DS90CR218A www.ti.com SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 DS90CR218A +3.3V Rising Edge Data Strobe LVDS 21-Bit Channel Link - 12 MHz to 85 MHz Check for Samples: DS90CR218A FEATURES 1 • • • • • • • • • • • • 12 to 85 MHz Shift Clock Support 50% Duty Cycle on Receiver Output Clock Low Power Consumption ±1V Common-mode Range (Around +1.2V) Narrow Bus Reduces Cable Size and Cost Up to 1.785 Gbps Throughput Up to 223 Mbytes/sec Bandwidth 345 mV (typ) Swing LVDS Devices for Low EMI PLL Requires No External Components Rising Edge Data Strobe Compatible with TIA/EIA-644 LVDS Standard Low Profile 48-Lead TSSOP Package DESCRIPTION The DS90CR218A receiver deserializes three input LVDS data streams into 21 bits of CMOS/TTL output data. When operating at the maximum input clock rate of 85 Mhz, the LVDS data is received at 595 Mbps per data channel for a total data throughput of 1.785 Gbit/sec (233 Mbytes/sec). The narrow bus and LVDS signalling of the DS90CR218A is an ideal means to solve EMI and cable size problems associated with wide, high-speed TTL interfaces. Block Diagram Figure 1. DS90CR218A Top View See Package Number DGG-48 (TSSOP) 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated DS90CR218A SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 www.ti.com Connection Diagrams Figure 2. DS90CR218A Typical Application Figure 3. Typical Application These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A DS90CR218A www.ti.com SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) −0.3V to +4V Supply Voltage (VCC) CMOS/TTL Input Voltage −0.5V to (VCC + 0.3V) CMOS/TTL Output Voltage −0.3V to (VCC + 0.3V) LVDS Receiver Input Voltage −0.3V to (VCC + 0.3V) Junction Temperature +150°C −65°C to +150°C Storage Temperature Range Lead Temperature (Soldering, 4 sec.) +260°C Maximum Package Power Dissipation @ +25°C TSSOP Package 1.89 W DS90CR218A Package Derating ESD Rating 15 mW/°C above +25°C (HBM, 1.5kΩ, 100pF) > 7kV (EIAJ, 0Ω, 200pF) > 700V Latch Up Tolerance @ 25°C (1) (2) > ±300mA If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. “Electrical Characteristics” specify conditions for device operation. Recommended Operating Conditions Min Nom Max Supply Voltage (VCC) 3.0 3.3 3.6 V Operating Free Air Temperature (TA) −10 +25 +70 °C Receiver Input Range 0 Supply Noise Voltage (VCC) Units 2.4 V 100 mVPP Electrical Characteristics (1) Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min Typ Max Units VCC V 0.8 V CMOS/TTL DC SPECIFICATIONS VIH High Level Input Voltage 2.0 VIL Low Level Input Voltage VOH High Level Output Voltage IOH = −0.4 mA VOL Low Level Output Voltage IOL = 2 mA 0.06 0.3 V VCL Input Clamp Voltage ICL = −18 mA −0.79 −1.5 V IIN Input Current VIN = 0.4V, 2.5V or VCC +1.8 +15 μA −120 mA +100 mV GND 2.7 −10 VIN = GND IOS Output Short Circuit Current 3.3 μA 0 −60 VOUT = 0V V LVDS RECEIVER DC SPECIFICATIONS VTH Differential Input High Threshold VTL Differential Input Low Threshold IIN Input Current VCM = +1.2V −100 mV VIN = +2.4V, VCC = 3.6V ±10 μA VIN = 0V, VCC = 3.6V ±10 μA 60 mA RECEIVER SUPPLY CURRENT ICCRW (1) (2) Receiver Supply Current (2) Worst Case CL = 8 pF, Worst Case Pattern Figure 4 Figure 5 f = 33 MHz 49 f = 40 MHz 53 65 mA f = 66 MHz 78 100 mA f = 85 MHz 90 115 mA Typical values are given for VCC = 3.3V and TA = +25°C. Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise specified (except VOD and ΔVOD). Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A 3 DS90CR218A SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 www.ti.com Electrical Characteristics(1) (continued) Over recommended operating supply and temperature ranges unless otherwise specified. Symbol ICCRZ Parameter Receiver Supply Current (2) Conditions Power Down Min PWR DWN = Low Receiver Outputs Stay Low during Powerdown Mode Typ Max Units 140 400 μA Receiver Switching Characteristics (1) Over recommended operating supply and temperature ranges unless otherwise specified. Typ Max Units CLHT Symbol CMOS/TTL Low-to-High Transition Time Figure 5 2.0 3.5 ns CHLT CMOS/TTL High-to-Low Transition Time Figure 5 1.8 3.5 ns RSPos0 Receiver Input Strobe Position for Bit 0 Figure 11 0.49 0.84 1.19 ns RSPos1 Receiver Input Strobe Position for Bit 1 2.17 2.52 2.87 ns RSPos2 Receiver Input Strobe Position for Bit 2 3.85 4.20 4.55 ns RSPos3 Receiver Input Strobe Position for Bit 3 5.53 5.88 6.23 ns RSPos4 Receiver Input Strobe Position for Bit 4 7.21 7.56 7.91 ns RSPos5 Receiver Input Strobe Position for Bit 5 8.89 9.24 9.59 ns RSPos6 Receiver Input Strobe Position for Bit 6 10.57 10.92 11.27 ns RSKM Parameter RxIN Skew Margin (2) Min f = 85 MHz Figure 12 f = 85 MHz 0.49 f = 12MHz 2.01 ns ns RCOP RxCLK OUT Period Figure 6 RCOH RxCLK OUT High Time Figure 6 RCOL RxCLK OUT Low Time Figure 6 RSRC RxOUT Setup to RxCLK OUT Figure 6 3.5 ns RHRC RxOUT Hold to RxCLK OUT Figure 6 3.5 ns f = 85 MHz (3) T 83.33 ns 4 5 6.5 ns 3.5 5 6 ns RCCD RxCLK IN to RxCLK OUT Delay @ 25°C, VCC = 3.3V 9.5 ns RPLLS Receiver Phase Lock Loop Set Figure 8 10 ms RPDD Receiver Powerdown Delay Figure 10 1 μs (1) (2) (3) Figure 7 11.76 5.5 7 Typical values are given for VCC = 3.3V and TA = +25°C. Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the receiver input setup and hold time (internal data sampling window). This margin do not take into account the Transmitter Pulse Position (TPPOS) variance and is measured using the ideal TPPOS. This margin allows LVDS interconnect skew, inter-symbol interference (both dependent on type/length of cable), Transmitter Pulse Position (TPPOS) variance, and source clock jitter less than 250 ps. Total latency for the channel link chipset is a function of clock period and gate delays through the transmitter (TCCD) and receiver (RCCD). The total latency for the 217/287 transmitter and 218A/288A receiver is: (T + TCCD) + (2*T + RCCD), where T = Clock period. AC Timing Diagrams Figure 4. “Worst Case” Test Pattern 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A DS90CR218A www.ti.com SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 Figure 5. DS90CR218A (Receiver) CMOS/TTL Output Load and Transition Times Figure 6. DS90CR218A (Receiver) Setup/Hold and High/Low Times Figure 7. DS90CR218A (Receiver) Clock In to Clock Out Delay Figure 8. DS9OCR218A (Receiver) Phase Lock Loop Set Time Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A 5 DS90CR218A SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 www.ti.com Figure 9. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs Figure 10. Receiver Powerdown Delay 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A DS90CR218A www.ti.com SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 Figure 11. Receiver LVDS Input Strobe Position Ideal Strobe Position RxIN+ or RxINC RxIN+ or RxINRSKM RSKM min Tppos Ideal max Rsposn Tppos Ideal C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max Tppos Ideal — Calculated Transmitter output pulse position RSKM ≥ Cable Skew (type, length) + Source Clock Jitter (Cycle-to-cycle)(1) + ISI (Inter-symbol interference) + TPPOS variance (Tx dependent)(2) Cable Skew—typically 10 ps–40 ps per foot, media dependent (1) Cycle-to-cycle jitter is less than 250 ps at 85MHz (2) ISI is dependent on interconnect length; may be zero Figure 12. Receiver LVDS Input Skew Margin Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A 7 DS90CR218A SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 www.ti.com APPLICATIONS INFORMATION DS90CR218A PIN DESCRIPTIONS — Channel Link Receiver Pin Name RxIN+ I/O No. I 3 Positive LVDS differential data inputs. Description RxIN− I 3 Negative LVDS differential data inputs. RxOUT O 21 TTL level data outputs. RxCLK IN+ I 1 Positive LVDS differential clock input. RxCLK IN− I 1 Negative LVDS differential clock input. RxCLK OUT O 1 TTL level clock output. The rising edge acts as data strobe. Pin name RxCLK OUT. PWR DWN I 1 TTL level input. When asserted (low input) the receiver outputs are low. VCC I 4 Power supply pins for TTL outputs. GND I 5 Ground pins for TTL outputs. PLL VCC I 1 Power supply for PLL. PLL GND 1 2 Ground pin for PLL. LVDS VCC I 1 Power supply pin for LVDS inputs. LVDS GND I 3 Ground pins for LVDS inputs. The Channel Link devices are intended to be used in a wide variety of data transmission applications. Depending upon the application the interconnecting media may vary. For example, for lower data rate (clock rate) and shorter cable lengths (< 2m), the media electrical performance is less critical. For higher speed/long distance applications the media's performance becomes more critical. Certain cable constructions provide tighter skew (matched electrical length between the conductors and pairs). Twin-coax for example, has been demonstrated at distances as great as 5 meters and with the maximum data transfer of 1.785 Gbit/s. Additional applications information can be found in the following Interface Application Notes: AN = #### Topic AN-1041 (SNLA218) Introduction to Channel Link AN-1108 (SNLA008) Channel Link PCB and Interconnect Design-In Guidelines AN-1109 (SNLA220) Multi-Drop Channel-Link Operation AN-806 (SNLA026) Transmission Line Theory AN-905 (SNLA035) Transmission Line Calculations and Differential Impedance AN-916 (SNLA219) Cable Information CABLES A cable interface between the transmitter and receiver needs to support the differential LVDS pairs. The ideal cable/connector interface would have a constant 100Ω differential impedance throughout the path. It is also recommended that cable skew remain below 90ps (@ 85 MHz clock rate) to maintain a sufficient data sampling window at the receiver. In addition to the four or five cable pairs that carry data and clock, it is recommended to provide at least one additional conductor (or pair) which connects ground between the transmitter and receiver. This low impedance ground provides a common-mode return path for the two devices. Some of the more commonly used cable types for point-to-point applications include flat ribbon, flex, twisted pair and Twin-Coax. All are available in a variety of configurations and options. Flat ribbon cable, flex and twisted pair generally perform well in short point-to-point applications while Twin-Coax is good for short and long applications. When using ribbon cable, it is recommended to place a ground line between each differential pair to act as a barrier to noise coupling between adjacent pairs. For Twin-Coax cable applications, it is recommended to utilize a shield on each cable pair. All extended point-to-point applications should also employ an overall shield surrounding all cable pairs regardless of the cable type. This overall shield results in improved transmission parameters such as faster attainable speeds, longer distances between transmitter and receiver and reduced problems associated with EMS or EMI. 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A DS90CR218A www.ti.com SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 The high-speed transport of LVDS signals has been demonstrated on several types of cables with excellent results. However, the best overall performance has been seen when using Twin-Coax cable. Twin-Coax has very low cable skew and EMI due to its construction and double shielding. All of the design considerations discussed here and listed in the supplemental application notes provide the subsystem communications designer with many useful guidelines. It is recommended that the designer assess the tradeoffs of each application thoroughly to arrive at a reliable and economical cable solution. RECEIVER FAILSAFE FEATURE These receivers have input failsafe bias circuitry to guarantee a stable receiver output for floating or terminated receiver inputs. Under these conditions receiver inputs will be in a HIGH state. If a clock signal is present, data outputs will all be HIGH; if the clock input is also floating/terminated, data outputs will remain in the last valid state. A floating/terminated clock input will result in a HIGH clock output. BOARD LAYOUT To obtain the maximum benefit from the noise and EMI reductions of LVDS, attention should be paid to the layout of differential lines. Lines of a differential pair should always be adjacent to eliminate noise interference from other signals and take full advantage of the noise canceling of the differential signals. The board designer should also try to maintain equal length on signal traces for a given differential pair. As with any high-speed design, the impedance discontinuities should be limited (reduce the numbers of vias and no 90 degree angles on traces). Any discontinuities which do occur on one signal line should be mirrored in the other line of the differential pair. Care should be taken to ensure that the differential trace impedance match the differential impedance of the selected physical media (this impedance should also match the value of the termination resistor that is connected across the differential pair at the receiver's input). Finally, the location of the CHANNEL LINK TxOUT/RxIN pins should be as close as possible to the board edge so as to eliminate excessive pcb runs. All of these considerations will limit reflections and crosstalk which adversely effect high frequency performance and EMI. UNUSED INPUTS All unused outputs at the RxOUT outputs of the receiver must then be left floating. TERMINATION Use of current mode drivers requires a terminating resistor across the receiver inputs. The CHANNEL LINK chipset will normally require a single 100Ω resistor between the true and complement lines on each differential pair of the receiver input. The actual value of the termination resistor should be selected to match the differential mode characteristic impedance (90Ω to 120Ω typical) of the cable. Figure 13 shows an example. No additional pull-up or pull-down resistors are necessary as with some other differential technologies such as PECL. Surface mount resistors are recommended to avoid the additional inductance that accompanies leaded resistors. These resistors should be placed as close as possible to the receiver input pins to reduce stubs and effectively terminate the differential lines. Figure 13. LVDS Serialized Link Termination Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A 9 DS90CR218A SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 www.ti.com DECOUPLING CAPACITORS Bypassing capacitors are needed to reduce the impact of switching noise which could limit performance. For a conservative approach three parallel-connected decoupling capacitors (Multi-Layered Ceramic type in surface mount form factor) between each VCC and the ground plane(s) are recommended. The three capacitor values are 0.1 μF, 0.01 μF and 0.001 μF. An example is shown in Figure 14. The designer should employ wide traces for power and ground and ensure each capacitor has its own via to the ground plane. If board space is limiting the number of bypass capacitors, the PLL VCC should receive the most filtering/bypassing. Next would be the LVDS VCC pins and finally the logic VCC pins. Figure 14. CHANNEL LINK Decoupling Configuration CLOCK JITTER The CHANNEL LINK devices employ a PLL to generate and recover the clock transmitted across the LVDS interface. The width of each bit in the serialized LVDS data stream is one-seventh the clock period. For example, a 85 MHz clock has a period of 11.76 ns which results in a data bit width of 1.68 ns. Differential skew (Δt within one differential pair), interconnect skew (Δt of one differential pair to another) and clock jitter will all reduce the available window for sampling the LVDS serial data streams. Care must be taken to ensure that the clock input to the transmitter be a clean low noise signal. Individual bypassing of each VCC to ground will minimize the noise passed on to the PLL, thus creating a low jitter LVDS clock. These measures provide more margin for channelto-channel skew and interconnect skew as a part of the overall jitter/skew budget. COMMON-MODE vs. DIFFERENTIAL MODE NOISE MARGIN The typical signal swing for LVDS is 300 mV centered at +1.2V. The CHANNEL LINK receiver supports a 100 mV threshold therefore providing approximately 200 mV of differential noise margin. Common-mode protection is of more importance to the system's operation due to the differential data transmission. LVDS supports an input voltage range of Ground to +2.4V. This allows for a ±1.0V shifting of the center point due to ground potential differences and common-mode noise. 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A DS90CR218A www.ti.com SNLS054D – NOVEMBER 1999 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS90CR218A 11 PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS90CR218AMTD/NOPB ACTIVE TSSOP DGG 48 38 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -10 to 70 DS90CR218AMTD >B DS90CR218AMTDX/NOPB ACTIVE TSSOP DGG 48 1000 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -10 to 70 DS90CR218AMTD >B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS90CR218AMTDX/NOP B Package Package Pins Type Drawing TSSOP DGG 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 24.4 Pack Materials-Page 1 8.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.2 1.6 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90CR218AMTDX/NOPB TSSOP DGG 48 1000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated