MAS MAS9270CTB2 Ic for 10.00 - 30.00 mhz vctcxo Datasheet

DA9270.008
11 September 2006
MAS9270
IC FOR 10.00 – 30.00 MHz VCTCXO
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Wide Supply Voltage Range
True Sine Wave Output
Very High Level of Integration
Electrically Trimmable
Very Low Phase Noise
Low Cost
Minimum Operating Temperature –40 °C
DESCRIPTION
The MAS9270 is an integrated circuit well suited to
build VCTCXO for mobile communication.
Temperature calibration is achieved in three
calibration temperatures only. The trimming is done
through a serial bus and the calibration information
is stored in an internal PROM. This means no
rework for trimming is needed.
FEATURES
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To build a VCTCXO additionally only crystal is
required. The compensation method is fully analog,
working continuously without generating any steps
or other interference.
APPLICATIONS
Very small size
Minor current draw
Wide operating temperature range
Phase noise <-120 dBc/Hz at 100Hz offset
Programmable VC-sensitivity
Minimum Operating Temperature –40 °C for
MAS9270Cxx3
VCTCXO for mobile phones
VCTCXO for other telecommunications
systems
•
•
BLOCK DIAGRAM
DA
CLK
PV
CUB
4
INF
4
SENS
4
LIN
8
CDAC1
8
MAS9270
f(T)
TE1
Σ
f(T)
T
Vref
TMux
TE2
VC
VDD
CDAC2
VSS
2
OUT
X2
X1
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DA9270.008
11 September 2006
PIN DESCRIPTION
Pin Description
Symbol
x-coordinate
y-coordinate
Power Supply Voltage
Programming Input
Serial Bus Clock Input
VDD
PV
CLK
166
420
979
1430
1435
1441
Serial Bus Data Input
Temperature Output
Test Multiplexer Output
Voltage Control Input
Crystal Oscillator Output
Crystal/Varactor Oscillator Input
Power Supply Ground
Buffer Output
DA
TE1
TE2
VC
X1
X2
VSS
OUT
1234
1488
1742
185
439
1357
1790
2046
1441
1441
1441
153
149
149
166
153
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
Input Pin Voltage
Power Dissipation
Storage Temperature
VDD - VSS
-0.3
VSS -0.3
6.0
VDD + 0.3
20
150
V
V
mW
o
C
PMAX
TST
-55
Note
1)
Note 1: Not valid for programming pin PV
RECOMMENDED OPERATION CONDITIONS
Parameter
Symbol
Supply Voltage
Supply Current
Operating Temperature
Storage Temperature
VDD
ICC
TOP
TS
Crystal Pulling Sensitivity
Crystal Load Capacitance
S
CL
Conditions
Min
Typ
Max
Unit
Note
2.7
2.8
5.5
1.8
+85
+40
V
mA
o
C
o
C
1)
Vdd = 2.8 Volt
Relative humidity =
15%…70%
-30
-45
30
10
2)
ppm/pF
pF
Note 1: Minimum Supply Voltage 2.6 V for MAS9270Cxx2 version.
Note 2: Minimum Operating Temperature –40 °C for MAS9270Cxx3 version.
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DA9270.008
11 September 2006
ELECTRICAL CHARACTERISTICS
(recommended operation conditions)
Parameter
Symbol
Min
Frequency Range
fo
Voltage Control Range
Typ
Max
Unit
Note
10.00
30.00
MHz
VC
0
Vdd
V
Voltage Control Sensitivity (VCR = 0)
VCSENS
9
15
ppm/V
Voltage Control Sensitivity (VCR = 1)
VCSENS
4
8
ppm/V
1)
Frequency vs. Supply Voltage
dfo
±0.2
ppm
2)
Frequency vs. Load Change
dfo
±0.2
ppm
3)
Output Voltage (10kΩ // 10 pF)
Vout
Compensation Range ± 2.5 ppm
TC
Compensation Range ± 2.0 ppm
1.0
-30
TC
Compensation Range ± 2.5 ppm
-25
Vpp
85
o
75
o
o
C
C
TC
-40
85
Compensation Range Linear Part
a1
-0.7
0.0
Compensation Inflection Point
INF
25
31
Compensation Range Cubic Part
a3
Compensation CDAC1 (7 Bit)
CX1
C10
C10 + 18
pF
5)
Compensation CDAC2 (2 Bit)
CX2
C20
C20 + 4
pF
6)
Start up Time
2
4)
ppm/K
o
C
2
95
TSTART
C
3
ppm /K
ms
Note 1: default
Note 2: VDD +/- 5%
Note 3: R=10 kohm +/- 10%, C=10 pF +/- 10%
Note 4: MAS9270Cxx3
Note 5: typ C10 = 13 pF
Note 6: typ C20 = 6 pF (varactor capacitance at 1.8 V 12 pF)
IC OUTLINES
PV
CLK
DA
TE1
1584 µm
VDD
TE2
MAS9270
VC
X1
X2
VSS
OUT
Die map reference
2204 µm
Note 1: MAS9270 pads are round with 80 µm diameter at opening.
Note 2: Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to
VDD or left floating and pin TE1 must be left floating in VCTCXO module end-user application.
Note 3: Die map reference is the actual left bottom corner of the sawn chip.
3 (9)
DA9270.008
11 September 2006
SAMPLES IN SB20 DIL PACKAGE
1
20 OUT
2
19
3
18 GND
TE2 4
DA 6
MAS9270
YYWW
XXXXX.X
TE1 5
Top marking:
YYWW = Year, Week
XXXXX.X = Lot number
17
CLK 7
16 X2
15
14 X1
PV 8
13
VDD 9
12 VC
10
11
DEVICE OUTLINE CONFIGURATION
MSOP10
OUT
DA
VSS
CLK
X2
PV
VDD
9270
CX
YWW
TE2
Top View
X1
VC
C = product version
X = voltage version
Y = year
WW= week
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DA9270.008
11 September 2006
PACKAGE (MSOP-10) OUTLINE
e
S
See Detail A
c
B
c1
b1
(b)
E1
E1
B
Section B - B
E
E
5-15 Degrees
L1
Detail A
A2A
F
AA
A1
Land
Pattern
Recommendation
Gauge Plane
0 - 8 Degrees
L2
D
Seating Plane
N
L
G
Symbol
Min
Nom
Max
Unit
A
A1
A2
b
b1
c
c1
D
E
E1
e
F
G
L
(Terminal length for
soldering)
L1
L2
M
N
S
-0.00
0.75
0.15
0.15
0.08
0.08
--0.85
----
1.10
0.15
0.95
0.30
0.25
0.23
0.18
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
0.40
3.00 BSC
4.90 BSC
3.00 BSC
0.50 BSC
4.8
0.50
0.60
0.80
0.95 REF
0.25 BSC
0.41
1.02
0.50
M
mm
mm
mm
Mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Reference Standard : JEDEC MO-187 BA.
5 (9)
DA9270.008
11 September 2006
SOLDERING INFORMATION
◆ For Sn/Pb MSOP-10
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
◆ For Pb Free, RoHS Compliant MSOP-10
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
Solder plate 7.62 - 25.4 µm, material Matte Tin
6 (9)
DA9270.008
11 September 2006
EMBOSSED TAPE SPECIFICATIONS
P1
T
DO
PO
P2
E
W
F
BO
A
AO
KO
D1
Section A-A
User Direction of Feed
Pin 1 Designator
Dimension
Min/Max
Unit
Ao
Bo
Do
D1
E
F
Ko
Po
P1
P2
T
W
5.00 ±0.10
3.20 ±0.10
1.50 +0.1/-0.0
1.50 min
1.75
5.50 ±0.05
1.45 ±0.10
4.0
8.0
±0.10
2.0
±0.05
0.3
±0.05
12.00 +0.30/-0.10
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
7 (9)
DA9270.008
11 September 2006
REEL SPECIFICATIONS
W2
A
D
C
Tape Slot for Tape Start
N
B
W1
5000 Components on Each Reel
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static Dissipative
Carrier Tape
Cover Tape
End
Start
Trailer
Dimension
A
B
C
D
N
W 1 (measured at hub)
W 2 (measured at hub)
Trailer
Leader
Weight
Leader
Components
Min
1.5
12.80
20.2
50
12.4
Max
Unit
330
mm
mm
mm
mm
mm
mm
mm
mm
mm
13.50
14.4
18.4
160
390,
of which minimum 160
mm of empty carrier tape
sealed with cover tape
1500
g
8 (9)
DA9270.008
11 September 2006
ORDERING INFORMATION
Product Code
Product
MAS9270CTB1
MAS9270CTG1
MAS9270CASN06
VCTCXO IC 2.7 V
VCTCXO IC 2.7 V
VCTCXO IC 2.7 V
Package
Comments
EWS Tested wafers 480 µm
EWS Tested wafers 215 µm
Green MSOP-10, Pb Free,
RoHS Compliant/Top Marking CA
MAS9270CTB2
VCTCXO IC 2.6 V
EWS Tested wafers 480 µm
MAS9270CTG2
VCTCXO IC 2.6 V
EWS Tested wafers 215 µm
MAS9270C2SN06
VCTCXO IC 2.6 V
Green MSOP-10, Pb Free,
RoHS Compliant /Top Marking C2
MAS9270CTB3
VCTCXO IC –40 °C EWS Tested wafers 480 µm
MAS9270CTG3
VCTCXO IC –40 °C EWS Tested wafers 215 µm
MAS9270C3SN06
VCTCXO IC –40 °C Green MSOP-10, Pb Free,
RoHS Compliant /Top Marking C3
Please contact Micro Analog Systems Oy for other wafer thickness options.
Die Size 2.204 x 1.584 mm
Die Size 2.204 x 1.584 mm
Tape & Reel, 5.000 pcs/reel
Die Size 2.204 x 1.584 mm
Die Size 2.204 x 1.584 mm
Tape & Reel, 5.000 pcs/reel
Die Size 2.204 x 1.584 mm
Die Size 2.204 x 1.584 mm
Tape & Reel, 5.000 pcs/reel
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
Tel. +358 9 80 521
Fax +358 9 805 3213
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
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