M8
Reflow profile
Figure 22. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
2°C/s recommended
2°C/s recommended
6°C/s max
6°C/s max
3°C/s max
3°C/s max
0
0
1
2
3
4
5
10-30 sec
90 to 150 sec
Note:
10/12
6
7
Time (min)
90 sec max
Minimize air convection currents in the reflow oven to avoid component movement.
EMIF04-EAR02M8
6
Ordering information
Ordering information
Table 4.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF04-EAR02M8
KA(1)
Micro QFN
3.8 mg
3000
Tape and reel
1. The marking can be rotated by 90° to differentiate assembly location
7
Revision history
Table 5.
Document revision history
Date
Revision
24-Mar-2009
1
Changes
Initial release
11/12
EMIF04-EAR02M8
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2009 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
12/12
Similar pages