Freescale MPX4100 Integrated pressure sensor Datasheet

Freescale Semiconductor
Technical Data
MPX4100
Rev 7, 12/2006
Integrated Silicon Pressure Sensor
Manifold Absolute Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPX4100 series Manifold Absolute Pressure (MAP) sensor for engine
control is designed to sense absolute air pressure within the intake manifold. This
measurement can be used to compute the amount of fuel required for each
cylinder. The small form factor and high reliability of on-chip integration makes
the MAP sensor a logical and economical choice for automotive system
designers.
MPX4100
SERIES
INTEGRATED
PRESSURE SENSOR
20 TO 105 kPA (2.9 TO 15.2 psi)
0.3 TO 4.9 V OUTPUT
MPX4100A
CASE 867-08
Features
•
•
•
•
•
•
1.8% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute Pressure Sensing in
Engine Control Systems
Ideally Suited for Microprocessor Interfacing
Temperature Compensated Over -40°C to +125°C
Durable Epoxy Unibody Element
Ideal for Non-Automotive Applications
MPX4100AP
CASE 867B-04
Typical Applications
•
Manifold Sensing for Automotive Systems
ORDERING INFORMATION(1)
Device Type
Basic Element
Case No.
MPX Series
Order Number
Device
Marking
867-08
MPX4100A
MPX4100A
867B-04
MPX4100AP
MPX4100AP
Absolute, Stove Pipe
Port
867E-03
MPX4100AS
MPX4100A
Absolute, Axial Port
867F-03
MPX4100ASX
MPX4100A
Options
Absolute, Element
Only
Ported Elements Absolute, Ported
1. The MPX4100A series MAP silicon pressure sensors are available in the Basic
Element, or with pressure port fittings that provide mounting ease and barbed hose
connections.
MPX4100AS
CASE 867E-03
MPX4100ASX
CASE 867F-03
PIN NUMBERS
© Freescale Semiconductor, Inc., 2006. All rights reserved.
1
VOUT
4
NC
2
GND
5
NC
3
VS
6
NC
processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry
integrated on a pressure sensor chip.
The MPX4100 series piezoresistive transducer is a stateof-the-art, monolithic, signal conditioned, silicon pressure
sensor. This sensor combines advanced micromachining
techniques, thin film metallization, and bipolar semiconductor
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 4, 5, and 6 are NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
(1)
Table 1. MAXIMUM RATINGS
Rating
Overpressure
(2)
(P1 > P2)
Symbol
Value
Unit
Pmax
400
kPa
Pburst
1000
kPa
Storage Temperature
Tstg
-40 to +125
°C
Operating Temperature
TA
-40 to +125
°C
Burst Pressure(2) (P1 > P2)
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4100
2
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Table 2. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25×C unless otherwise noted, P1 > P2)
Characteristic(1)
Pressure Range(2)
Supply
Voltage(2)
Supply Current
Symbol
Min
Typ
Max
Unit
POP
20
—
105
kPa
VS
4.85
5.1
5.35
Vdc
IO
—
7.0
10
mAdc
Minimum Pressure Offset(3)
@ VS = 5.1 V
(0 to 85°C)
Voff
0.225
0.306
0.388
Vdc
Full Scale Output(4)
@ VS = 5.1 V
(0 to 85°C)
VFSO
4.815
4.897
4.978
Vdc
Full Scale Span(5)
@ VS = 5.1 V
(0 to 85°C)
VFSS
—
4.59
—
Vdc
Accuracy(6)
(0 to 85°C)
—
—
—
±1.8
%VFSS
V/P
—
54
—
mV/kPa
Response Time(7)
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
IO+
—
0.1
—
mAdc
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Sensitivity
Warm-Up Time
(8)
Offset Stability(9) (10)
1. Decoupling circuit shown in Figure 3 required to meet electrical specifications.
2. 1.0 kPa (kiloPascal) equals 0.145 psi.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Device is ratiometric within this specified excitation range.
Table 3. MECHANICAL CHARACTERISTICS
Characteristic
Weight, Basic Element (Case 867)
Common Mode Line
Pressure(1)
Symbol
Min
Typ
Max
Unit
—
—
4.0
—
Grams
—
—
—
690
kPa
1. Common mode pressures beyond specified may result in leakage at the case-to-lead interface.
MPX4100
Sensors
Freescale Semiconductor
3
Fluoro Silicone
Gel Die Coat
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Lead Frame
Sealed Vacuum Reference
Epoxy Plastic
Case
Die
Bond
Absolute Element
P2
Figure 2. Cross-Sectional Diagram (Not to Scale)
+5.0 V
1
OUTPUT
3
1.0 µF
0.01 µF
2
IPS
Figure 3. Recommended Power Supply Decoupling
(For output filtering recommendations, refer to Application Note AN1646.)
Figure 2 illustrates an absolute sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor
diaphragm. The MPX4100A series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
5.0
4.5
4.0
3.5
Output (Volts)
3.0
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C. (The output will saturate outside of the specified
pressure range.)
Transfer Function:
VOUT = Vs* (.01059*P-.152) ± Error
VS = 5.1 Vdc
TEMP = 0 to 85°C
20 kPa TO 105 kPa
MAX
MPX4100A
TYP
2.5
2.0
1.5
MIN
1.0
0.5
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
0
Pressure (ref. to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
MPX4100
4
Sensors
Freescale Semiconductor
Transfer Function (MPX4100A)
Nominal Transfer Value:
Vout = VS (P x 0.01059 - 0.1518)
± (Pressure Error x Temp. Factor x 0.01059 x VS)
VS = 5.1 V ± 0.25 Vdc
Temperature Error Band
MPX4100A Series
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
- 40
0 to 85
+125
3
1
3
1.0
0.0
-40
-20
0
20
40
80
60
100
120
140
Temperature in C×
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
-1.0
20
40
60
80
100
Pressure (in kPa)
120
-2.0
-3.0
Pressure
Error (Max)
20 to 105 (kPa)
±1.5 (kPa)
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Part Number
MPX4100A
Case Type
867
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX4100AP
867B
Side with Port Marking
MPX4100AS
867E
Side with Port Attached
MPX4100ASX
867F
Side with Port Attached
MPX4100
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
M
T A
M
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
16.00
0.595
0.630 15.11
13.56
0.514
0.534 13.06
5.59
0.200
0.220
5.08
0.84
0.027
0.033
0.68
1.63
0.048
0.064
1.22
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
18.42
0.695
0.725 17.65
30˚ NOM
30˚ NOM
12.57
0.475
0.495 12.07
11.43
0.430
0.450 10.92
0.090
0.105
2.29
2.66
STYLE 3:
CASE
OPEN 867-08
PIN 1.
GROUND
2.
ISSUE
N
-VOUT
3.
VSUPPLY
4.
BASIC ELEMENT
(A,
D)
+VOUT
5.
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
6. OPEN
CASE 867-O8
ISSUE N
BASIC ELEMENT
MPX4100
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
-B-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
C
DIM
A
B
C
D
E
F
G
J
K
N
S
V
V
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
6
K
4
3
2
1
S
J
N
5
G
F
E
D 6 PL
-T-
0.13 (0.005)
M
T B
M
INCHES
MILLIMETERS
MAX
MIN
MAX
MIN
18.28
0.720 17.53
0.690
6.48
6.22
0.245
0.255
20.82
0.780
0.820 19.81
0.84
0.69
0.027
0.033
4.72
4.52
0.178
0.186
1.63
1.22
0.048
0.064
0.100 BSC
2.54 BSC
0.41
0.36
0.014
0.016
9.53
8.76
0.375
0.345
7.87
7.62
0.300
0.310
6.10
5.59
0.220
0.240
4.93
4.62
0.194
0.182
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867E-O3
ISSUE D
STOVE PIPE PORT (AS)
-TC
A
E
-Q-
U
N
V
B
R
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
-P0.25 (0.010)
M
T Q
6
M
5
4
3
2
1
S
K
J
0.13 (0.005)
M
T P
S
D 6 PL
Q S
G
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MILLIMETERS
MAX
MIN
MIN MAX
28.45
27.43
1.080 1.120
19.30
18.80
0.740 0.760
16.51
16.00
0.630 0.650
0.84
0.68
0.027 0.033
4.57
4.06
0.160 0.180
1.63
1.22
0.048 0.064
0.100 BSC
2.54 BSC
0.41
0.36
0.014 0.016
6.10
5.59
0.220 0.240
2.03
1.78
0.070 0.080
4.06
3.81
0.150 0.160
4.06
3.81
0.150 0.160
11.68
11.18
0.440 0.460
18.42
17.65
0.695 0.725
21.84
21.34
0.840 0.860
4.93
4.62
0.182 0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867F-03
ISSUE D
AXIAL PORT (ASX)
MPX4100
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
PORTED (AP)
MPX4100
8
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
PORTED (AP)
MPX4100
Sensors
Freescale Semiconductor
9
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MPX4100
Rev. 7
12/2006
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