MOTOROLA MPX700GP 0 to 700 kpa (0-100 psi) 60 mv full scale span (typical) Datasheet

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by MPX700/D
SEMICONDUCTOR TECHNICAL DATA
The MPX700 series device is a silicon piezoresistive pressure sensor providing a very
accurate and linear voltage output — directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola’s single
element strain gauge design.
0 to 700 kPa (0 – 100 psi)
60 mV FULL SCALE SPAN
(TYPICAL)
Features
• Low Cost
• Patented, Silicon Shear Stress Strain Gauge Design
• Linearity to ± 0.5% (Max) Linearity
• Easy to Use Chip Carrier Package Options
• Ratiometric to Supply Voltage
• 60 mV Span (Typ)
• Absolute, Differential and Gauge Options
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
Application Examples
• Environmental Control Systems
• Pneumatic Control Systems
• Appliances
• Automotive Performance Controls
• Medical Instrumentation
• Industrial Controls
DIFFERENTIAL
PORT OPTION
CASE 344C–01, STYLE 1
Figure 1 illustrates a schematic of the internal circuitry on the stand–alone pressure
sensor chip.
PIN 3
+ VS
NOTE: Pin 1 is the notched pin.
PIN 2
+ Vout
X–ducer
PIN 4
– Vout
PIN NUMBER
1
Gnd
3
VS
2
+Vout
4
–Vout
PIN 1
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The absolute sensor has a built–in reference vacuum. The output voltage will decrease
as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly,
output voltage increases as increasing vacuum is applied to the vacuum (P2) side
relative to the pressure (P1) side. This sensor is designed for applications where P1 is
always greater than, or equal to P2.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 5
Motorola Sensor Device Data
 Motorola, Inc. 1997
1
MAXIMUM RATINGS
Rating
Overpressure(8) (P2
v 1 Atmosphere)
v 1 Atmosphere)
Symbol
Value
Unit
P1max
2800
kPa
Burst Pressure(8) (P2
P1burst
5000
kPa
Storage Temperature
Tstg
– 40 to +125
°C
TA
– 40 to +125
°C
Operating Temperature
OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted. P1
Characteristic
w P2; P2 v 1 Atmosphere.)
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
700
kPa
Supply Voltage(2)
VS
—
3.0
6.0
Vdc
Supply Current
Io
—
6.0
—
mAdc
VFSS
45
60
90
mV
Full Scale Span(3)
Offset(4)
Voff
0
20
35
mV
∆V/∆P
—
86
—
µV/kPa
—
– 0.5
– 1.0
—
—
0.5
1.0
%VFSS
Pressure Hysteresis(5) (0 to 700 kPa)
—
—
± 0.1
—
%VFSS
Temperature Hysteresis(5) (– 40°C to +125°C)
—
—
± 0.5
—
%VFSS
Temperature Coefficient of Full Scale Span(5)
TCVFSS
– 0.21
—
– 0.15
%VFSS/°C
TCVoff
—
±15
—
µV/°C
TCR
0.34
—
0.4
%Zin/°C
Sensitivity
Linearity(5)
MPX700D
MPX700A
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Zin
400
—
550
Ω
Zout
750
—
1800
Ω
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm–Up (7)
—
—
20
—
ms
Symbol
Min
Typ
Max
Unit
—
—
2.0
—
Grams
Input Impedance
Output Impedance
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element, Case 344–15)
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
• TCR:
Zin deviation with minimum rated pressure applied, over the temperature range of – 40°C to +125°C,
relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
8. Basic Element only, Case 344–15.
9. P2 max : 500 kPa.
2
Motorola Sensor Device Data
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX700 series over temperature.
The X–ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components
or by designing your system using the MPX2700 series
sensors.
Several approaches to external temperature compensation over both – 40 to +125°C and 0 to + 80°C ranges are
presented in Motorola Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
70
80
– 40°C
MPX700
VS = 3 Vdc
P1 > P2
60
LINEARITY
+ 125°C
50
+ 25°C
SPAN
RANGE
(TYP)
40
30
20
50
OUTPUT (mVdc)
OUTPUT (mVdc)
70
ACTUAL
40
SPAN
(VFSS)
30
THEORETICAL
20
OFFSET
(TYP)
10
0
PSI 0
20
140
kPa
40
60
280
420
PRESSURE DIFFERENTIAL
80
100
560
700
Figure 2. Output versus Pressure Differential
SILICONE GEL
DIE COAT
DIFFERENTIAL/GAUGE
STAINLESS STEEL
DIE
METAL COVER
P1
EPOXY
CASE
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
P2
DIE
BOND
10
OFFSET
(VOFF)
0
0
MAX
POP
PRESSURE (kPA)
Figure 3. Linearity Specification Comparison
SILICONE GEL ABSOLUTE
DIE COAT
DIE
P1
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
WIRE BOND
LEAD FRAME
ABSOLUTE ELEMENT
P2
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
Figure 4. Cross–Sectional Diagrams (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344–15). A silicone gel isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPX700 series pressure sensor operating character-
Motorola Sensor Device Data
istics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information regarding media compatibility in your application.
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The differential or
gauge sensor is designed to operate with positive differential
Part Number
pressure applied, P1 > P2. The absolute sensor is designed
for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table on the below:
Case Type
Pressure (P1) Side Identifier
MPX700A, MPX700D
344–15C
Stainless Steel Cap
MPX700DP
344C–01
Side with Part Marking
MPX700AP, MPX700GP
344B–01
Side with Port Attached
MPX700GVP
344D–01
Stainless Steel Cap
MPX700AS, MPX700GS
344E–01
Side with Port Attached
MPX700ASX, MPX700GSX
344F–01
Side with Port Attached
MPX700GVSX
344G–01
Stainless Steel Cap
ORDERING INFORMATION
MPX700 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPX Series
D i T
Device
Type
O i
Options
C
Case
Type
T
Order Number
Device Marking
Basic Element
Absolute, Differential
Case 344–15
MPX700A
MPX700D
MPX700A
MPX700D
Ported Elements
Differential
Case 344C–01
MPX700DP
MPX700DP
Absolute, Gauge
Case 344B–01
MPX700AP
MPX700GP
MPX700AP
MPX700GP
Gauge Vacuum
Case 344D–01
MPX700GVP
MPX700GVP
Absolute, Gauge Stove Pipe
Case 344E–01
MPX700AS
MPX700GS
MPX700A
MPX700D
Absolute, Gauge Axial
Case 344F–01
MPX700ASX
MPX700GSX
MPX700A
MPX700D
Gauge Vacuum Axial
Case 344G–01
MPX700GVSX
MPX700D
4
Motorola Sensor Device Data
PACKAGE DIMENSIONS
NOTES:
C
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
POSITIVE
PRESSURE (P1)
R
M
B
–A–
DIM
A
B
C
D
F
G
J
L
M
N
R
N
1
PIN 1
2
3
L
4
–T–
SEATING
PLANE
J
POSITIVE
PRESSURE
(P1)
G
F
D
4 PL
0.136 (0.005)
T A
M
M
INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.016
0.020
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30_ NOM
0.475
0.495
0.430
0.450
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.41
0.51
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30_ NOM
12.07
12.57
10.92
11.43
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344–15
ISSUE W
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
–A–
–T–
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
–Q–
B
1 2
3 4
PIN 1
K
–P–
0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.016
0.020
0.048
0.064
0.100 BSC
0.182
0.194
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.230
0.250
0.220
0.240
0.910 BSC
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.41
0.51
1.22
1.63
2.54 BSC
4.62
4.93
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344B–01
ISSUE B
Motorola Sensor Device Data
5
PACKAGE DIMENSIONS — CONTINUED
PORT #1
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
–A–
U
V
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
–Q–
B
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
–P–
–T–
–T–
0.25 (0.010)
T Q
M
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.016
0.020
0.048
0.064
0.100 BSC
0.182
0.194
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.248
0.278
0.310
0.330
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.41
0.51
1.22
1.63
2.54 BSC
4.62
4.93
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
6.30
7.06
7.87
8.38
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344C–01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
–A–
U
L
SEATING
PLANE
–T–
R
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
H
PORT #2
VACUUM
(P2)
POSITIVE
PRESSURE
(P1)
N
–Q–
B
1 2
3 4
K
PIN 1
S
C
J
F
–P–
0.25 (0.010)
M
T Q
S
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.016
0.020
0.048
0.064
0.100 BSC
0.182
0.194
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.158
0.230
0.250
0.220
0.240
0.910 BSC
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.41
0.51
1.22
1.63
2.54 BSC
4.62
4.93
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344D–01
ISSUE B
6
Motorola Sensor Device Data
PACKAGE DIMENSIONS — CONTINUED
PORT #1
POSITIVE
PRESSURE
(P1)
–B–
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
BACK SIDE
VACUUM
(P2)
DIM
A
B
C
D
F
G
J
K
N
R
S
V
V
4 3
2 1
PIN 1
K
J
N
MILLIMETERS
MIN
MAX
17.53
18.28
6.22
6.48
19.81
20.82
0.41
0.51
1.22
1.63
2.54 BSC
0.36
0.41
8.76
9.53
7.62
7.87
4.52
4.72
5.59
6.10
4.62
4.93
G
STYLE 1:
PIN 1.
2.
3.
4.
F
R
SEATING
PLANE
S
INCHES
MIN
MAX
0.690
0.720
0.245
0.255
0.780
0.820
0.016
0.020
0.048
0.064
0.100 BSC
0.014
0.016
0.345
0.375
0.300
0.310
0.178
0.186
0.220
0.240
0.182
0.194
D 4 PL
0.13 (0.005)
–T–
M
T B
M
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344E–01
ISSUE B
–T–
C
A
E
–Q–
U
N
V
B
R
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
–P–
0.25 (0.010)
M
T Q
M
4
3
2
1
S
K
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MIN
MAX
1.080
1.120
0.740
0.760
0.630
0.650
0.016
0.020
0.160
0.180
0.048
0.064
0.100 BSC
0.014
0.016
0.220
0.240
0.070
0.080
0.150
0.160
0.150
0.160
0.440
0.460
0.695
0.725
0.840
0.860
0.182
0.194
MILLIMETERS
MIN
MAX
27.43
28.45
18.80
19.30
16.00
16.51
0.41
0.51
4.06
4.57
1.22
1.63
2.54 BSC
0.36
0.41
5.59
6.10
1.78
2.03
3.81
4.06
3.81
4.06
11.18
11.68
17.65
18.42
21.34
21.84
4.62
4.92
G
D 4 PL
0.13 (0.005)
M
T P
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
V (+) OUT
V SUPPLY
V (–) OUT
CASE 344F–01
ISSUE B
Motorola Sensor Device Data
7
PACKAGE DIMENSIONS — CONTINUED
–T–
C
A
E
–Q–
U
POSITIVE
PRESSURE
(P1)
N
V
B
R
PIN 1
PORT #2
VACUUM
(P2)
–P–
0.25 (0.010)
M
T Q
M
1
2
3
4
S
K
F
J
G
D 4 PL
0.13 (0.005)
M
T P
S
Q
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MIN
MAX
1.080
1.120
0.740
0.760
0.630
0.650
0.016
0.020
0.160
0.180
0.048
0.064
0.100 BSC
0.014
0.016
0.220
0.240
0.070
0.080
0.150
0.160
0.150
0.160
0.440
0.460
0.695
0.725
0.840
0.860
0.182
0.194
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
27.43
28.45
18.80
19.30
16.00
16.51
0.41
0.51
4.06
4.57
1.22
1.63
2.54 BSC
0.36
0.41
5.59
6.10
1.78
2.03
3.81
4.06
3.81
4.06
11.18
11.68
17.65
18.42
21.34
21.84
4.62
4.92
GROUND
V (+) OUT
V SUPPLY
V (–) OUT
CASE 344G–01
ISSUE B
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315
Mfax: [email protected] – TOUCHTONE 602–244–6609
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
INTERNET: http://motorola.com/sps
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