TM8 Vishay Sprague Solid Tantalum Chip Capacitors Reliability, Low DCL, Leadframeless Molded MICROTANTM High FEATURES • High reliability solid surface mount tantalum capacitors • Low DCL for extended battery life • Small sizes for space constrained applications • L-shaped terminations for superior board mounting • Suitable for medical implantable applications additional screening • Compliant to RoHS directive 2002/95/EC with PERFORMANCE CHARACTERISTICS Operating Temperature: - 55 °C to + 85 °C (to + 125 °C with voltage derating) Capacitance Range: 1 µF to 47 µF Capacitance Tolerance: ± 10 % and ± 20 % standard Voltage Range: 2 WVDC to 40 WVDC ORDERING INFORMATION TM8 MODEL R CASE CODE 106 CAPACITANCE M CAPACITANCE TOLERANCE 016 DC VOLTAGE RATING AT + 85 °C E TERMINATION/ PACKAGING B RELIABILITY LEVEL A SURGE CURRENT See Ratings and Case Codes Table This is expressed in picofarads. The first two digits are the significant figures. The third is the number of zeros to follow. K = ± 10 % M = ± 20 % This is expressed in volts. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an “R” (6R3 = 6.3 V). E = Sn/Pb solder/ 7" (178 mm) reels R = Sn/Pb solder/ 7" (178 mm) 300 pcs. qty. C = 100 % tin/ 7" (178 mm) reels U = 100 % tin/ 7" (178 mm) 300 pcs. qty. B = 0.1 % weibull FRL S = Hi-Rel std. (40 h burn-in) Z = Nonestablished reliability A = 10 cycles at 25 °C B = 10 cycles at - 55 °C/+ 85 °C Z = None Note • Standard options are in bold DIMENSIONS in inches [millimeters] Anode Polarity Bar Cathode Termination Anode Termination W C P1 P2 CASE H P1 L L W H P1 P2 (REF.) C Q 0.100 ± 0.015 [2.54 ± 0.38] 0.053 ± 0.012 [1.35 ± 0.30] 0.050 ± 0.012 [1.27 ± 0.30] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.038 ± 0.010 [0.96 ± 0.25] 0.046 + 0.009/- 0.001 [1.17 + 0.23/- 0.025] D 0.150 ± 0.015 [3.8 ± 0.38] 0.100 ± 0.015 [2.54 ± 0.38] 0.050 ± 0.012 [1.27 ± 0.30] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.088 ± 0.010 [2.24 ± 0.25] 0.091 + 0.009/- 0.001 [2.3 + 0.23/- 0.025] E 0.201 ± 0.015 [5.1 ± 0.38] 0.100 ± 0.015 [2.54 ± 0.38] 0.050 ± 0.012 [1.27 ± 0.30] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.139 ± 0.010 [3.5 ± 0.25] 0.091 + 0.009/- 0.001 [2.3 + 0.23/- 0.025] F 0.220 ± 0.015 [5.6 ± 0.38] 0.138 ± 0.012 [3.5 ± 0.3] 0.050 ± 0.012 [1.27 ± 0.30] 0.039 ± 0.005 [1.0 ± 0.13] 0.142 ± 0.010 [3.6 ± 0.25] 0.126 + 0.009/- 0.001 [3.2 + 0.23/- 0.025] K 0.045 ± 0.002 [1.14 ± 0.05] 0.026 ± 0.002 [0.66 ± 0.05] 0.024 max. [0.61 max.] 0.010 ± 0.004 [0.25 ± 0.1] 0.020 min. [0.51 min.] 0.015 ± 0.004 [0.38 ± 0.1] www.vishay.com 38 For technical questions, contact: [email protected] Document Number: 40133 Revision: 22-Jun-10 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded Vishay Sprague DIMENSIONS in inches [millimeters] CASE L W H P1 P2 (REF.) C L 0.081 ± 0.008 [2.05 ± 0.2] 0.051 ± 0.004 [1.3 ± 0.10] 0.04 max. [1.0 max.] 0.020 ± 0.004 [0.50 ± 0.1] 0.027 min. [0.70 min.] 0.035 + 0.009/- 001 [0.9+0.23/- 0.02] M 0.063 ± 0.006 [1.60 ± 0.15] 0.033 ± 0.006 [0.84 ± 0.15] 0.033 ± 0.006 [0.84 ± 0.15] 0.020 ± 0.004 [0.51 ± 0.1] 0.019 min. [0.48 min.] 0.024 ± 0.004 [0.61 ± 0.1] N 0.138 + 0.004/- 0.008 [3.505 + 0.101/- 0.203] 0.110 ± 0.004 [2.80 ± 0.1] 0.04 max. [1.0 max.] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.088 ± 0.010 [2.24 ± 0.25] 0.091 + 0.009/- 0.001 [2.3 + 0.23/- 0.025] P 0.096 ± 0.006 [2.45 ± 0.15] 0.059 ± 0.006 [1.5 ± 0.15] 0.049 max. [1.25 max.] 0.020 ± 0.004 [0.51 ± 0.1] 0.043 min. [1.1 min.] 0.035 ± 0.004 [0.90 ± 0.1] R 0.081 ± 0.006 [2.06 ± 0.15] 0.053 ± 0.006 [1.35 ± 0.15] 0.058 ± 0.004 [1.47 ± 0.10] 0.020 ± 0.004 [0.51 ± 0.1] 0.028 min. [0.71 min.] 0.035 ± 0.004 [0.90 ± 0.1] T 0.138 + 0.004/- 0.008 [3.505 + 0.101/- 0.203] 0.110 ± 0.004 [2.80 ± 0.1] 0.06 max. [1.52 max.] 0.031 + 0.004/- 0.006 [0.80 + 0.1/- 0.15] 0.088 ± 0.010 [2.24 ± 0.25] 0.091 + 0.009/- 0.001 [2.3 + 0.23/- 0.025] W 0.081 ± 0.006 [2.06 ± 0.15] 0.053 ± 0.006 [1.35 ± 0.15] 0.047 max. [1.2 max.] 0.020 ± 0.004 [0.51 ± 0.1] 0.028 min. [0.71 min.] 0.035 ± 0.004 [0.90 ± 0.1] RATINGS AND CASE CODES F 6.3 V 10 V 16 V 20 V 25 V 40 V M M W R P 1.0 2.2 3.3 R 4.7 M 7.5 L 10 M 15 M R P N* R 22 33 47 T Note * Preliminary values, contact factory for availability. MARKING P-Case M-Case Polarity Bar Voltage Code Polarity Bar A Voltage Capacitance Code Code GJ D, E, F, N, T-Case K-Case Capacitance Polarity band Voltage XXX - XX Vishay logo (if space allows) Document Number: 40133 Revision: 22-Jun-10 For technical questions, contact: [email protected] www.vishay.com 39 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded Vishay Sprague STANDARD RATINGS MAX. DC LEAKAGE PART NUMBER AT + 25 °C (µA) 6.3 WVDC AT + 85 °C, 4 WVDC AT + 125 °C MAX. DF AT + 25 °C (%) MAX. ESR AT + 25 °C 100 kHz STD. (Ω) 8 5.0 8 5.0 0.20 6 12.0 0.24 8 6.0 TM8L755(1)010(2)(3)(5) 0.38 8 8.0 R TM8R106(1)010(2)(3)(5) 0.50 8 6.0 47 T TM8T476(1)010(2)(3)(5) 2.35 16 WVDC AT + 85 °C, 10 WVDC AT + 125 °C 8 1.0 1.0 M TM8M105(1)016(2)(3)(5) 6 12.0 10 R TM8R106(1)016(2)(3)(5) 0.80 20 WVDC AT + 85 °C, 13 WVDC AT + 125 °C 8 6.0 1.0 W TM8W105(1)020(2)(3)(5) 0.20 8 8.0 3.3 R TM8R335(1)020(2)(3)(5) 0.33 8 8.0 7.5 N TM8N755(1)020(2)(3)(5)* 0.93 25 WVDC AT + 85 °C, 17 WVDC AT + 125 °C 8 8.0 1.0 R TM8R105(1)025(2)(3)(5) 6 10.0 4.7 P TM8P475(1)025(2)(3)(5) 0.59 40 WVDC AT + 85 °C, 27 WVDC AT + 125 °C 6 6.0 1.0 P TM8P105(1)040(2)(3)(5) 8 10.0 CAPACITANCE (µF) CASE CODE 10 M TM8M106(1)6R3(2)(3)(5) 15 M TM8M156(1)6R3(2)(3)(5) 0.47 10 WVDC AT + 85 °C, 7 WVDC AT + 125 °C 1.0 M TM8M105(1)010(2)(3)(5) 4.7 M TM8M475(1)010(2)(3)(5) 7.5 L 10 0.32 0.20 0.20 0.20 Notes (1) Capacitance tolerance: K, M (2) Termination and Packaging: E, C (3) Reliability level: Z, S, B (4) Reliability level: Z only (5) Surge current: Z, A, B (6) Surge current: Z only * Preliminary ratings: contact factory for availability www.vishay.com 40 For technical questions, contact: [email protected] Document Number: 40133 Revision: 22-Jun-10 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded Vishay Sprague CAPACITORS PERFORMANCE CHARACTERISTICS ELECTRICAL PERFORMANCE CHARACTERISTICS ITEM Category Temperature Range Capacitance Tolerance Dissipation Factor (at 120 Hz) ESR (100 kHz) Leakage Current Reverse Voltage Temperature Derating Operating Temperature PERFORMANCE CHARACTERISTICS - 55 °C to + 85 °C (to + 125 °C with voltage derating) ± 20 %, ± 10 % (at 120 Hz) 1 Vrms at + 25 °C using a capacitance bridge Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz. Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz. After application of rated voltage applied to capacitors for 5 minutes using a steady source of power with 1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in Standard Ratings Table. Note that the leakage current varies with temperature and applied voltage. See graph below for the appropriate adjustment factor. Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC rating at + 25 °C or 5 % of the DC rating at + 85 °C. Vishay does not recommended intentional or repetitive application of reverse voltage. If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or voltage shall be calculated using the derating factors: 1.0 at + 25 °C 0.9 at + 85 °C 0.4 at + 125 °C + 85 °C RATING + 125 °C RATING WORKING VOLTAGE (V) WORKING VOLTAGE (V) 2 1.3 4 2.7 6.3 4 10 7 15 10 16 10 20 13 25 17 40 27 TYPICAL LEAKAGE CURRENT FACTOR RANGE LEAKAGE CURRENT FACTOR 100 + 125 °C + 85 °C 10 + 55 °C + 25 °C 1.0 0 °C 0.1 - 55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED VOLTAGE Notes • At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table • At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table • At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table Document Number: 40133 Revision: 22-Jun-10 For technical questions, contact: [email protected] www.vishay.com 41 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded Vishay Sprague TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY “M” Case “M” Case 1000 1000 IMPEDANCE ESR IMPEDANCE ESR 100 ESR/Z, Ω ESR/Z, Ω 100 10 10 4.7 µF - 10 V 1 10 µF - 6 V 1 0.1 1 10 100 0.1 0.1 1000 1 10 100 FREQUENCY, kHz FREQUENCY, kHz “M” Case “P” CASE 10 000 1000.0 IMPEDANCE ESR IMPEDANCE ESR 1000 100.0 ESR, Z, Ω ESR/Z, Ω 1000 100 10.0 1 µF - 16 V 10 1.0 4.7 µF - 25 V 1 0.1 1 10 100 1000 0.1 0.1 FREQUENCY, kHz www.vishay.com 42 For technical questions, contact: [email protected] 1 10 100 1000 FREQUENCY, kHz Document Number: 40133 Revision: 22-Jun-10 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded Vishay Sprague PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] 0.157 ± 0.004 [4.0 ± 0.10] Tape Thickness Deformation Between Embossments 0.014 [0.35] MAX. 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] Top Cover Tape B1 MAX. (Note 6) 10 pitches cumulative tolerance on tape ± 0.008 [0.200] Embossment 0.069 ± 0.004 0.079 ± 0.002 [1.75 ± 0.10] [2.0 ± 0.05] A0 K0 0.030 [0.75] MIN. (Note 3) B0 Top Cover Tape 0.004 [0.1] MAX. For Tape Feeder Reference only including draft. Concentric around B0 (Note 5) Center Lines of Ca vity 20° F W Maximum Component Rotation 0.030 [0.75] MIN. (Note 4) (Side or Front Sectional Vie w) P1 USER DIRECTION OF FEED Maximum Cavity Siz e (Note 1) D1 MIN. For Components 0.079 x 0.047 [2.0 x 1.2] and Larger . (Note 5) Cathode (-) Anode (+) Direction of Feet Ty pical Component Cavity Center Line B0 A0 Ty pical Component Center Line (Top Vie w) Tape and Reel Specifications: All case sizes are available on plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3 is also available. Standard reel diameter is 7" [178 mm], 13" [330 mm] reels are available and recommended as the most cost effective packaging method. 3.937 [100.0] 0.039 [1.0] MAX. 20° Maximum Component Rotation Tape 0.039 [1.0] MAX. 0.9843 [250.0] The most efficient packaging quantities are full reel increments on a given reel diameter. The quantities shown allow for the sealed empty pockets required to be in conformance with EIA-481-1. Reel size and packaging orientation must be specified in the Vishay Sprague part number. Camber (Top View) Allo wable Camber to be 0.039/3.937 [1/100] Non-Cumulative Ov er 9.843 [250.0] Note Metric dimensions will govern. Dimensions in inches are rounded and for reference only. CASE CODE TM8 TAPE SIZE P 8 mm Q 8 mm L 8 mm R 8 mm W 8 mm D 12 mm E 12 mm F 12 mm N 12 mm T 12 mm Document Number: 40133 Revision: 22-Jun-10 B1 (MAX.) D1 (MIN.) F K0 (MAX.) P1 W 0.108 (2.75) 0.135 (3.43) 0.094 (2.4) 0.112 (2.85) 0.112 (2.85) 0.154 (3.9) 0.235 (5.97) 0.231 (5.88) 0.150 (3.8) 0.150 (3.8) 0.039 (1.0) 0.039 (1.0) 0.039 (1.0) 0.039 (1.0) 0.039 (1.0) 0.059 (1.5) 0.059 (1.5) 0.059 (1.5) 0.059 (1.5) 0.059 (1.5) 0.138 (3.5) 0.138 (3.5) 0.138 (3.5) 0.138 (3.5) 0.138 (3.5) 0.216 (5.5) 0.216 (5.5) 0.216 (5.5) 0.216 (5.5) 0.216 (5.5) 0.054 (1.37) 0.065 (1.65) 0.047 (1.2) 0.066 (1.68) 0.053 (1.35) 0.051 (1.3) 0.070 (1.78) 0.060 (1.53) 0.047 (1.2) 0.063 (1.60) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.157 (4.0) 0.315 (8.0) 0.315 (8.0) 0.315 (8.0) 0.315 (8.0) 0.315 (8.0) 0.472 (12.0) 0.472 (12.0) 0.472 (12.0) 0.472 (12.0) 0.472 (12.0) For technical questions, contact: [email protected] www.vishay.com 43 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded Vishay Sprague PAPER TAPE AND REEL PACKAGING in inches [millimeters] T P2 Ø D0 [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 P0 A0 Bottom Cover Tape F W B0 E2 Top Cover Tape Anode P1 Cavity Center Lines G Bottom Cover Tape Cavity Size Note 1 User Feed Direction TM8 CASE TAPE SIZE SIZE A0 B0 D0 P0 P1 P2 E F W T K 8 mm 0.033 ± 0.002 0.053 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.078 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.03 ± 0.002 [0.85 ± 0.05] [1.35 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.75 ± 0.05] M 8 mm 0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002 [1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.95 ± 0.05] STANDARD PACKAGING QUANTITY SERIES TM8 CASE CODE K M P Q D E F L N R T W 7" REEL 5000 4000 3000 4000 2500 2500 2500 2500 2500 2500 2500 2500 QTY (PCS/REEL) 1/2 REEL 2500 2000 1500 2000 1250 1250 1250 1250 1250 1250 1250 1250 SMALL REEL 300 300 300 300 300 300 300 300 300 300 300 300 POWER DISSIPATION SERIES TM8 www.vishay.com 44 CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION AT + 25 °C (W) IN FREE AIR K M P Q D E F L N R T W 0.015 0.025 0.045 0.045 0.084 0.090 0.110 0.035 0.075 0.045 0.084 0.040 For technical questions, contact: [email protected] Document Number: 40133 Revision: 22-Jun-10 TM8 Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded Vishay Sprague RECOMMENDED REFLOW PROFILES Tp °C (tp) Temperature (°C) TL °C Ts MAX. °C (tL) Ts MAX. °C Preheat (ts) 25 °C t, s All Case Codes TYPE TM8 TP TP lead (Pb)-free Sn/Pb 260 °C TL TL TS MIN. TS MIN. TS MAX. TS MAX. tS tS lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb tP 225 °C 10 217 °C 183 °C 150 °C 100 °C 200 °C 150 °C 60 to 150 tL 60 to 90 60 PAD DIMENSIONS in inches [millimeters] B D C A A (MIN.) B (NOM.) C (NOM.) D (NOM.) K 0.028 (0.70) 0.018 (0.45) 0.024 (0.60) 0.059 (1.50) M 0.039 (1.00) 0.028 (0.70) 0.24 (0.60) 0.080 (2.00) P 0.063 (1.60) 0.031 (0.80) 0.047 (1.20) 0.110 (2.80) CASE CODE TM8 Q 0.065 (1.60) 0.050 (1.30) 0.040 (1.00) 0.142 (3.60) D 0.115 (2.90) 0.070 (1.80) 0.070 (1.80) 0.213 (5.40) E 0.115 (2.90) 0.070 (1.80) 0.120 (3.00) 0.260 (6.60) F 0.150 (3.80) 0.070 (1.80) 0.140 (3.60) 0.283 (7.20) L 0.059 (1.50) 0.031 (0.80) 0.039 (1.00) 0.102 (2.60) N 0.118 (3.00) 0.067 (1.70) 0.051 (1.30) 0.185 (4.70) R 0.059 (1.50) 0.031 (0.80) 0.039 (1.00) 0.102 (2.60) T 0.118 (3.00) 0.067 (1.70) 0.051 (1.30) 0.185 (4.70) W 0.059 (1.50) 0.031 (0.80) 0.039 (1.00) 0.102 (2.60) Document Number: 40133 Revision: 22-Jun-10 For technical questions, contact: [email protected] www.vishay.com 45 TM8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded GUIDE TO APPLICATION 1. Printed Circuit Board Materials: Molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment: 7.1 Solder Paste: The recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: Capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time/temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per second. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. A-C Ripple Current: The maximum allowable ripple current shall be determined from the formula: I rms = where, P= P ---------------R ESR Power dissipation in watts at + 25 °C as given in the table in paragraph number 5 (power dissipation). The capacitor equivalent series resistance at the specified frequency. RESR = 2. 6. A-C Ripple Voltage: The maximum allowable ripple voltage shall be determined from the formula: P V rms = Z ---------------R ESR or, from the formula: V rms = I rms × Z where, P= RESR = Z= 2.1 Power dissipation in watts at + 25 °C as given in the table in paragraph number 5 (power dissipation). The capacitor equivalent series resistance at the specified frequency. The capacitor impedance at the specified frequency. The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. 2.2 The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at + 25 °C. 3. Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at + 25 °C, 5 % of the DC rating at + 85 °C and 1 % of the DC rating at + 125 °C. 4. Temperature Derating: If these capacitors are to be operated at temperatures above + 25 °C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: TEMPERATURE + 25 °C + 85 °C + 125 °C 5. DERATING FACTOR 1.0 0.9 0.4 Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power Dissipation calculated using + 25 °C temperature rise.) www.vishay.com 46 7.2.1 Backward and Forward Compatibility: Capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: Molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 minutes. 9. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design. For technical questions, contact: [email protected] Document Number: 40133 Revision: 22-Jun-10 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1