ON NL17SV32XV5T2G Single gate 2−input or gate Datasheet

NL17SV32XV5T2
Single Gate 2−Input OR Gate
The NL17SV32 is an ultra−high performance 2 input OR gate
manufactured in 0.35 m CMOS technology with excellent
performance down to 0.9 V. This device is ideal for extremely
high−speed and high−drive applications. Additionally, limitations of
board space are no longer a constraint. The very small SOT−553
makes this device fit most tight designs and spaces.
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Features
•
•
•
•
•
•
•
Extremely High Speed: tPD = 1.0 ns (Typ) at VCC = 3.3 V
Designed for 0.9 to 3.3 V Operation
Overvoltage Tolerance (OVT)* Input Pins Permit Logic Translation
Balanced "24 mA Output Drive @ 3.3 V
Near Zero Static Supply Current
Ultra−Tiny SOT−553 5 Pin Package Only 1.6 x 1.6 x 0.6 mm
These are Pb−Free Devices
Typical Applications
•
•
•
•
Cellular
Digital Camera
PDA
Digital Video
UM MG
G
SOT−553
CASE 463B
UM
= Device Code
M
= Date Code*
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN DIAGRAM
Important Information
• High ESD Ratings for Handling:
•
MARKING
DIAGRAM
Human Body Model: 2000 V
Machine Model: 200 V
Latchup Max Rating: 500 mA
Industry Standard
A
1
B
2
GND
3
5
VCC
4
Y
• Compatible with Fairchild’s NC7SV32 and TI’s SN74AUC1G32
FUNCTION TABLE
PIN ASSIGNMENT
Input A
Input B
L
L
H
H
Output Y
1
Input
A
L
H
H
H
2
Input
B
L
H
L
H
*Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of
their operating voltages, with no damage to the devices or to signal integrity.
IN A
w1
IN B
3
GND
−
4
Output
Y
5
VCC
−
ORDERING INFORMATION
Device
OUT Y
NL17SV32XV5T2
Package
Shipping†
SOT−553* 4000 Tape & Reel
NL17SV32XV5T2G SOT−553* 4000 Tape & Reel
Figure 1. Logic Symbol
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
© Semiconductor Components Industries, LLC, 2005
September, 2005 − Rev. 2
1
Publication Order Number:
NL17SV32XV5T2/D
NL17SV32XV5T2
MAXIMUM RATINGS
Symbol
Value
Unit
DC Supply Voltage
−0.5 to + 4.6
V
VI
DC Input Voltage
−0.5 to + 4.6
V
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
VCC
Rating
−0.5 to VCC +0.5
V
VI < GND
±50
mA
VO = GND
VO = VCC
−50
+50
mA
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±50
mA
IGND
DC Ground Current per Ground Pin
TSTG
Storage Temperature Range
±50
mA
− 65 to +150
°C
260
°C
+150
°C
TL
Lead Temperature, 1.0 mm from Case for 10 seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance (Note 1)
250
°C/W
PD
Power Dissipation in Still Air at 85°C
250
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
Level 1
Oxygen index: 28 to 34
UL 94 V−0 @ 0125 in
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
0.9
3.6
V
Digital Input Voltage
0
3.6
V
Vout
Output Voltage
0
VCC
V
IOH/IOL
Output Current
±24
±18
±6
±4
±2
±0.1
mA
−40
+85
°C
0
10
nS/V
VCC
Positive DC Supply Voltage
VIN
tA
VCC = 3.0 V to 3.6 V
VCC = 2.3 V to 2.7 V
VCC = 1.65 V to 1.95 V
VCC = 1.4 V to 1.6 V
VCC = 1.1 V to 1.3 V
VCC = 0.9 V
Operating Temperature Range. All Package Types
tr, tf
Input Rise or Fall Time
VCC = 3.3V ± 0.3 V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
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2
NL17SV32XV5T2
DC CHARACTERISTICS – Digital Section (Voltages Referenced to GND)
TA = 25°C
VCC
Min
High Level
Input Voltage
0.90
1.10 v= VCC v 1.30
1.40 v VCC v 1.60
1.65 v VCC v 1.95
2.30 v VCC v 2.70
2.70 v VCC v 3.60
0.65 x VCC
0.65 x VCC
0.65 x VCC
0.65 x VCC
1.6
2.0
VIL
Low Level
Input Voltage
0.90
1.10 v VCC v 1.30
1.40 v VCC v 1.60
1.65 v VCC v 1.95
2.30 v VCC v 2.70
2.70 v VCC v 3.60
VOH
High Level
Output Voltage
Symbol
Parameter
VIH
VOL
Low Level
Output Voltage
IIN
Input
Leakage Current
IOFF
Power Off
Leakage Current
ICC
Quiescent
Supply Current
Condition
TA = −40 to 85°C
Max
Min
Max
0.65 x VCC
0.65 x VCC
0.65 x VCC
0.65 x VCC
1.6
2.0
0.35 x VCC
0.35 x VCC
0.35 x VCC
0.35 x VCC
0.7
0.8
Unit
V
0.35 x VCC
0.35 x VCC
0.35 x VCC
0.35 x VCC
0.7
0.8
V
V
IOH = −100 mA
0.90
1.10 v VCC v 1.30
1.40 v VCC v 1.60
1.65 v VCC v 1.95
2.30 v VCC v 2.70
2.70 v VCC v 3.60
VCC − 0.1
VCC − 0.1
VCC − 0.2
VCC − 0.2
VCC − 0.2
VCC − 0.2
VCC − 0.1
VCC − 0.1
VCC − 0.2
VCC − 0.2
VCC − 0.2
VCC − 0.2
IOH = −2.0 mA
1.10 v VCC v 1.30
0.75 x VCC
0.75 x VCC
IOH = −4.0 mA
1.40 v VCC v 1.60
0.75 x VCC
0.75 x VCC
IOH = −6.0 mA
1.65 v VCC v 1.95
2.30 v VCC v 2.70
1.25
2.0
1.25
2.0
IOH = −12 mA
2.30 v VCC v 2.70
2.70 v VCC v 3.60
1.8
2.2
1.8
2.2
IOH = −18 mA
2.30 v VCC v 2.70
2.70 v VCC v 3.60
1.7
2.4
1.7
2.4
IOH = −24 mA
2.70 v VCC v 3.60
2.2
2.2
IOL = 100 mA
0.90
1.10 v VCC v 1.30
1.40 v VCC v 1.60
1.65 v VCC v 1.95
2.30 v VCC v 2.70
2.70 v VCC v 3.60
0.1
0.1
0.2
0.2
0.2
0.2
0.1
0.1
0.2
0.2
0.2
0.2
IOL = 2.0 mA
1.10 v VCC v 1.30
0.25 x VCC
0.25 x VCC
IOL = 4.0 mA
1.40 v VCC v 1.60
0.25 x VCC
0.25 x VCC
IOL = 6.0 mA
1.65 v VCC v 1.95
0.3
0.3
IOL = 12 mA
2.30 v VCC v 2.70
2.70 v VCC v 3.60
0.4
0.4
0.4
0.4
IOL = 18 mA
2.30 v VCC v 2.70
2.70 v VCC v 3.60
0.6
0.4
0.6
0.4
IOL = 24 mA
2.70 v VCC v 3.60
0.55
0.55
0 = VI = 3.6 V
0.90 to 3.60
±0.1
±0.9
mA
0
1
5
mA
0.90 to 3.60
0.9
5
mA
VI = VCC or GND
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3
V
NL17SV32XV5T2
AC CHARACTERISTICS (Input tr = tf = 3.0 nS)
−40°C
25°C
Min
Typ
85°C
Symbol
Parameter
Condition
VCC
Max
Min
Max
TPHL,
TPLH
Propagation Delay
CL = 15 pF, RL = 1.0 MW
0.90
CL = 15 pF, RL = 2.0 kW
1.10 v VCC v 1.30
1.40 v VCC v 1.60
3.0
1.0
6.0
3.2
15.8
8.7
1.0
1.0
18.6
9.7
nS
CL = 30 pF, RL = 500 kW
1.65 v VCC v 1.95
2.30 v VCC v 2.70
2.70 v VCC v 3.60
1.0
0.8
0.7
2.0
1.2
1.0
6.0
4.1
3.3
1.0
0.7
0.6
6.8
4.7
4.0
nS
13
Unit
nS
CIN
Input Capacitance
0
2.0
pF
COUT
Output Capacitance
0
4.5
pF
CPD
Power Dissipation
Capacitance
0.90 to 3.60
20
pF
VI = 0 V or VCC
F = 10 MHz
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4
NL17SV32XV5T2
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B−01
ISSUE B
D
−X−
5
A
4
1
e
2
3
E
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
L
HE
b 5 PL
0.08 (0.003)
c
M
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.70
1.20
1.30
0.50 BSC
0.10
0.20
0.30
1.50
1.60
1.70
DIM
A
b
c
D
E
e
L
HE
X Y
MIN
0.50
0.17
0.08
1.50
1.10
INCHES
NOM
MAX
0.022
0.024
0.009
0.011
0.005
0.007
0.063
0.067
0.047
0.051
0.020 BSC
0.004
0.008
0.012
0.059
0.063
0.067
MIN
0.020
0.007
0.003
0.059
0.043
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL17SV32XV5T2/D
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