NZQA5V6AXV5 Advance Information Low Capacitance Quad Array for ESD Protection This integrated transient voltage suppressor device (TVS) is designed for applications requiring transient overvoltage protection. It is intended for use in sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its integrated design provides very effective and reliable protection for four separate lines using only one package. These devices are ideal for situations where board space is at a premium. http://onsemi.com 5 1 2 3 4 Features • ESD Protection: IEC61000−4−2: Level 4 • • • • • ESD Protection: MILSTD 883C − Method 3015−6: Class 3 Four Separate Unidirectional Configurations for Protection Low Leakage Current < 1 A @ 3 V Power Dissipation: 380 mW Small SOT−553 SMT Package Low Capacitance (8 pF Typical @ 3 V) SOT−553 CASE 463A PLASTIC Benefits MARKING DIAGRAM • Provides Protection for ESD Industry Standards: IEC 61000, HBM • Protects the Line Against Transient Voltage Conditions in Either • • 5 Direction Minimize Power Consumption of the System Minimize PCB Board Space 4 TBD 1 2 3 TBD = Device Marking Typical Applications • • • • • Instrumentation Equipment Serial and Parallel Ports Microprocessor Based Equipment Notebooks, Desktops, Servers Cellular and Portable Equipment ORDERING INFORMATION Device This document contains information on a new product. Specifications and information herein are subject to change without notice. Semiconductor Components Industries, LLC, 2003 September, 2003 − Rev. P0 1 NZQA5V6AXV5T1 Package Shipping SOT−553 4000/Tape & Reel Publication Order Number: NZQA5V6AXV5/D NZQA5V6AXV5 MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Symbol Value Unit Peak Power Dissipation 8 X 20 s Double Exponential Waveform (Note 1) PPK 20 W Thermal Resistance − Junction to Ambient Above 25°C, Derate RJA 327 3.05 °C/W mW/°C Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −55 to +150 °C Lead Solder Temperature − Maximum 10 Seconds Duration TL 260 °C 1. Non−repetitive current pulse per Figure TBD. 2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR4 board with min. pad. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit VBR 5.3 5.6 5.9 V Leakage Current (VRWM = 3.0 V) IR − − 1.0 A Clamping Voltage 1 (IPP = 1.6 A, 8 X 20 s Waveform) VC − 10 TBD V Maximum Peak Pulse Current (8 X 20 s Waveform) IPP − 1.6 TBD A Junction Capacitance − (VR = 0 V, f = 1 MHz) Junction Capacitance − (VR = 3 V, f = 1 MHz) CJ − − 15 8.0 TBD TBD pF Breakdown Voltage (IT = 1 mA) (Note 3) 3. VBR is measured at pulse test current IT. http://onsemi.com 2 NZQA5V6AXV5 PACKAGE DIMENSIONS SOT−553, 5−LEAD CASE 463B−01 ISSUE O A −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. C K 4 1 2 B −Y− 3 D G J 5 PL 0.08 (0.003) DIM A B C D G J K S S M X Y http://onsemi.com 3 MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 NZQA5V6AXV5 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800−282−9855 Toll Free USA/Canada http://onsemi.com 4 NZQA5V6AXV5/D