PHILIPS BZG04-36 Transient voltage suppressor diode Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D168
BZG04 series
Transient voltage suppressor
diodes
Preliminary specification
Supersedes data of 1996 Jun 10
1996 Sep 19
Philips Semiconductors
Preliminary specification
Transient voltage suppressor diodes
BZG04 series
FEATURES
DESCRIPTION
• Glass passivated
DO-214AC surface mountable
package with glass passivated chip.
• High maximum operating
temperature
• Low leakage current
• Excellent stability
,,
,,
,,
cathode
band
handbook, 4 columns
• UL 94V-O classified plastic
package
• Transient suppressor stand-off
voltage range:
8.2 to 220 V for 32 types
• Shipped in 12 mm embossed tape.
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
k
a
Top view
Side view
MSA473
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
10/1000 µs exponential pulse
(see Fig.4); Tj = 25 °C prior to
surge; see also Fig.2
MIN.
MAX.
UNIT
−
300
W
PRSM
non-repetitive peak reverse power
dissipation
Tstg
storage temperature
−65
+175
°C
Tj
junction temperature
−65
+175
°C
1996 Sep 19
2
Philips Semiconductors
Preliminary specification
Transient voltage suppressor diodes
BZG04 series
ELECTRICAL CHARACTERISTICS
Total series
Tj = 25 °C unless otherwise specified.
SYMBOL
VF
PARAMETER
forward voltage
CONDITIONS
IF = 0.5 A; see Fig.3
MIN.
MAX.
−
1.2
UNIT
V
Per type
Tj = 25 °C unless otherwise specified.
TYPE
NUMBER
REVERSE
BREAKDOWN
VOLTAGE
TEMPERATURE
COEFFICIENT
TEST
CURRENT
CLAMPING
VOLTAGE
V(BR)R (V)
at Itest
SZ (%/K) at Itest
Itest
(mA)
V(CL)R (V) at IRSM (A)
note 1
MAX.
MIN.
REVERSE CURRENT
at STAND-OFF
VOLTAGE
IR (µA)
MIN.
MAX.
BZG04-10
9.4
10.4
11.4
0.05
0.05
0.05
0.09
0.10
0.10
50
50
50
14.8
15.7
17.0
20.3
19.1
17.7
20
5
5
BZG04-11
12.4
0.05
0.10
50
18.9
15.9
5
11
BZG04-12
13.8
0.05
0.10
50
20.9
14.4
5
12
BZG04-13
15.3
0.06
0.11
25
22.9
13.1
5
13
BZG04-15
16.8
0.06
0.11
25
25.6
11.7
5
15
BZG04-16
18.8
0.06
0.11
25
28.4
10.6
5
16
BZG04-18
20.8
0.06
0.11
25
31.0
9.7
5
18
BZG04-20
22.8
0.06
0.11
25
33.8
8.9
5
20
BZG04-22
25.1
0.06
0.11
25
38.1
7.9
5
22
BZG04-24
28
0.06
0.11
25
42.2
7.1
5
24
BZG04-27
31
0.06
0.11
25
46.2
6.5
5
27
BZG04-30
34
0.06
0.11
10
50.1
6.0
5
30
BZG04-33
37
0.06
0.11
10
54.1
5.5
5
33
BZG04-36
40
0.07
0.12
10
60.7
4.9
5
36
BZG04-39
44
0.07
0.12
10
65.5
4.6
5
39
BZG04-43
48
0.07
0.12
10
70.8
4.2
5
43
BZG04-47
52
0.07
0.12
10
78.6
3.8
5
47
BZG04-51
58
0.08
0.13
10
86.5
3.5
5
51
BZG04-56
64
0.08
0.13
10
94.4
3.2
5
56
BZG04-62
70
0.08
0.13
10
103.5
2.9
5
62
BZG04-68
77
0.08
0.13
10
114
2.6
5
68
BZG04-75
85
0.09
0.13
5
126
2.4
5
75
BZG04-82
94
0.09
0.13
5
139
2.2
5
82
BZG04-91
104
0.09
0.13
5
152
2.0
5
91
BZG04-100
114
0.09
0.13
5
167
1.8
5
100
BZG04-8V2
BZG04-9V1
1996 Sep 19
3
MAX.
at VR
(V)
8.2
9.1
10
Philips Semiconductors
Preliminary specification
Transient voltage suppressor diodes
TYPE
NUMBER
BZG04 series
REVERSE
BREAKDOWN
VOLTAGE
TEMPERATURE
COEFFICIENT
TEST
CURRENT
CLAMPING
VOLTAGE
V(BR)R (V)
at Itest
SZ (%/K) at Itest
Itest
(mA)
V(CL)R (V) at IRSM (A)
note 1
MAX.
MIN.
MIN.
MAX.
REVERSE CURRENT
at STAND-OFF
VOLTAGE
IR (µA)
MAX.
at VR
(V)
BZG04-110
124
0.09
0.13
5
185
1.6
5
110
BZG04-120
138
0.09
0.13
5
204
1.5
5
120
BZG04-130
153
0.09
0.13
5
224
1.3
5
130
BZG04-150
168
0.09
0.13
5
249
1.2
5
150
BZG04-160
188
0.09
0.13
5
276
1.1
5
160
BZG04-180
208
0.09
0.13
2
305
1.0
5
180
BZG04-200
228
0.09
0.13
2
336
0.9
5
200
BZG04-220
251
0.09
0.13
2
380
0.8
5
220
Note
1. Non-repetitive peak reverse current in accordance with “IEC 60-1, Section 8” (10/1000 µs pulse); see Fig.4.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-tp
thermal resistance from junction to tie-point
Rth j-a
thermal resistance from junction to ambient
CONDITIONS
VALUE
UNIT
25
K/W
note 1
100
K/W
note 2
150
K/W
Notes
1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5.
2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5.
For more information please refer to the “General Part of associated Handbook”.
1996 Sep 19
4
Philips Semiconductors
Preliminary specification
Transient voltage suppressor diodes
BZG04 series
GRAPHICAL DATA
MBH452
104
handbook, halfpage
MBH453
3
handbook, halfpage
IF
(A)
PZSM
(W)
103
2
102
1
10
10−2
10−1
0
1
tp (ms)
1
0
10
2
VF (V)
Tj = 25 °C prior to surge.
Tj = 25 °C.
Fig.2
Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
Fig.3
Forward current as a function of forward
voltage; typical values.
IRSMhalfpage
handbook,
50
(%)
100
90
4.5
50
50
2.5
10
t
t1
1.25
t2
MSB213
MGD521
In accordance with “IEC 60-1, Section 8”.
t1 = 10 µs.
t2 = 1000 µs.
Dimensions in mm.
Fig.4
Non-repetitive peak reverse current pulse
definition.
1996 Sep 19
Fig.5 Printed-circuit board for surface mounting.
5
Philips Semiconductors
Preliminary specification
Transient voltage suppressor diodes
BZG04 series
PACKAGE OUTLINE
5.5
5.1
4.5
4.3
handbook, full pagewidth
2.3
2.0
0.05
2.8 1.6
2.4 1.4
,
,
,
,
0.2
3.3
2.7
MSA414
Dimensions in mm.
The marking band indicates the cathode.
Fig.6 DO-214AC; SOD106.
1996 Sep 19
6
Philips Semiconductors
Preliminary specification
Transient voltage suppressor diodes
BZG04 series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Sep 19
7
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