AVAGO HLMP-S201-EF000 2 mm x 5 mm rectangular led lamp Datasheet

HLMP-S100, HLMP-S201, HLMP-S301,
HLMP-S400, HLMP-S401, HLMP-S501, HLMP-S600
2 mm x 5 mm Rectangular LED Lamps
Data Sheet
Description
Features
The HLMP-S100, -S201, -5301, -S400, -S401, -S501,
-S600 are epoxy encap­su­lated lamps in rectangular packages which are easily stacked in arrays or
used for discrete front panel indicators. Contrast and
light uniformity are enhanced by a special epoxy diffusion
and tinting process.
• Rectangular light emitting surface
The HLMP-S100 uses double heterojunction (DH)
absorbing substrate (AS) aluminum gallium arsenide
(AlGaAs) LEDs to produce outstanding light output over a
wide range of drive currents.
• Excellent for flush mounting on panels
• Choice of five bright colors
• Long life: solid state reliability
• Excellent uniformity of light output
Package Dimensions
5.46 (0.215)
4.95 (0.195)
5.18 (0.204)
4.93 (0.194)
0.46 (0.018)
SQ. NOMINAL
CATHODE LEAD
2.54 (0.100)
NOMINAL
25.40 (1.00) MIN.
BOTTOM VIEW
8.00 (0.315)
7.37 (0.290)
2.23 (0.088)
1.98 (0.078)
1.27 (0.50)
NOMINAL
2.41 (0.100)
2.03 (0.085)
SIDE VIEW
NOTES:
1. ALL DIMENSIONS ARE IN
MILLIMETERS (INCHES).
2. AN EPOXY MENISCUS MAY EXTEND
ABOUT 1 mm (0.040") DOWN THE LEADS.
3. THERE IS A MXIMUM 1 TAPER FROM
BASE TO THE TOP OF LAMP.
Selection Guide
Color
Part Number
Min.
Luminous Intensity Iv (mcd) at 20 mA
Typ.
AlGaAs Red
HLMP-S100
3.4
7.5
HER
HLMP-S201
Orange
Yellow
Green
Emerald Green[1]
Max.
–
HLMP-S201-D00xx
2.1
3.5
–
HLMP-S201-E00xx
3.4
7.5
–
HLMP-S201-EF0xx
3.4
7.5
10.8
HLMP-S400
2.1
3.5
–
HLMP-S401
3.4
7.5
–
HLMP-S301-B00xx
1.4
2.1
–
HLMP-S301-C00xx
2.2
4.0
–
HLMP-S301-CDBxx
2.2
4.0
7.2
HLMP-S501-C00xx
2.6
4.0
–
HLMP-S501-D00xx
4.2
8.0
–
HLMP-S501-DE0xx
4.2
8.0
13.4
HLMP-S600-A00xx
1.0
3.0
–
HLMP-S301
HLMP-S501
Note:
1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.
Part Numbering System
HLMP - S x xx - x x x xx
Mechanical Option
00: Bulk
02: Tape & Reel, Straight Leads
DG: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
B: Color Bins 2 & 3 only
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Brightness Level
00: Less Brightness
01: Higher Brightness
Color Options
1: AlGaAs Red
2: GaP HER
3: GaP Yellow
4: GaP Orange
5: GaP Green
6: GaP Emerald Green
Electrical/Optical Characteristics at TA = 25°C
Sym.
Description
2q1/2
Included Angle Between Half
All
110
Deg.
Luminous Intensity Points
Device HLMP-
Min.
Typ.
Max.
Units
Test Conditions
IF = 20 mA
See Note 1
lPEAK
Peak Wavelength
AlGaAs Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green
645
nm
635
600
583
565
558
Measurement at
Peak
ld
Dominant Wavelength
AlGaAs Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green
637
nm
626
602
585
569
560
See Note 2
Time const, e-t/ts
ts
Speed of Response
AlGaAs Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green
30
90
280
90
500
3100
ns
C
Capacitance
AlGaAs Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green
30
11
4
15
18
35
pF
VF = 0; f = 1 MHz
RqJ-PIN
Thermal Resistance
All
260
°C/W
Junction to Cathode
Lead at Seating
Plane
VF
Forward Voltage
AlGaAs Red
HER/Orange
Yellow
Green/Emerald
Green
1.6
1.5
1.5
1.5
V
IF = 20 mA
VR
All
5.0
V
IR = 100 mA
lumens/
watt
See Note 3
Reverse Breakdown Voltage
hV
Luminous Efficacy
AlGaAs Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green
1.8
1.9
2.1
2.2
2.2
2.6
2.6
3.0
80
145
380
500
595
656
Notes:
1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/watt.
4. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.
Absolute Maximum Ratings at TA = 25°C
Parameter
AlGaAs Red
High Efficiency Red/
Orange
Green/
Yellow
Emerald Green
Units
Peak Forward Current
300
90
60
90
mA
Average Forward Current[1]
20
25
20
25
mA
DC Current[2]
30
30
20
30
mA
Transient Forward Current[3]
(10 µsec Pulse)
500
500
500
500
mA
LED Junction Temperature
110
110
110
110
°C
Operating Temperature Range
-20 to +100
-40 to +100
-40 to +100
-20 to +100
°C
Storage Temperature Range
-40 to +100
-40 to +100
-40 to +100
-40 to +100
°C
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. For AlGaAs Red, Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.34 mA/°C.
3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wire
bond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum
Ratings.
RELATIVE INTENSITY
1.0
ORANGE
EMERALD GREEN
HIGH
PERFORMANCE
GREEN
HIGH EFFICIENCY RED
0.5
YELLOW
0
500
550
600
650
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
TA = 25 C
AlGaAs RED
700
750
70
60
RED
50
YELLOW
40
30
20
GREEN/EMERALD GREEN
10
0
1.0
2.0
1.3
3.0
4.0
2.0
HER, YELLOW,
EMERALD GREEN
1.5
1.0
AlGaAs RED
0.5
5.0
0
5
10
1
1
10
RATIO OF MAXIMUM PEAK CURRENT
TO TEMPERATURE DERATED
MAXIMUM DC CURRENT
1.0
0.8
0.6
0.4
0.2
20
30
40
50
Figure 6. Relative luminous intensity vs. angular displacement.
1000
tp – PULSE DURATION – s
AlGaAs RED
0
10
100
z
IPEAK MAX.
IDC MAX.
2
60
70
80
90 100
300 H
IPEAK MAX.
IDC MAX.
Hz
3
1 KHz
10,000
100
1000
4
z
90
0
10
20
30
40
50
60
70
80
Figure 4. Relative efficiency (luminous intensity
per unit current) vs. LED peak current. hv
(300 mA) for AlGaAs Red = 0.7.
3 KHz
80
0.4
30
5
60
70
0.6
IPEAK – PEAK SEGMENT CURRENT – mA
10 KH
50
25
10
9
8
7
6
Figure 5. Maximum tolerable peak current vs. peak duration.
(IPEAK MAX determined from temperature derated IDC MAX).
40
AlGaAs RED
0.7
ATE –
RATIO OF MAXIMUM TOLERABLE
PEAK CURRENT TO MAXIMUM
TOLERABLE DC CURRENT
20
tP – PULSE DURATION – s
HER, ORANGE, YELLOW, and GREEN
30
0.8
SH R
1.5
10
RED/ORANGE
0.9
EFRE
z
z
100 H
z
300 H
1 KHz
3 KHz
z
10 KH
Hz
30 KH
100 K
2.0
20
GREEN
f–R
3.0
100
15
Figure 3. Relative luminous intensity vs. DC
forward current.
4.0
10
1.0
IDC – DC CURRENT PER LED – mA
Figure 2. Forward current vs. forward voltage
characteristics. VF (300 mA) for AlGaAs Red = 2.6
volts typical.
1
YELLOW
1.1
0.5
0
VF – FORWARD VOLTAGE – V
1.0
EMERALD GREEN
1.2
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
2.5
AlGaAs
RED
80
ηPEAK – RELATIVE EFFICIENCY
(NORMALIZED AT 20 mA)
90
10000
90
Intensity Bin Limits
Color
Bin
Red/Orange
Yellow
Intensity Range (mcd)
Min.
Max.
D
2.4
3.8
E
3.8
6.1
F
6.1
9.7
G
9.7
15.5
H
15.5
24.8
I
24.8
J
39.6
K
Intensity Bin Limits, continued
Color
Bin
Intensity Range (mcd)
Min.
Max.
A
1.1
1.8
B
1.8
2.9
C
2.9
4.7
D
4.7
7.6
39.6
E
7.6
12.0
63.4
F
12.0
19.1
63.4
101.5
G
19.1
30.7
L
101.5
162.4
H
30.7
49.1
M
162.4
234.6
I
49.1
78.5
N
234.6
340.0
J
78.5
125.7
O
340.0
540.0
Green/
K
125.7
201.1
P
540.0
850.0
Emerald Green
L
201.1
289.0
Q
850.0
1200.0
M
289.0
417.0
R
1200.0
1700.0
N
417.0
680.0
S
1700.0
2400.0
O
680.0
1100.0
T
2400.0
3400.0
P
1100.0
1800.0
U
3400.0
4900.0
Q
1800.0
2700.0
V
4900.0
7100.0
R
2700.0
4300.0
W
7100.0
10200.0
S
4300.0
6800.0
X
10200.0
14800.0
T
6800.0
10800.0
Y
14800.0
21400.0
U
10800.0
16000.0
Z
21400.0
30900.0
V
16000.0
25000.0
B
1.6
2.5
W
25000.0
40000.0
C
2.5
4.0
D
4.0
6.5
E
6.5
10.3
F
10.3
16.6
G
16.6
26.5
H
26.5
42.3
I
42.3
67.7
J
67.7
108.2
K
108.2
173.2
L
173.2
250.0
M
250.0
360.0
N
360.0
510.0
O
510.0
800.0
P
800.0
1250.0
Q
1250.0
1800.0
R
1800.0
2900.0
S
2900.0
4700.0
T
4700.0
7200.0
U
7200.0
11700.0
V
11700.0
18000.0
W
18000.0
27000.0
Maximum tolerance for each bin limit is ±18%.
Color Categories
Lambda (nm)
Color
Category #
Min.
Max.
9
552.5
555.5
8
555.5
558.5
7
558.5
561.5
6
561.5
564.5
6
561.5
564.5
5
564.5
567.5
4
567.5
570.5
3
570.5
573.5
2
573.5
576.5
1
582.0
584.5
3
584.5
587.0
2
587.0
589.5
4
589.5
592.0
5
592.0
593.0
1
597.0
599.5
2
599.5
602.0
3
602.0
604.5
4
604.5
607.5
5
607.5
610.5
6
610.5
613.5
7
613.5
616.5
8
616.5
619.5
Emerald Green
Green
Yellow
Orange
Tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical Option Code
Definition
00
Bulk Packaging, minimum increment 500 pcs/bag
02
Tape & Reel, straight leads, minimum increment 1300 pcs/bag
DG
Ammo Pack, straight leads with minimum increment 2K/pack
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative
for further clarification/information.
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
LED Component Lead Size
Diagonal
Plated Through Hole Diameter
Wave Soldering
Manual Solder
Dipping
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
Pre-heat Temperature
105°C Max.
–
Pre-heat Time
30 sec Max.
–
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Peak Temperature
250°C Max.
260°C Max.
Dwell Time
3 sec Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
Note:
Refer to application note AN1027 for more information on soldering
LED components.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
TEMPERATURE – C
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
150
FLUXING
100
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4266EN
AV02-1563EN - October 13, 2008
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