Kingbright APC3216MGC 3.2 x 1.6mm(1206) smd chip led Datasheet

3.2x1.6mm SMD CHIP LED LAMP
APC3216MGC
Features
MEGA GREEN
Description
!3.2mmx1.6mm SMT LED, 1.1mm THICKNESS.
!LOW POWER CONSUMPTION.
The Mega Green source color devices are made with
DH InGaAlP on GaAs substrate Light Emitting Diode.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
! VARIOUS
COLORS AND LENS TYPES AVAILABLE.
! PACKAGE
: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD1005
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE:MAR/20/2003
DRAWN:D.L.HUANG
PAGE: 1 OF 4
Selection Guide
Par t No .
Dic e
APC3216MGC
Iv (m c d )
@ 20 m A
L en s Ty p e
MEGA GREEN ( InGaAlP )
WATER CLEAR
V i ew i n g
An g l e
Min .
Ty p .
2θ1/2
18
70
120°
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°°C
Sy m b o l
Par am et er
D ev i c e
λpeak
Peak Wavelength
Mega Green
λD
Dominate Wavelength
∆λ 1/2
Ty p .
Max .
Un it s
Tes t Co n d it io n s
574
nm
I F =20mA
Mega Green
568
nm
I F =20mA
Spectral Line Half-width
Mega Green
26
nm
I F =20mA
C
Capacitance
Mega Green
20
pF
VF=0V;f=1MHz
VF
Forward Voltage
Mega Green
2.1
2.5
V
I F =20mA
IR
Reverse Current
Mega Green
10
uA
V R = 5V
Absolute Maximum Ratings at T)=25°°C
P ar am e t e r
Meg a Gr een
Un it s
Power dissipation
105
mW
DC Forward Current
30
mA
Peak Forward Current [1]
150
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAD1005
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE:MAR/20/2003
DRAWN:D.L.HUANG
PAGE: 2 OF 4
Mega Green
SPEC NO: DSAD1005
APPROVED : J. Lu
APC3216MGC
REV NO: V.1
CHECKED :Allen Liu
DATE:MAR/20/2003
DRAWN:D.L.HUANG
PAGE: 3 OF 4
APC3216MGC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD1005
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE:MAR/20/2003
DRAWN:D.L.HUANG
PAGE: 4 OF 4
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