Material Content Data Sheet Sales Product Name IPU60R600C6 Issued MA# MA001348750 Package PG-TO251-3-341 29. September 2015 Weight* 388.54 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-22-4 7440-31-5 7439-92-1 3.063 0.79 0.248 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.79 7883 7883 639 0.075 0.02 248.124 63.86 63.94 638598 192 639429 0.414 0.11 0.11 1065 1065 0.389 0.10 1000 11.788 3.03 117.366 30.21 33.34 302064 30340 333404 3.740 0.96 0.96 9626 9626 0.509 0.13 0.13 1310 1310 0.071 0.02 0.057 0.01 2.702 0.70 182 146 0.73 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 6955 7283 1000000