MASW-004103-1365 Silicon SP4T Surface Mount HMIC PIN Diode Switch 50 MHZ - 20 GHz Rev. V5 Features Operates 50 MHz to 20 GHz Usable up to 26 GHz Low Insertion Loss High Isolation Low Parasitic Capacitance and Inductance RoHS Compliant Surmount Package Rugged, Fully Monolithic Glass Encapsulated Construction Up to +38 dBm C.W. Power Handling @ +25°C Silicon Nitride Passivation Polymer Scratch Protection Solderable Functional Schematic Description The MASW-004103-1365 is a SP4T, surmount, broadband, monolithic switch using four sets of series and shunt connected PIN diodes. This device is designed for use in broadband, low to moderate signal, high performance, switch applications up to 20 GHz. It is a surface mountable switch configured for optimized performance and offers a distinct advantage over MMIC, beamlead and chip and wire hybrid designs. Because the PIN diodes of the MASW-004103-1365 are integrated into the chip and kept within close proximity, the parasitics typically associated with other designs that use individual components are kept to a minimum. To minimize the parasitics and achieve high performance the MASW-004103-1365 is fabricated using MACOMs’ patented HMIC™ (Heterolithic Microwave Integrated Circuit) process. This process allows the silicon pedestals, which form the series and shunt diodes or vias, to be imbeded in low loss, low dispersion glass. The combination of low loss glass and using tight spacing between elements results in an HMIC device with low loss and high isolation through low millimeter wave frequencies. The topside is fully encapsulated with silicon nitride and also has an additional layer of polymer for scratch and impact protection. The protective coating guards against damage to the junction and the anode airbridges during handling and assembly. On the backside of the chip gold metalized pads have been added to produce a solderable surmount device. J4 J3 J2 J5 J1 Pin Configuration Pin Function J1 RFC J2 RF1 J3 RF2 J4 RF3 J5 RF4 Ordering Information Part Number Package MASW-004103-13650G 50 piece gel pack MASW-004103-13655P 500 piece reel MASW-004103-13650P 3000 piece reel MASW-004103-001SMB Sample Test Board 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-004103-1365 Silicon SP4T Surface Mount HMIC PIN Diode Switch 50 MHZ - 20 GHz Rev. V5 Electrical Specifications: TA = 25°C, PIN = 0 dBm, Z0 = 50 Ω, 20 mA / -10 V Parameter Conditions Units Min. Typ. Max. Insertion Loss 6 GHz 13 GHz 20 GHz dB — 0.5 0.8 1.2 0.6 1.0 1.5 Isolation 6 GHz 13 GHz 20 GHz dB 48 38 29 51 39 32 — Input Return Loss 6 GHz 13 GHz 20 GHz dB 17 13 12 21 17 16 — Output to Output Isolation 6 GHz 13 GHz 20 GHz dB — 53.5 41.5 31.5 — Input 0.1dB Compression Point 2 GHz dB — 36 — IIP3 0.5 GHz, 5 MHz Spacing, 20 dBm 1 GHz, 10 MHz Spacing, 20 dBm 2 GHz, 10 MHz Spacing, 20 dBm dBm — 60 63 64 — Switching Speed1 — ns — 20 — Voltage Rating2 — V — — 80 1. Typical Switching Speed measured from 10% to 90 % of detected RF signal driven by TTL compatible drivers. 2. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 µA maximum @ -80 volts. Absolute Maximum Ratings3,4 Absolute Maximum Static Sensitivity Operating Temperature -65 °C to +125 °C Storage Temperature -65 °C to +150 °C These devices are rated at Class 1A Human Body Model. Proper ESD control techniques should be used when handling these devices. Junction Temperature +175 °C Applied Reverse Voltage |-80 V| Parameter RF CW Incident Power 2 GHz 20 GHz Bias Current +25°C 3. 4. 38 dBm 33 dBm ± 50 mA Exceeding any one or combination of these limits may cause permanent damage to this device. MACOM does not recommend sustained operation near these survivability limits. Combined maximum operating conditions for RF power, DC bias, & temperature: 33 dBm CW, 20 mA per diode, +85ºC 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-004103-1365 Silicon SP4T Surface Mount HMIC PIN Diode Switch 50 MHZ - 20 GHz Rev. V5 Typical Performance Curves Insertion Loss @ 20mA -10V RF Input to RF Outputs (J1 to J2, J3, J4, J5) Isolation @ 20mA -10V RF Input to RF Outputs (J1 to J2, J3, J4, J5) 0.0 0 J1 J1 J1 J1 J2 J3 J4 J5 J1 J1 J1 J1 -20 Isolation (dB) Insertion Loss (dB) -0.5 TO TO TO TO -1.0 TO TO TO TO J2 J3 J4 J5 -40 -60 -1.5 -80 -2.0 -100 0 5 10 15 20 25 30 0 10 15 20 25 Frequency (GHz) Input Return Loss @ 20mA -10V RF Input to RF Outputs (J1 to J2, J3, J4, J5) Output Return Loss @ 20mA -10V RF Input to RF Outputs (J1 to J2, J3, J4, J5) 0 30 0 J1 J1 J1 J1 -10 TO TO TO TO J2 J3 J4 J5 -20 -30 J1 J1 J1 J1 -10 Output Return Loss (dB) Input Return Loss (dB) 5 Frequency (GHz) TO TO TO TO J2 J3 J4 J5 -20 -30 -40 -40 0 5 10 15 20 25 30 0 5 10 Frequency (GHz) 15 20 25 30 Frequency (GHz) Output to Output Isolation @ 20mA, -10V J2 to J3 and J4 to J5 MASW-004103-1365 Maximum Input Power Curve Baseplate Temperature fixed @ 25degC 12 0 10 J4 TO J5 Input Power (Watts) Output to Output Isolation (dB) J2 TO J3 -20 -40 8 2GHz, 6.4W 6 4 10GHz, 3.1W 2 -60 20GHz, 2W 0 -80 0 3 5 10 15 20 25 30 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Insertion Loss (dB) Frequency (GHz) M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 1.6 MASW-004103-1365 Silicon SP4T Surface Mount HMIC PIN Diode Switch 50 MHZ - 20 GHz Rev. V5 Bias Control Optimal operation of the MASW-004103-1365 is achieved by simultaneous application of negative DC voltage and current to the low loss switching arm and positive DC voltage and current to the remaining switching arms as shown in the applications circuit below. DC return is achieved via R2 on the RFC path. In the low loss state, the series diode must be forward biased with current and the shunt diode reverse biased with voltage. In the isolated arm, the shunt diode is forward biased with current and the series diode is reverse biased with voltage. Driver Connections Control Level (DC Currents and Voltages) B2 J1-J2 J1-J3 J1-J4 J1-J5 Low Loss Isolation Isolation Isolation +6 V at +20 mA -15 V at -20 mA +6 V at +20 mA +6 V at +20 mA Isolation Low Loss Isolation Isolation +6 V at +20 mA +6 V at +20 mA -15 V at -20 mA5 +6 V at +20 mA Isolation Isolation Low Loss Isolation Isolation Isolation Isolation Low Loss -15 V at -20 mA B3 5 B4 Condition of RF Output B5 +6 V at +20 mA +6 V at +20 mA +6 V at +20 mA 5 +6 V at +20 mA +6 V at +20 mA +6 V at +20 mA -15 V at -20 mA 5 5. The voltage applied to the off arm is allowed to vary provided a constant current is applied through the shunt diode on the off arm. Application Circuit6,7,8,9,10 Example: J1 to J2→ Low Loss R1 = 250Ω R2 = 450Ω B2 = -15V B3, B4, B5 = 6V 6. 7. 8. 9. 10. 4 Assume Vf ~ 1 V at 20 mA R1 = 5 V / 0.02 A = 250 Ω; R2 = 9 V / 0.02 A = 450 Ω PR1 = 0.02 A x 0.02 A x 250 = 0.1 W PR2 = 0.02 A x 0.02 A x 450 = 0.18 W Inductors shown in the above schematic are RF bias chokes. The operating bandwidth of a broad-band PIN diode switch is often dependent on the bias components, particularly the RF bias chokes. It is suggested that the response at the frequencies of interest be measured with all the bias components in place prior to installing of MASW-004103-1365. M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-004103-1365 Silicon SP4T Surface Mount HMIC PIN Diode Switch 50 MHZ - 20 GHz Rev. V5 Outline Drawing and Footprint (All dimensions in µm) DC & RF GND 1) 2) 3) 4) Bottom view shows the back metal foot print and mounting pads. All dimension are +/-0.5 µm. Ground radius is 200 µm and centered on the I/O Pad. The center pad shown on the chip bottom view must be connected to RF and DC ground MASW-004103-1365 DIM Inches mm MIN MAX MIN MAX Width Length 0.06220 0.08740 0.06417 0.08937 1.580 2.220 1.630 2.270 Thickness 0.00394 0.00591 0.100 0.150 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-004103-1365 Silicon SP4T Surface Mount HMIC PIN Diode Switch 50 MHZ - 20 GHz Rev. V5 Sample Board Samples test boards are available upon request Handling Procedures Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting pads are conveniently located on the bottom of the chip and are removed from the active junction locations making it well suited for solder attachment. Connections may be made onto hard or soft substrates via the use of 80Au/20Sn, or RoHS compliant solders. Typical re-flow profiles for provided in Application Note M538 , “Surface Mounting Instructions“ and can viewed in the Customer Support, Technical Resources section of the MA-COM Technology Solutions website at www.macomtech.com. For applications where the average power is ≤ 1W, a thermally conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150°C. When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum pick up tool with a soft tip is recommended while placing the chip . When soldering to soft substrates, such as Duroid, a soft solder is recommended at the circuit board to chip mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die so that its mounting pads are aligned with the circuit board land pads. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. PCB Land Pattern (All dims. in µm) DC & RF GND 6 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-004103-1365 Silicon SP4T Surface Mount HMIC PIN Diode Switch 50 MHZ - 20 GHz Rev. V5 Pocket Tape Information Carrier Tape Dimensions .157 ± .004 4.00 ± 0.10 .157 ± .004 4.00 ± 0.10 .079 ± .002 2.00 ± 0.05 Ф .059 ± .004 THRU 1.5 ± .069 ± .004 1.75 ± 0.10 +.012 .138 3.5 ± 0.05 +0.30 8.00 - 0.10 .093 ± .002 2.36 ± 0.05 Ф 0.035 THRU TYP. Ф 0.89 .012 ± .001 0.30 ± 0.03 5° MAX. .012 ± .002 0.30 ± 0.05 POCKET DEPTH .066 ± .002 1.80 ± 0.05 Chip Orientation in Tape 7 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-004103-1365 Silicon SP4T Surface Mount HMIC PIN Diode Switch 50 MHZ - 20 GHz Rev. V5 Reel Information A INCHES MIN. MAX. MIN. MAX. A 6.980 7.019 177.3 178.3 B .059 .098 1.5 2.5 C .504 .520 12.8 13.2 D .795 .815 20.2 20.7 N 2.146 2.185 54.5 55.5 W1 .331 .337 8.4 8.55 W2 —- .567 —- 14.4 DIM MM 8 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support