TI1 LM5107MA 1.4a peak half bridge gate driver Datasheet

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LM5107
SNVS333E – NOVEMBER 2004 – REVISED MARCH 2016
LM5107 100V / 1.4A Peak Half Bridge Gate Driver
1 Features
3 Description
•
The LM5107 is a low cost high voltage gate driver,
designed to drive both the high side and the low side
N-Channel MOSFETs in a synchronous buck or a
half bridge configuration. The floating high-side driver
is capable of working with rail voltages up to 100V.
The outputs are independently controlled with TTL
compatible input thresholds. An integrated on chip
high voltage diode is provided to charge the high side
gate drive bootstrap capacitor. A robust level shifter
technology operates at high speed while consuming
low power and providing clean level transitions from
the control input logic to the high side gate driver.
Under-voltage lockout is provided on both the low
side and the high side power rails. The device is
available in the SOIC and the thermally enhanced
WSON packages.
1
•
•
•
•
•
•
•
•
•
•
•
Drives Both a High Side and Low Side N-Channel
MOSFET
High Peak Output Current (1.4A Sink / 1.3A
Source)
Independent TTL compatible inputs
Integrated Bootstrap Diode
Bootstrap Supply Voltage to 118V DC
Fast Propagation Times (27 ns Typical)
Drives 1000 pF Load with 15ns Rise and Fall
Times
Excellent Propagation Delay Matching (2 ns
Typical)
Supply Rail Under-Voltage Lockout
Low Power Consumption
Pin Compatible with ISL6700
Packages:
– SOIC
– WSON (4 mm x 4 mm)
2 Applications
•
•
•
•
Device Information(1)
PART NUMBER
LM5107
PACKAGE
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
WSON (8)
4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Block Diagram
Current Fed Push-Pull Converters
Half and Full Bridge Power Converters
Solid State Motor Drives
Two Switch Forward Power Converters
HV
HB
HO
UVLO
LEVEL
SHIFT
DRIVER
HS
HI
VDD
UVLO
LO
DRIVER
LI
VSS
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM5107
SNVS333E – NOVEMBER 2004 – REVISED MARCH 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
7
Detailed Description ............................................ 10
8
Application and Implementation ........................ 11
9
Layout ................................................................... 12
6.1
6.2
6.3
6.4
6.5
6.6
3
4
4
5
6
7
10 Device and Documentation Support ................. 13
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Electrical Characteristics .........................................
Switching Characteristics.........................................
Typical Performance Characteristics ........................
7.1 Functional Block Diagram ....................................... 10
8.1 Application Information............................................ 11
9.1 Layout Guidelines ................................................... 12
10.1
10.2
10.3
10.4
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
13
13
13
13
11 Mechanical, Packaging, and Orderable
Information ........................................................... 13
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2013) to Revision E
•
Added Device Information table, ESD Ratings, Pin Configuration and Functions section, Detailed Description
section, Application and Implementation section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Changes from Revision C (March 2013) to Revision D
•
2
Page
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 11
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5 Pin Configuration and Functions
D and NGT Packages
8-Pin SOIC, WSON
Top View
VDD
1
8
HB
HI
2
7
HO
LI
3
6
HS
VSS
4
5
LO
Pin Functions (1)
Pin #
Name
Description
Application Information
SOIC
WSON
1
1
VDD
Positive gate drive supply
Locally decouple to VSS using low ESR/ESL capacitor located as
close to IC as possible.
2
2
HI
High side control input
The LM5107 HI input is compatible with TTL input thresholds.
Unused HI input should be tied to ground and not left open
3
3
LI
Low side control input
The LM5107 LI input is compatible with TTL input thresholds. Unused
LI input should be tied to ground and not left open.
4
4
VSS
Ground reference
All signals are referenced to this ground.
5
5
LO
Low side gate driver output
Connect to the gate of the low side N-MOS device.
6
6
HS
High side source connection
Connect to the negative terminal of the bootstrap capacitor and to the
source of the high side N-MOS device.
7
7
HO
High side gate driver output
Connect to the gate of the low side N-MOS device.
8
8
HB
High side gate driver positive
supply rail
Connect the positive terminal of the bootstrap capacitor to HB and
the negative terminal of the bootstrap capacitor to HS. The bootstrap
capacitor should be placed as close to IC as possible.
(1)
For WSON package it is recommended that the exposed pad on the bottom of the LM5107 be soldered to ground plane on the PCB
board and the ground plane should extend out from underneath the package to improve heat dissipation.
6 Specifications
6.1 Absolute Maximum Ratings
See
(1) (2)
VDD to VSS
-0.3V to 18V
HB to HS
−0.3V to 18V
LI or HI to VSS
−0.3V to VDD +0.3V
LO to VSS
−0.3V to VDD +0.3V
HO to VSS
VHS −0.3V to VHB +0.3V
HS to VSS (3)
−5V to 100V
HB to VSS
118V
Junction Temperature
-40°C to +150°C
Storage Temperature Range
−55°C to +150°C
(1)
(2)
(3)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics .
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
In the application the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS voltage will generally
not exceed -1V. However in some applications, board resistance and inductance may result in the HS node exceeding this stated
voltage transiently. If negative transients occur on HS, the HS voltage must never be more negative than VDD - 15V. For example, if VDD
= 10V, the negative transients at HS must not exceed -5V.
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6.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM) (1)
VALUE
UNIT
±2000
V
The human body model is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. Pin 6 , Pin 7 and Pin 8 are rated at
500V.
6.3 Recommended Operating Conditions
VDD
HS
8V to 14V
(1)
−1V to 100V
HB
VHS +8V to VHS +14V
HS Slew Rate
< 50 V/ns
−40°C to +125°C
Junction Temperature
(1)
4
In the application the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS voltage will generally
not exceed -1V. However in some applications, board resistance and inductance may result in the HS node exceeding this stated
voltage transiently. If negative transients occur on HS, the HS voltage must never be more negative than VDD - 15V. For example, if VDD
= 10V, the negative transients at HS must not exceed -5V.
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6.4
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Electrical Characteristics
Specifications in standard typeface are for TJ = +25°C, and those in boldface type apply over the full operating junction
temperature range. Unless otherwise specified, VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO.
Symbol
Parameter
Conditions
Min (1)
Typ
Max (1)
Units
SUPPLY CURRENTS
IDD
VDD Quiescent Current
LI = HI = 0V
0.3
0.6
mA
IDDO
VDD Operating Current
f = 500 kHz
2.1
3.4
mA
IHB
Total HB Quiescent Current
LI = HI = 0V
0.06
0.2
mA
IHBO
Total HB Operating Current
f = 500 kHz
1.6
3.0
mA
IHBS
HB to VSS Current, Quiescent
VHS = VHB = 100V
0.1
10
IHBSO
HB to VSS Current, Operating
f = 500 kHz
0.5
µA
mA
INPUT PINS LI and HI
VIL
Low Level Input Voltage Threshold
VIH
High Level Input Voltage Threshold
RI
Input Pulldown Resistance
0.8
1.8
V
1.8
2.2
V
100
180
500
kΩ
6.0
6.9
7.4
V
UNDER VOLTAGE PROTECTION
VDDR
VDD Rising Threshold
VDDH
VDD Threshold Hysteresis
VHBR
HB Rising Threshold
VHBH
HB Threshold Hysteresis
VDDR = VDD - VSS
0.5
VHBR = VHB - VHS
5.7
6.6
V
7.1
V
0.4
V
BOOT STRAP DIODE
VDL
Low-Current Forward Voltage
IVDD-HB = 100 µA
VDL = VDD - VHB
0.58
0.9
V
VDH
High-Current Forward Voltage
IVDD-HB = 100 mA
VDH = VDD - VHB
0.82
1.1
V
RD
Dynamic Resistance
IVDD-HB = 100 mA
0.8
1.5
Ω
LO GATE DRIVER
VOLL
Low-Level Output Voltage
ILO = 100 mA
VOHL = VLO – VSS
0.28
0.45
V
VOHL
High-Level Output Voltage
ILO = −100 mA,
VOHL = VDD– VLO
0.45
0.75
V
IOHL
Peak Pullup Current
VLO = 0V
1.3
A
IOLL
Peak Pulldown Current
VLO = 12V
1.4
A
HO GATE DRIVER
VOLH
Low-Level Output Voltage
IHO = 100 mA
VOLH = VHO– VHS
0.28
0.45
V
VOHH
High-Level Output Voltage
IHO = −100 mA
VOHH = VHB– VHO
0.45
0.75
V
IOHH
Peak Pullup Current
VHO = 0V
1.3
A
IOLH
Peak Pulldown Current
VHO = 12V
1.4
A
SOIC
160
WSON (3)
40
THERMAL RESISTANCE
θJA (2)
(1)
(2)
(3)
Junction to Ambient
°C/W
Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
The θJA is not a constant for the package and depends on the printed circuit board design and the operating conditions.
4 layer board with Cu finished thickness 1.5/1/1/1.5 oz. Maximum die size used. 5x body length of Cu trace on PCB top. 50 x 50mm
ground and power planes embedded in PCB. See Application Note AN-1187.
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6.5
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Switching Characteristics
Specifications in standard typeface are for TJ = +25°C, and those in boldface type apply over the full operating junction
temperature range. Unless otherwise specified, VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO.
Symbol
Parameter
Min (1)
Conditions
Typ
Max (1)
Units
LM5100A
tLPHL
Lower Turn-Off Propagation Delay
(LI Falling to LO Falling)
27
56
ns
tHPHL
Upper Turn-Off Propagation Delay
(HI Falling to HO Falling)
27
56
ns
tLPLH
Lower Turn-On Propagation Delay
(LI Rising to LO Rising)
29
56
ns
tHPLH
Upper Turn-On Propagation Delay
(HI Rising to HO Rising)
29
56
ns
tMON
Delay Matching: Lower Turn-On and Upper
Turn-Off
2
15
ns
tMOFF
Delay Matching: Lower Turn-Off and Upper
Turn-On
2
15
ns
tRC, tFC
Either Output Rise/Fall Time
15
-
ns
tPW
Minimum Input Pulse Width that Changes
the Output
tBS
Bootstrap Diode Turn-Off Time
(1)
CL = 1000 pF
IF = 100 mA, IR = 100 mA
50
ns
105
ns
Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
LI
LI
HI
tHPLH
tLPLH
HI
tHPHL
tLPHL
LO
LO
HO
HO
tMON
tMOFF
Figure 1. Timing Diagram
6
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6.6 Typical Performance Characteristics
100
100
VDD = VHB = 12V
VDD = VHB = 12V
VSS = VHS = 0V
VSS = VHS = 0V
10
10
IDDO (mA)
CL = 2200 pF
IDDO (mA)
CL = 1000 pF
CL = 1000 pF
CL = 4400 pF
CL = 2200 pF
CL = 4400 pF
1
1
CL = 0 pF
0.1
CL = 0 pF
CL = 470 pF
CL = 470 pF
0.1
0.01
1
10
100
1000
1
10
FREQUENCY (kHz)
100
1000
FREQUENCY (kHz)
Figure 2. VDD Operating Current vs Frequency
Figure 3. HB Operating Current vs Frequency
0.45
2.4
0.40
IDDO
0.35
CL = 0 pF
f = 500 kHz
2.0
IDD, IHB (mA)
IDDO, IHBO (mA)
2.2
VDD = VHB = 12V
1.8
VSS = VHS = 0V
1.6
IHBO
IDDO
0.30
0.25 LI = HI = 0V
VDD = VHB = 12V
0.20
VSS = VHS = 0V
0.15
0.10
1.4
IHBO
0.05
0.00
-40 -25 -10 5 20 35 50 65 80 95 110 125
1.2
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (oC)
TEMPERATURE (oC)
Figure 5. Quiescent Current vs Temperature
Figure 4. Operating Current vs Temperature
600
44
CL = 0 pF
VDD = VHB
VDD = VHB = 12V
CURRENT (PA)
VSS= VHS = 0V
IDD
400
300
200
IHB
100
40
PROPAGATION DELAY (ns)
500
LI = HI = 0V
VSS = VHS = 0V
36
turn off
32
tHPLH
28
24
0
8
10
12
14
16
tLPHL
tHPHL
tLPLH
turn on
20
-40 -25 -10 5 20 35 50 65 80 95 110 125
18
VDD, VHB (V)
TEMPERATURE (oC)
Figure 6. Quiescent Current vs Voltage
Figure 7. Propagation Delay vs Temperature
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Typical Performance Characteristics (continued)
0.5
0.9
Output Current : -100 mA
VSS = VHS = 0V
Output Current : -100 mA
0.8
VSS = VHS = 0V
0.4
0.7
VDD = VHB = 8V
0.6
VOL (V)
VOH (V)
VDD = VHB = 8V
0.5
0.3
VDD = VHB = 12V
0.4
VDD = VHB = 12V
0.3
0.2
VDD = VHB =16V
VDD = VHB =16V
0.2
0.1
-40 -25 -10 5 20 35 50 65 80 95 110 125
0.1
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (oC)
TEMPERATURE (oC)
Figure 8. LO and HO High Level Output Voltage vs
Temperature
Figure 9. LO and HO Low Level Output Voltage vs
Temperature
1.6
1.00E-01
VDD = VHB = 12V
VSS = VHS = 0V
25°C
1
1.00E-03
0.8
Pull-up Current
-40°C
1.00E-04
0.6
0.4
1.00E-05
0.2
Pull-down Current
0
0
2
4
6
8
10
12
1.00E-06
0.2
VLO, VHO (V)
6.9
0.5
0.6
0.7
0.8
0.9
0.50
VDDR = VDD - VSS
0.48
VHBR = VHB - VHS
0.46
6.8
6.7
0.4
Figure 11. Doide Forward Voltage
HYSTERESIS (V)
7.0
0.3
FORWARD VOLTAGE
Figure 10. HO and LO Peak Output Current vs Output
Voltage
THRESHOLD (V)
150°C
1.00E-02
1.2
ID (A)
OUTPUT CURRENTS (A)
1.4
VDDR
VHBR
6.6
0.44
VDDH
0.42
0.40
0.38
VHBH
0.36
6.5
0.34
6.4
0.32
0.30
-40 -25 -10 5 20 35 50 65 80 95 110 125
6.3
-40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (oC)
TEMPERATURE (oC)
Figure 12. Undervoltage Rising Thresholds vs Temperature
8
Figure 13. Undervoltage Hysteresis vs Temperature
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Typical Performance Characteristics (continued)
1.92
VDD = 12V
1.95
INPUT THRESHOLD VOLTAGE (V)
INPUT THRESHOLD VOLTAGE (V)
2.00
VSS = 0V
Rising
1.90
1.85
Falling
1.80
1.75
1.91
Rising
1.90
1.89
1.88
1.87
1.86
1.85
Falling
1.84
1.83
1.82
1.81
1.70
1.80
8
-40 -25 -10 5 20 35 50 65 80 95 110 125
9
10
11
12
13
14
15
16
VDD (V)
TEMPERATURE (oC)
Figure 14. Input Thresholds vs Temperature
Figure 15. Input Thresholds vs Supply Voltage
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7 Detailed Description
7.1 Functional Block Diagram
HV
HB
HO
UVLO
LEVEL
SHIFT
DRIVER
HS
HI
VDD
UVLO
LO
DRIVER
LI
VSS
10
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 HS Transient Voltages Below Ground
The HS node will always be clamped by the body diode of the lower external FET. In some situations, board
resistances and inductances can cause the HS node to transiently swing several volts below ground. The HS
node can swing below ground provided:
1. HS must always be at a lower potential than HO. Pulling HO more than -0.3V below HS can activate
parasitic transistors resulting in excessive current to flow from the HB supply possibly resulting in damage to
the IC. The same relationship is true with LO and VSS. If necessary, a Schottky diode can be placed
externally between HO and HS or LO and GND to protect the IC from this type of transient. The diode must
be placed as close to the IC pins as possible in order to be effective.
2. HB to HS operating voltage should be 15V or less . Hence, if the HS pin transient voltage is -5V, VDD should
be ideally limited to 10V to keep HB to HS below 15V.
3. A low ESR bypass capacitor between HB to HS as well as VDD to VSS is essential for proper operation. The
capacitor should be located at the leads of the IC to minimize series inductance. The peak currents from LO
and HO can be quite large. Any series inductances with the bypass capacitor will cause voltage ringing at the
leads of the IC which must be avoided for reliable operation.
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9 Layout
9.1 Layout Guidelines
The optimum performance of high and low side gate drivers cannot be achieved without taking due
considerations during circuit board layout. Following points are emphasized.
1. A low ESR / ESL capacitor must be connected close to the IC, and between VDD and VSS pins and between
HB and HS pins to support high peak currents being drawn from VDD during turn-on of the external
MOSFET.
2. To prevent large voltage transients at the drain of the top MOSFET, a low ESR electrolytic capacitor must be
connected between MOSFET drain and ground (VSS).
3. In order to avoid large negative transients on the switch node (HS) pin, the parasitic inductances in the
source of top MOSFET and in the drain of the bottom MOSFET (synchronous rectifier) must be minimized.
4. Grounding Considerations:
–
The first priority in designing grounding connections is to confine the high peak currents from charging
and discharging the MOSFET gate in a minimal physical area. This will decrease the loop inductance and
minimize noise issues on the gate terminal of the MOSFET. The MOSFETs should be placed as close as
possible to the gate driver.
–
The second high current path includes the bootstrap capacitor, the bootstrap diode, the local ground
referenced bypass capacitor and low side MOSFET body diode. The bootstrap capacitor is recharged on
the cycle-by-cycle basis through the bootstrap diode from the ground referenced VDD bypass capacitor.
The recharging occurs in a short time interval and involves high peak current. Minimizing this loop length
and area on the circuit board is important to ensure reliable operation.
12
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10 Device and Documentation Support
10.1 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
10.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
10.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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16-Mar-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM5107MA/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L5107
MA
LM5107MAX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L5107
MA
LM5107SD/NOPB
ACTIVE
WSON
NGT
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L5107SD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2016
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Mar-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM5107MAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5107SD/NOPB
WSON
NGT
8
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Mar-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM5107MAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM5107SD/NOPB
WSON
NGT
8
1000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NGT0008A
SDC08A (Rev A)
www.ti.com
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