Renesas BCR08AS-12 Triac low power use Datasheet

BCR08AS-12
Triac
Low Power Use
REJ03G0292-0200
Rev.2.00
Mar 22, 2007
Features
•
•
•
•
• Non-Insulated Type
• Planar Passivation Type
• Completed Pb Free
IT (RMS) : 0.8 A
VDRM : 600 V
IFGTI, IRGTI, IRGT : 5 mA
IFGT : 10 mA
Outline
RENESAS Package code: PLZZ0004CA-A
(Package name: UPAK)
1
2
RENESAS Package code: PLZZ0004CB-A
LZ
ZZ0004
(Package name: SOT-89))
2, 4
3
4
1
2
4
3
3
1.
2.
3.
4.
1
T1 Terminal
T2 Terminal
Gate Terminal
T2 Terminal
Applications
Hybrid IC, solid state relay, electric fan, washing machine, and other general purpose control applications
Maximum Ratings
Parameter
Symbol
Voltage class
12 (Mark BF)
Unit
VDRM
VDSM
600
720
V
V
Repetitive peak off-state voltageNote1
Non-repetitive peak off-state voltageNote1
Parameter
RMS on-state current
Symbol
IT (RMS)
Ratings
0.8
Unit
A
Surge on-state current
ITSM
8
A
I2 t
0.26
A2s
PGM
PG (AV)
VGM
IGM
Tj
Tstg
1
0.1
10
1
– 40 to +125
– 40 to +125
W
W
V
A
°C
°C
—
50
mg
I2t for fusing
Peak gate power dissipation
Average gate power dissipation
Peak gate voltage
Peak gate current
Junction temperature
Storage temperature
Mass
Notes: 1. Gate open.
REJ03G0292-0200 Rev.2.00 Mar 22, 2007
Page 1 of 7
Conditions
Commercial frequency, sine full wave
Note3
360° conduction, Ta = 40°C
60Hz sinewave 1 full cycle, peak value,
non-repetitive
Value corresponding to 1 cycle of half
wave 60Hz, surge on-state current
Typical value
BCR08AS-12
Electrical Characteristics
Parameter
Repetitive peak off-state current
On-state voltage
Gate trigger voltageNote2
Gate trigger currentNote2
Gate non-trigger voltage
Thermal resistance
Critical-rate of rise of off-state
Note4
commutating voltage
Ι
ΙΙ
ΙΙΙ
ΙV
Ι
ΙΙ
ΙΙΙ
ΙV
Symbol
IDRM
VTM
Min.
—
—
Typ.
—
—
Max.
2.0
2.0
Unit
mA
V
Test conditions
Tj = 125°C, VDRM applied
VFGTΙ
VRGTΙ
VRGTΙΙΙ
VFGTΙΙΙ
IFGTΙ
IRGTΙ
IRGTΙΙΙ
IFGTΙΙΙ
VGD
Rth (j-a)
—
—
—
—
—
—
—
—
0.1
—
—
—
—
—
—
—
—
—
—
—
2.0
2.0
2.0
2.0
5
5
5
10
—
65
V
V
V
V
mA
mA
mA
mA
V
°C/W
Tj = 25°C, VD = 6 V, RL = 6 Ω,
RG = 330 Ω
Tj = 125°C, VD = 1/2 VDRM
Junction to ambientNote3
(dv/dt)c
0.5
—
—
V/µs
Tj = 125°C
Tc = 25°C, ITM = 1.2 A,
Instantaneous measurement
Tj = 25°C, VD = 6 V, RL = 6 Ω,
RG = 330 Ω
Notes: 2. Measurement using the gate trigger characteristics measurement circuit.
3. Soldering with ceramic plate (25 mm × 25 mm × t0.7 mm).
4. Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below.
Test conditions
1. Junction temperature
Tj = 125°C
2. Rate of decay of on-state commutating current
(di/dt)c = – 0.4 A/ms
3. Peak off-state voltage
VD = 400 V
REJ03G0292-0200 Rev.2.00 Mar 22, 2007
Page 2 of 7
Commutating voltage and current waveforms
(inductive load)
Supply Voltage
Time
Main Current
(di/dt)c
Time
Main Voltage
(dv/dt)c
Time
VD
BCR08AS-12
Performance Curves
101
7
5
4
3
2
102
7
5
3
2
101
7
5
3
2
100
7
5
3
2
Surge On-State Current (A)
Tj = 125°C
Tj = 25°C
0
1
2
3
4
Gate Trigger Voltage (Tj = t°C)
× 100 (%)
Gate Trigger Voltage (Tj = 25°C)
102
7
5
4
3
2
6
4
2
2 3 4 5 7 101
2 3 4 5 7 102
On-State Voltage (V)
Conduction Time (Cycles at 60Hz)
Gate Characteristics
Gate Trigger Current vs.
Junction Temperature
VGM = 10V
PGM = 1W
PG(AV)
= 0.1W
VGT
IFGT I,
IRGT I, IRGT III
IGM = 1A
IFGT III
VGD = 0.2V
10–1
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103
103
7
5
4
3
2
8
0
100
5
Gate Trigger Current (Tj = t°C)
× 100 (%)
Gate Trigger Current (Tj = 25°C)
Gate Voltage (V)
10
100
7
5
4
3
2
10–1
Rated Surge On-State Current
103
7
5
4
3
2
Typical Example
IFGT III
IFGT I, IRGT III, IRGT I
102
7
5
4
3
2
101
–60 –40 –20 0 20 40 60 80 100 120 140
Gate Current (mA)
Junction Temperature (°C)
Gate Trigger Voltage vs.
Junction Temperature
Maximum Transient Thermal Impedance
Characteristics (Junction to ambient)
Typical Example
VFGT I VFGT III
VRGT I VRGT III
101
–60 –40 –20 0 20 40 60 80 100 120 140
Junction Temperature (°C)
REJ03G0292-0200 Rev.2.00 Mar 22, 2007
Page 3 of 7
Transient Thermal Impedance (°C/W)
On-State Current (A)
Maximum On-State Characteristics
102 2 3 5 7 103 2 3 5 7 104 2 3 5 7 105
103
7 * 25mm×25mm×t0.7mm
5 Ceramic plate
3
2
102
7
5
3
2
Junction to ambient *
101
7
5
3
2
100
10–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
Conduction Time (Cycles at 60Hz)
BCR08AS-12
Allowable Ambient Temperature vs.
RMS On-State Current
Maximum On-State Power Dissipation
160
1.2
0.8
0.4
Latching Current (mA)
0
0.4
0.8
1.2
1.6
25mm×25mm×t0.7mm
140 Ceramic plate
120
Curves apply regardless
of conduction angle
Resistive, inductive loads
Natural convection
100
80
60
40
20
0
2.0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
RMS On-State Current (A)
RMS On-State Current (A)
Repetitive Peak Off-State Current vs.
Junction Temperature
Holding Current vs.
Junction Temperature
105
7 Typical Example
5
3
2
104
7
5
3
2
103
7
5
3
2
102
–60 –40 –20 0 20 40 60 80 100 120 140
102
7
5
3
2
Holding Current (Tj = t°C)
× 100 (%)
Holding Current (Tj = 25°C)
Repetitive Peak Off-State Current (Tj = t°C)
× 100 (%)
Repetitive Peak Off-State Current (Tj = 25°C)
0
360° Conduction
Resistive,
inductive loads
Ambient Temperature (°C)
1.6
103
7
5
Typical Example
3
2
102
7
5
3
2
101
–60 –40 –20 0 20 40 60 80 100 120 140
Junction Temperature (°C)
Junction Temperature (°C)
Latching Current vs.
Junction Temperature
Breakover Voltage vs.
Junction Temperature
Distribution
T2+, G–
Typical Example
101
7
5
3
2
100
7
5
3 T2+, G+ 
2 T2–, G– Typical Example
T2–, G+ 
10–1
0
40
80
–40
120
Junction Temperature (°C)
REJ03G0292-0200 Rev.2.00 Mar 22, 2007
Page 4 of 7
160
Breakover Voltage (Tj = t°C)
× 100 (%)
Breakover Voltage (Tj = 25°C)
On-State Power Dissipation (W)
2.0
160
Typical Example
140
120
100
80
60
40
20
0
–60 –40 –20 0 20 40 60 80 100120 140
Junction Temperature (°C)
Breakover Voltage vs.
Rate of Rise of Off-State Voltage
Commutation Characteristics
101
160
Typical Example
Tj = 125°C
140
120
I Quadrant
100
80
60
40
III Quadrant
20
0
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103
Critical Rate of Rise of Off-State
Commutating Voltage (V/µs)
Breakover Voltage (dv/dt = xV/µs)
× 100 (%)
Breakover Voltage (dv/dt = 1V/µs)
BCR08AS-12
3
2
100
7
5
Gate Trigger Current (tw)
× 100 (%)
Gate Trigger Current (DC)
103
7
5
4
3
2
Typical Example
Minimum
10–1
10–1
2
3
I Quadrant
5 7 100
6Ω
Gate Current Pulse Width (µs)
REJ03G0292-0200 Rev.2.00 Mar 22, 2007
Page 5 of 7
5 7 101
6Ω
A
A
6V
330Ω
330Ω
V
Test Procedure I
Test Procedure II
6Ω
6Ω
A
6V
2 3 4 5 7 102
3
Gate Trigger Characteristics Test Circuits
V
2 3 4 5 7 101
2
Rate of Decay of On-State
Commutating Current (A/ms)
6V
102
7 IRGT I IRGT III IFGT I
5
IFGT III
4
3
2
101 0
10
III Quadrant
3 Characteristics
2 Value
Rate of Rise of Off-State Voltage (V/µs)
Gate Trigger Current vs.
Gate Current Pulse Width
Typical Example
Tj = 125°C
IT = 1A
τ = 500µs
VD = 200V
7
5
V
330Ω
Test Procedure III
A
6V
V
330Ω
Test Procedure IV
BCR08AS-12
Package Dimensions
Previous Code
UPAK / UPAKV
RENESAS Code
PLZZ0004CA-A
4.5 ± 0.1
(1.5)
2.5 ± 0.1
4.25 Max
0.44 Max
0.8 Min
0.53 Max
0.48 Max
1.5 1.5
3.0
JEITA Package Code
RENESAS Code
Package Name
MASS[Typ.]
SC-62
PLZZ0004CB-A
SOT-89
0.48g
(0.2)
φ1
Unit: mm
1.5 ± 0.1
0.44 Max
0.4
1.8 Max
MASS[Typ.]
0.050g
(2.5)
JEITA Package Code
SC-62
(0.4)
Package Name
UPAK
Unit: mm
4.6Max
1.5 ± 0
0.1
4.2Max
Max
0.8Min
0.8M
2.5 ± 0
0.1
1.6 ± 0.2
0.58Max
1.5
3.0
REJ03G0292-0200 Rev.2.00 Mar 22, 2007
Page 6 of 7
0.48Max
+0.03
0.4 –0.05
BCR08AS-12
Order Code
Lead form
Surface-mounted type
Standard packing
Taping
Quantity
4000
Standard order code
Type name +A –T +Direction (1 or 2)+4
Note : Please confirm the specification about the shipping in detail.
REJ03G0292-0200 Rev.2.00 Mar 22, 2007
Page 7 of 7
Standard order
code example
BCR08AS-12A-T14
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