Bourns CG0603MLC-12E Mlc series varistor esd clamp protector Datasheet

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Features
Applications
■ Select models are compliant with
■ HDMI 1.4
■
■
■
■
AEC-Q200 Rev-C Stress Test Qualification
for Passive Components in Automotive
Applications (see chart below)
RoHS compliant*
ESD protection >25 kV
Low capacitance <0.5 pF
Low leakage current <50 nA
■ Digital Visual Interface (DVI)
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
■ Automotive
ChipGuard® MLC Series - ESD Protectors
General Information
AEC Approved Models
The ChipGuard® MLC Series has been specifically designed to protect sensitive
electronic components from electrostatic discharge damage. The MLC family has been
designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air
Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4,
DVI or IEEE1394 applications.
Model
AEC-Q200
CG0603MLC-05E
✓ Yes
CG0603MLC-12E
✓ Yes
The ChipGuard® MLC Series has been manufactured to provide low 0.5 pF capacitance
and leakage currents less than 50 nA with excellent clamp qualities, making the family
almost transparent under normal working conditions.
Device Symbol
V
Electrical Characteristics @ 25 °C (unless otherwise noted)
Parameter
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
Maximum Response Time
Symbol
VDC
VC
CO
IL
VT
RT
3.3LG
3.3
05LG
5
12LG
12
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
Operating Temperature
Storage Temperature
Parameter
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
Maximum Response Time
05LGA
5
12LGA
12
24LGA
24
TOPR
TSTG
Symbol
VDC
VC
CO
IL
VT
RT
-40 to +85
-40 to +125
-55 to +150
3.3LE
3.3
25
05E
5
20
05LE
5
25
12E
12
30
5
250
50
150
5
250
50
150
CG0603MLC12LE
24LE 3.3LEA 05LEA 12LEA 24LEA
12
24
3.3
5
12
24
25
0.5
5
250
1
-40 to +85
V
V
pF
nA
V
ns
˚C
˚C
Unit
V
V
pF
nA
V
ns
kV
kV
kV
±8
±15 (Note 3)
±25
TOPR
TSTG
Unit
kV
kV
kV
±8
±15 (Note 3)
±25
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
Operating Temperature
Storage Temperature
CG0402MLC24LG
3.3LGA
24
3.3
25
0.5
5
250
1
-40 to +125
-55 to +150
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. IEC 61000-4-2 ESD Performance for CG0603MLC-05E and CG0603MLC-12E devices will meet minimum 100 reps.
Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet
IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
˚C
˚C
ChipGuard® MLC Series - ESD Protectors
Product Dimensions
Recommended Pad Layout
A
A
W
DIMENSIONS:
MM
(INCHES)
B
L
B
C
D
CG0402
Series
CG0603
Series
L
1.00 ± 0.15
(0.04 ± 0.006)
1.60 ± 0.20
(0.064 ± 0.008)
W
0.50 ± 0.10
(0.02 ± 0.004)
A
B
Dimension
CG0402
Series
CG0603
Series
A
0.51
(0.020)
0.76
(0.030)
0.80 ± 0.20
(0.032 ± 0.008)
B
0.61
(0.024)
1.02
(0.040)
0.36 ± 0.05
(0.014 ± 0.002)
0.45 ± 0.10
(0.018 ± 0.004)
C
0.51
(0.020)
0.50
(0.020)
0.25 ± 0.15
(0.10 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
D
1.70
(0.067)
2.54
(0.100)
Dim.
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Temperature (°C)
250
200
150
Stage 1 Preheat
Stage 2 Preheat
140 °C to 160 °C
Stage 3 Preheat
Preheat to 200 °C
20 s to 40 s
D
Main Heating
200 °C
210 °C
220 °C
230 °C
240 °C
250 °C to 255 °C
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
5s
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
0
120 sec. (min.)
60 s to 120 s
B
50
30-70
sec.
30 s to 60 s
C
100
110 sec. (min.)
Ambient to Preheating
Temperature
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLC Series - ESD Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
(0.06 ± 0.004)
62.0 ± 1.50
(2.48 ± 0.06)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
W
D
21.0 ± 0.80
(0.84 ± 0.032)
3.50 ± 0.05
(0.14 ± 0.002)
NOTES: TAPE MATERIAL IS PAPER.
0.48 ± 0.03
TAPE THICKNESS IS
(0.019 ± 0.0012)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
DIMENSIONS:
MM
(INCHES)
CG0402
Series
CG0603
Series
C
1.75 ± 0.05
(0.04 ± 0.002)
1.75 ± 0.10
(0.04 ± 0.004)
D
2.00 ± 0.02
(0.08 ± 0.0008)
2.00 ± 0.05
(0.08 ± 0.002)
L
1.12 ± 0.03
(0.045 ± 0.0012)
1.80 ± 0.20
(0.072 ± 0.008)
W
0.62 ± 0.03
(0.025 ± 0.0012)
0.90 ± 0.20
(0.036 ± 0.008)
G
2.0 ± 0.05
(0.08 ± 0.002)
4.0 ± 0.05
(0.16 ± 0.002)
Dimension
180.8 ± 2.0
(7.12 ± 0.08)
9.0 ± 0.50
(0.36 ± 0.02)
How to Order
CG 0n0n MLC - n.n x x x
®
ChipGuard
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
12 = 12 V
24 = 24 V
Low Leakage Current Option
L = Low Leakage Current
Blank = Standard Product
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
Operating Temperature Option
A = Higher +125 °C Operating Temperature
Blank = Standard Product
** Only models lower than 10 volts require
decimal point.
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. S 06/13
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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