ON NL7SZ18MUR2G 1−to−2 demultiplexer with 3−state deselected output Datasheet

NL7SZ18
1−to−2 Demultiplexer with
3−State Deselected Output
Features
• High−Speed Propagation Delay
•
•
•
•
•
•
tPD 2.5 nS (Typ), Load 50 pF @ 5.0 V
Power Down Impedance
Outputs in High−Z
Output Drive Capability
32 mA @ 5.0 V
Broad VCC Operating Range
1.65 V to 5.5 V
Surface Mount Technology
SC−70, 6−Lead and UDFN6 Packaging
OVT* on Inputs/Outputs
Pb−Free Package is Available
MARKING DIAGRAMS
1
SOT−363/SC70−6/SC−88
DF SUFFIX
CASE 419B
LD M G
G
1
TM
G
1
UDFN6
MU SUFFIX
CASE 517AA
LD, T
M
G
= Device Marking
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
Typical Applications
•
•
•
•
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M
The NL7SZ18 is a high−performance non−inverting 1−to−2
demultiplexer. With the Select input [S] at Low, data at A is passed to
Y0 and Y1 is set to high impedance. With the Select input [S] at High,
data at A is passed to Y1 and Y0 is set to high impedance. The device
operates over the voltage range from 1.65 V to 5.5 V.
This device has been optimized for on−board buffering applications
and offers mixed (1.65 V, 2.3 V, 3.0 V and 5.5 V) voltage capability by
providing over voltage tolerance (OVT*) circuitry on I/O pins.
PIN ASSIGNMENT
Cell Phones
PDAs
Digital Cameras
Video Cameras
Important Information
• ESD Protection: MM >200 V, Human Body Model >2000 V
• Latch−Up Max Rating: 300 mA
• Pin−to−Pin Compatible with NC7SZ18
S
1
6
Y0
GND
2
5
VCC
A
3
4
Y1
*Over Voltage Tolerance (OVT) enables input and output pins to function outside
(higher) of their operating voltages, with no damage to the devices or to signal
integrity.
(TOP VIEW)
TRUTH TABLE
PIN/FUNCTION TABLE
Input
Output
Pin
Function
S
A
A
Data Input
Y0
Y1
S
Demultiplexer Select
Y0
Output 1
L
L
H
H
L
H
L
H
L
H
Z
Z
Z
Z
L
H
Y1
Output 2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 7
1
Publication Order Number:
NL7SZ18/D
NL7SZ18
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
DC Supply Voltage
VCC
−0.5 to +7.0
V
DC Input Voltage
VIN
−0.5 to +7.0
V
VOUT
−0.5 to +7.0
V
DC Input Diode Current @ V1 t −0.5 V
IIK
−50
mA
DC Output Diode Current @ V1 t −0.5 V
IOK
−50
mA
DC Output Sink Current
IOUT
"50
mA
DC Supply Current per Supply Pin
ICC
"100
mA
DC Ground Current per Ground Pin
IGND
"100
mA
Storage Temperature Range
TSTG
−65 to +150
°C
DC Output Voltage
Lead Temperature, 1 mm from Case for 10 Seconds
TL
260
°C
Junction Temperature Under Bias
TJ
+150
°C
Thermal Resistance (Note 1)
qJA
250
°C/W
Power Dissipation in Still Air at 85°C
PD
180
mW
MSL
Level 1
−
FR
UL 94 V−0 @ 0125 in
−
VESD
> 2000
> 200
n/a
V
Moisture Sensitivity
Flammability Rating
Oxygen Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Rating
Symbol
Value
Unit
DC Supply Voltage
VCC
1.65 to 5.5
V
DC Supply Voltage, Data Retention
VCC
1.5 to 5.5
V
Input Voltage
VIN
0 to 5.5
V
VOUT
0 to 5.5
V
Output Voltage
Operating Temperature
Input Rise and Fall Times
VCC @ 1.8 " 0.15 V
VCC @ 2.5 " 0.2 V
VCC @ 3.3 " 0.3 V
VCC @ 5.0 " 0.5 V
Thermal Resistance
TA
−40 to 85
°C
tr, tf
0 to 20
0 to 20
0 to 10
0 to 5
nS/V
qJA
350
°C/W
ORDERING INFORMATION
Package
Shipping †
SC70−6
3000 / Tape & Reel
NL7SZ18DFT2G
SC70−6
(Pb−Free)
3000 / Tape & Reel
NL7SZ18MUR2G
UDFN6
(Pb−Free)
3000 / Tape & Reel
Device Order Number
NL7SZ18DFT2
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
NL7SZ18
DC ELECTRICAL CHARACTERISTICS
Parameter
Condition
Symbol
TA = 255C
VCC
(V)
Min
0.75 VCC
0.70 VCC
Typ
TA = −405C to 855C
Max
Min
High−Level
Input Voltage
VIH
1.65−1.95
2.3−5.5
Low−Level
Output Voltage
VIL
1.65−1.95
2.3−5.5
VOH
1.65
2.3
3.0
4.5
1.55
2.20
2.90
4.40
1.65
2.30
3.00
4.50
1.55
2.20
2.90
4.40
1.65
2.3
3.0
3.0
4.5
1.29
1.90
2.40
2.30
3.80
1.52
2.15
2.80
2.68
4.20
1.29
1.90
2.40
2.30
3.80
High−Level
Output Voltage
VIN = VIH
IOH = −100 ma
IOH = −4.0 mA
IOH = −8.0 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
Low−Level
Output Voltage
VIN = VIL
IOL = 100 ma
VOL
IOL = 4.0 mA
IOL = 8.0 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
Max
0.75 VCC
0.70 VCC
0.25 VCC
0.30 VCC
Unit
V
0.25 VCC
0.30 VCC
V
V
1.65
2.3
3.0
4.5
0.0
0.0
0.0
0.0
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
1.65
2.3
3.0
3.0
4.5
0.08
0.10
0.15
0.22
0.22
0.24
0.30
0.40
0.55
0.55
0.24
0.30
0.40
0.55
0.55
V
Input Leakage
Current
VIN = 5.5 V, GND
IIN
0.0 to 5.5
"0.1
"1.0
mA
Output High−Z
Current
VIN = VIH or VIL
0 t Vout v 5.5 V
IOZ
1.65 to 5.5
"0.5
"5.0
mA
Power−Off
Leakage
Current
VIN or VCC = 5.5 V
IOFF
0.0
1.0
10
mA
Quiescent
Supply Current
VIN = 5.5 V, GND
ICC
1.8 to 5.5
1.0
10
mA
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3
NL7SZ18
AC ELECTRICAL CHARACTERISTICS
TA = −405C to
855C
TA = 255C
Parameter
Propagation Delay
A to Y0 or Y1
Output Enable Time
Condition
CL = 15 pF
RD = 1.0 MW
S = OPEN
Figure
Figures
1&3
VCC
Min
Typ
Max
Min
Max
Unit
tPLH
tPHL
1.8 " 0.15
2.5 " 0.2
3.3 " 0.3
5.0 " 0.5
2.0
1.0
0.8
0.5
6.3
3.6
2.7
2.0
10.1
5.7
4.0
3.1
2.0
1.0
0.8
0.5
10.5
6.0
4.3
3.3
nS
3.3 " 0.3
5.0 " 0.5
1.2
0.8
3.4
2.5
4.9
3.9
1.2
0.8
5.4
4.2
nS
CL = 50 pF
RD = 500 W
S = OPEN
Figures
1&3
CL = 50 pF
RD, RU = 500 W
S = GND for tPZH
S = VIN for tPZL
VI = 2 x VCC
Figures
1&3
tPZL
tPZH
1.8 " 0.15
2.5 " 0.2
3.3 " 0.3
5.0 " 0.5
3.0
1.8
1.2
0.8
6.9
4.2
3.2
2.5
12
6.8
5.0
4.0
3.0
1.8
1.2
0.8
12.5
7.3
5.5
4.3
nS
CL = 50 pF
RD, RD = 500 W
S = GND for tPHZ
S = VIN for tPLZ
VI = 2 x VCC
Figures
1&3
tPLZ
tPHZ
1.8 " 0.15
2.5 " 0.2
3.3 " 0.3
5.0 " 0.5
2.5
1.5
0.8
0.3
6.0
4.0
2.9
1.8
10
6.8
4.9
3.5
2.5
1.5
0.8
0.3
10.5
7.1
5.3
3.7
nS
CIN
COUT
OPEN
3.3
2.5
4.0
pF
CPD
3.3
5.0
16
19.5
pF
Input Capacitance
Output Capacitance
Power Dissipation
Capacitance
Symbol
Note 5
Figure 2
5. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle (see Figure 2). CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCDstatic).
VI
OPEN
GND
VCC
A
RU
OUTPUT
A
S
INPUT
CL
A
OUTPUT
RD
Figure 1. AC Test Circuit
Figure 2. ICCD Test Circuit
CL Includes Load and Stray Capacitance
Input PRR = 1.0 MHz; tW = 500 nS
Input = AC Waveform; tr = tf = 1.8 nS
PRR = 10 MHz; Duty Cycle = 50%
S Input = GND or x
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4
NL7SZ18
tr = 3 nS
tf = 3 nS
90%
50%
A Input
VCC
90%
50%
10%
10%
tPLH
GND
tPHL
VOH
50%
50%
Output
VOL
IR = tF = 3 nS
90%
S Input
50%
50%
10%
10%
tPZL
Output
VCC
90%
GND
tPLZ
50%
VOL + 0.3 V
tPHZ
tPZH
Output
VOH
VOH − 0.3 V
50%
Figure 3. AC Waveforms
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5
VOL
NL7SZ18
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
D
e
6
5
4
1
2
3
HE
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
b 6 PL
0.2 (0.008)
M
E
M
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
NL7SZ18
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE A
PIN ONE
REFERENCE
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
ÉÉ
ÉÉ
ÉÉ
E
DIM
A
A1
A3
b
D
E
e
L
L2
TOP VIEW
2X
0.10 C
(A3)
0.10 C
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.00 BSC
1.20 BSC
0.40 BSC
0.30
0.40
0.40
0.50
A
10X
0.08 C
6X
C
A1
5X
1
MOUNTING FOOTPRINT*
SEATING
PLANE
SIDE VIEW
6X
0.42
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
BOTTOM VIEW
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL7SZ18/D
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