ONSEMI NSDEMP11XV6T5

NSDEMP11XV6T1,
NSDEMP11XV6T5
Common Anode Quad
Array Switching Diode
These Common Anode Epitaxial Planar QUAD Diodes are
designed for use in ultra high speed switching applications. The
NSDEMP11XV6T1 device is housed in the SOT-563 package which
is designed for low power surface mount applications, where board
space is at a premium.
• Fast trr
• Low CD
• Available in 8 mm; 7 inch Tape and Reel
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(2)
(3)
(1)
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
VR
80
Vdc
Reverse Voltage
Peak Reverse Voltage
VRM
80
Vdc
IF
100
mAdc
IFM
300
mAdc
IFSM
(Note 1)
2.0
Adc
Forward Current
Peak Forward Current
Peak Forward Surge Current
(4)
6
MARKING
DIAGRAM
2
3
SOT-563
CASE 463A
PLASTIC
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
PD
357
(Note 2)
2.9
(Note 2)
mW
TA = 25°C
Derate above 25°C
RJA
350
(Note 2)
°C/W
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
P9 = Specific Device Code
D = Date Code
PD
500
(Note 2)
4.0
(Note 2)
mW
ORDERING INFORMATION
Device
TA = 25°C
Derate above 25°C
Junction and Storage Temperature
mW/°C
RJA
250
(Note 2)
°C/W
TJ, Tstg
- 55 to
+150
°C
Thermal Resistance Junction-to-Ambient
P9 D
mW/°C
Thermal Resistance Junction-to-Ambient
Total Device Dissipation
(6)
54
1
1. t = 1 S
Total Device Dissipation
(5)
Package
Shipping
NSDEMP11XV6T1
SOT-563
4 mm pitch
4000/Tape & Reel
NSDEMP11XV6T5
SOT-563
2 mm pitch
8000/Tape & Reel
2. FR-4 @ Minimum Pad
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Condition
Min
Max
Unit
Reverse Voltage Leakage Current
IR
VR = 70 V
-
0.1
Adc
Forward Voltage
VF
IF = 100 mA
-
1.2
Vdc
Reverse Breakdown Voltage
VR
IR = 100 A
-0
—
Vdc
CD
VR = 6.0 V, f = 1.0 MHz
-
3.5
pF
trr (Note 2)
IF = 5.0 mA, VR = 6.0 V, RL = 100 , Irr = 0.1 IR
-
4.0
ns
Diode Capacitance
Reverse Recovery Time
3. trr Test Circuit for NSDEMP11XV6T1 in Figure 4.
 Semiconductor Components Industries, LLC, 2003
February, 2003 - Rev. 1
1
Publication Order Number:
NSDEMP11XV6T1/D
NSDEMP11XV6T1, NSDEMP11XV6T5
TYPICAL ELECTRICAL CHARACTERISTICS
10
IR , REVERSE CURRENT (µA)
TA = 85°C
10
TA = −40°C
1.0
0.1
TA = 25°C
0.2
0.4
0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
0.001
1.2
TA = 150°C
TA = 25°C
10
0
Figure 1. Forward Voltage
50
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Reverse Current
1.75
CD , DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
100
1.5
1.25
1.0
0.75
0
2
4
6
8
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Diode Capacitance
tr
tp
t
IF
trr
t
10%
A
RL
Irr = 0.1 IR
90%
VR
tp = 2 s
tr = 0.35 ns
INPUT PULSE
RECOVERY TIME EQUIVALENT TEST CIRCUIT
Figure 4. Reverse Recovery Time Test Circuit for the NSDEMP11XV6T1
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2
IF = 5.0 mA
VR = 6 V
RL = 100 OUTPUT PULSE
NSDEMP11XV6T1, NSDEMP11XV6T5
INFORMATION FOR USING THE SOT-563 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm inches
SOT-563
SOT-563 POWER DISSIPATION
SOLDERING PRECAUTIONS
The power dissipation of the SOT-563 is a function of
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature
of the die, RJA, the thermal resistance from the device
junction to ambient, and the operating temperature, TA.
Using the values provided on the data sheet for the
SOT-563 package, PD can be calculated as follows:
PD =
The melting temperature of solder is higher than the
rated temperature of the device. When the entire device is
heated to a high temperature, failure to complete soldering
within a short time could result in device failure. Therefore, the following items should always be observed in
order to minimize the thermal stress to which the devices
are subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling.
TJ(max) - TA
RJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 150 milliwatts.
PD =
150°C - 25°C
833°C/W
= 150 milliwatts
The 833°C/W for the SOT-563 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 150 milliwatts. There are other alternatives to achieving higher
power dissipation from the SOT-563 package. Another
alternative would be to use a ceramic substrate or an
aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
* Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage
to the device.
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NSDEMP11XV6T1, NSDEMP11XV6T5
PACKAGE DIMENSIONS
SOT-563, 6 LEAD
CASE 463A-01
ISSUE O
A
-X-
5
6
1
2
C
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4
B
-Y-
3
D
G
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
J
5 PL
6
0.08 (0.003)
EMITTER 1
BASE 1
COLLECTOR 2
EMITTER 2
BASE 2
COLLECTOR 1
DIM
A
B
C
D
G
J
K
S
S
M
X Y
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
EMITTER 1
EMITTER2
BASE 2
COLLECTOR 2
BASE 1
COLLECTOR 1
CATHODE 1
CATHODE 1
ANODE/ANODE 2
CATHODE 2
CATHODE 2
ANODE/ANODE 1
STYLE 4:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
1.50
1.70
1.10
1.30
0.50
0.60
0.17
0.27
0.50 BSC
0.08
0.18
0.10
0.30
1.50
1.70
INCHES
MIN
MAX
0.059
0.067
0.043
0.051
0.020
0.024
0.007
0.011
0.020 BSC
0.003
0.007
0.004
0.012
0.059
0.067
COLLECTOR
COLLECTOR
BASE
EMITTER
COLLECTOR
COLLECTOR
Thermal Clad is a trademark of the Bergquist Company.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative.
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4
NSDEMP11XV6T1/D