Cypress CY7C1021BNV33L-15ZXI 64 k ã 16 static ram cmos for optimum speed/power Datasheet

CY7C1021BNV33
64 K × 16 Static RAM
64 K × 16 Static RAM
Features
Functional Description[1]
■
3.3 V operation (3.0 V–3.6 V)
The CY7C1021BNV33 is a high-performance CMOS static RAM
organized as 65,536 words by 16 bits. This device has an
automatic power-down feature that significantly reduces power
consumption when deselected.
■
High speed
❐ tAA = 15 ns
■
CMOS for optimum speed/power
■
Low Active Power
❐ 576 mW (max)
■
Low CMOS Standby Power
❐ 1.80 mW (max)
■
Automatic power-down when deselected
■
Independent control of upper and lower bits
■
Available in 44-pin TSOP II and 400-mil SOJ
■
Available in a 48-ball Mini BGA package
Writing to the device is accomplished by taking Chip Enable (CE)
and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is
LOW, then data from I/O pins (I/O0 through I/O7), is written into
the location specified on the address pins (A0 through A15). If
Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8
through I/O15) is written into the location specified on the address
pins (A0 through A15).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then
data from memory will appear on I/O8 to I/O15. See the truth table
at the back of this data sheet for a complete description of read
and write modes.
The input/output pins (I/O0 through I/O15) are placed in a
high-impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW,
and WE LOW).
The CY7C1021BNV33 is available in 400-mil-wide SOJ,
standard 44-pin TSOP Type II, and 48-ball mini BGA packages.
Note
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.
Cypress Semiconductor Corporation
Document #: 001-06433 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 8, 2011
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CY7C1021BNV33
Logic Block Diagram
64K x 16
RAM Array
SENSE AMPS
A7
A6
A5
A4
A3
A2
A1
A0
ROW DECODER
DATA IN DRIVERS
I/O0–I/O7
I/O8–I/O15
A8
A9
A10
A11
A12
A13
A14
A15
COLUMN DECODER
BHE
WE
CE
OE
BLE
Selection Guide
-15
Maximum Access Time (ns)
15
Maximum Operating Current (mA)
160
Maximum CMOS Standby Current (mA)
0.5
Document #: 001-06433 Rev. *C
Page 2 of 17
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CY7C1021BNV33
Contents
Pin Configurations ........................................................... 4
Maximum Ratings ............................................................. 5
Operating Range ............................................................... 5
Electrical Characteristics ................................................. 5
Capacitance ...................................................................... 5
AC Test Loads and Waveforms ....................................... 6
Switching Characteristics ................................................ 7
Data Retention Characteristics ....................................... 8
Data Retention Waveform ................................................ 8
Switching Waveforms ...................................................... 9
Read Cycle No. 1 ........................................................ 9
Read Cycle No. 2 (OE Controlled) .............................. 9
Write Cycle No. 1 (CE Controlled) ............................. 10
Write Cycle No. 2 (BLE or BHE Controlled) .............. 10
Write Cycle No. 2 (WE Controlled, OE LOW) ........... 11
Document #: 001-06433 Rev. *C
Truth Table ...................................................................... 11
Ordering Information ...................................................... 12
Ordering Code Definitions ......................................... 12
Package Diagrams .......................................................... 13
Acronyms ........................................................................ 15
Document Conventions ................................................. 15
Units of Measure ....................................................... 15
Document History Page ................................................. 16
Sales, Solutions, and Legal Information ...................... 17
Worldwide Sales and Design Support ....................... 17
Products .................................................................... 17
PSoC Solutions ......................................................... 17
Page 3 of 17
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CY7C1021BNV33
Pin Configurations
SOJ / TSOP II
Top View
A4
A3
A2
A1
A0
CE
I/O0
I/O1
I/O2
I/O3
VCC
VSS
I/O4
I/O5
I/O6
I/O7
WE
A15
A14
A13
A12
NC
1
44
2
3
43
42
4
41
40
39
38
5
6
7
8
9
10
11
12
37
36
35
34
33
32
31
30
29
28
27
13
14
15
16
17
18
19
20
21
22
26
25
24
23
A5
A6
A7
OE
BHE
BLE
I/O15
I/O14
I/O13
I/O12
VSS
VCC
I/O11
I/O10
I/O9
I/O8
NC
A8
A9
A10
A11
NC
Mini BGA
Top View
Document #: 001-06433 Rev. *C
1
2
3
4
5
6
BLE
OE
A0
A1
A2
NC
A
I/O8 BHE
A3
A4
CE
I/O0
B
I/O9 I/O10
A5
A6
I/O1
I/O2
C
VSS I/O11 NC
A7
I/O3 VCC
D
VCC I/O12 NC
NC
I/O4
VSS
E
I/O14 I/O13 A14
A15 I/O6
I/O6
F
I/O15 NC
A12
A13
WE I/O7
G
NC
A9
A10
A11
H
A8
NC
Page 4 of 17
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CY7C1021BNV33
DC Input Voltage[2] .............................. –0.5 V to VCC + 0.5 V
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage Temperature ............................... –65 °C to +150 °C
Ambient Temperature with
Power Applied .......................................... –55 °C to +125 °C
Supply Voltage on VCC to Relative GND[2] ...–0.5 V to +4.6 V
DC Voltage Applied to Outputs
in High Z State[2] .................................. –0.5 V to VCC + 0.5 V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage.......................................... > 2001 V
(per MIL-STD-883, Method 3015)
Latch-Up Current .................................................... > 200 mA
Operating Range
Range
Ambient Temperature
VCC
–40 °C to +85 °C
3.3 V  10%
Industrial
Electrical Characteristics
Over the Operating Range
Parameter
Description
Test Conditions
VOH
Output HIGH Voltage
VCC = Min, IOH = –4.0 mA
VOL
Output LOW Voltage
VCC = Min, IOL = 8.0 mA
VIH
VIL
IIX
Input Load Current
IOZ
Output Leakage Current
ICC
ISB1
ISB2
-15
Min
Max
Unit
2.4
–
V
–
0.4
V
Input HIGH Voltage
2.2
VCC + 0.3 V
V
Input LOW Voltage[2]
–0.3
0.8
V
GND < VI < VCC
–1
+1
A
GND < VI < VCC, Output Disabled
–1
+1
A
VCC Operating Supply Current
VCC = Max, IOUT = 0 mA, f = fMAX = 1/tRC
–
160
mA
Automatic CE Power Down Current
—TTL Inputs
Max VCC, CE > VIH, VIN > VIH or VIN < VIL, f = fMAX
–
40
mA
Automatic CE Power Down Current
—CMOS Inputs
Max VCC, CE > VCC – 0.3 V, VIN > VCC – 0.3 V or
VIN < 0.3 V, f = 0
–
500
A
Capacitance[3]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25 °C, f = 1 MHz
Max
Unit
6
pF
8
pF
Notes
2. Minimum voltage is –2.0 V for pulse durations of less than 20 ns.
3. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-06433 Rev. *C
Page 5 of 17
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CY7C1021BNV33
AC Test Loads and Waveforms
R 317
3.3 V
R 317
3.3 V
OUTPUT
3.0 V
OUTPUT
30 pF
R2
351
INCLUDING
JIG AND
SCOPE
(a)
5 pF
INCLUDING
JIG AND
SCOPE
(b)
OUTPUT
Equivalent to: THÉVENIN
EQUIVALENT
Document #: 001-06433 Rev. *C
R2
351 
167
GND
Rise Time: 1 V/ns
ALL INPUT PULSES
90%
10%
90%
10%
Fall Time: 1 V/ns
1.73 V
30 pF
Page 6 of 17
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CY7C1021BNV33
Switching Characteristics[4]
Over the Operating Range
Parameter
Description
-15
Min
Max
Unit
READ CYCLE
tRC
Read Cycle Time
15
–
ns
tAA
Address to Data Valid
–
15
ns
tOHA
Data Hold from Address Change
3
–
ns
tACE
CE LOW to Data Valid
–
15
ns
tDOE
OE LOW to Data Valid
–
7
ns
tLZOE
OE LOW to Low Z
0
–
ns
–
7
ns
3
–
ns
Z[5, 6]
tHZOE
OE HIGH to High
tLZCE
CE LOW to Low Z[6]
Z[5, 6]
tHZCE
CE HIGH to High
–
7
ns
tPU
CE LOW to Power-Up
0
–
ns
tPD
CE HIGH to Power-Down
–
15
ns
tDBE
Byte Enable to Data Valid
–
7
ns
tLZBE
Byte Enable to Low Z
0
–
ns
Byte Disable to High Z
–
7
ns
tWC
Write Cycle Time
15
–
ns
tSCE
CE LOW to Write End
10
–
ns
tAW
Address Set-Up to Write End
10
–
ns
tHA
Address Hold from Write End
0
–
ns
tSA
Address Set-Up to Write Start
0
–
ns
tPWE
WE Pulse Width
10
–
ns
tSD
Data Set-Up to Write End
8
–
ns
tHD
Data Hold from Write End
0
–
ns
tLZWE
WE HIGH to Low Z[6]
3
–
ns
–
7
ns
9
–
ns
tHZBE
WRITE
CYCLE[7]
Z[5, 6]
tHZWE
WE LOW to High
tBW
Byte Enable to End of Write
Notes
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
5. tHZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads and Waveforms on page 6. Transition is measured
500 mV from steady-state voltage.
6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
7. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a write,
and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates
the write.
Document #: 001-06433 Rev. *C
Page 7 of 17
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CY7C1021BNV33
Data Retention Characteristics
Over the Operating Range (L version only)
Parameter
Description
Conditions[8]
Min
Max
Unit
2.0
–
V
–
100
A
Chip Deselect to Data Retention Time
0
–
ns
Operation Recovery Time
15
–
ns
VDR
VCC for Data Retention
ICCDR
Data Retention Current
tCDR[9]
tR[10]
VCC = VDR = 2.0 V,
CE > VCC – 0.3 V,
VIN > VCC – 0.3 V or VIN < 0.3 V
Data Retention Waveform
DATA RETENTION MODE
VCC
3.0 V
VDR > 2 V
tCDR
3.0 V
tR
CE
Notes
8. No input may exceed VCC + 0.5 V.
9. Tested initially and after any design or process changes that may affect these parameters.
10. tr < 3 ns for the -12 and -15 speeds. tr < 5 ns for the -20 and slower speeds.
Document #: 001-06433 Rev. *C
Page 8 of 17
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CY7C1021BNV33
Switching Waveforms
Read Cycle No. 1[11, 12]
tRC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 (OE Controlled)[12, 13]
ADDRESS
tRC
CE
tACE
OE
tHZOE
tDOE
BHE, BLE
tLZOE
tHZCE
tDBE
tLZBE
DATA OUT
HIGH IMPEDANCE
tLZCE
VCC
SUPPLY
CURRENT
tHZBE
DATA VALID
HIGH
IMPEDANCE
tPD
tPU
50%
50%
IICC
CC
IISB
SB
Notes
11. Device is continuously selected. OE, CE, BHE and/or BHE = VIL.
12. WE is HIGH for read cycle.
13. Address valid prior to or coincident with CE transition LOW.
Document #: 001-06433 Rev. *C
Page 9 of 17
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CY7C1021BNV33
Switching Waveforms(continued)
Write Cycle No. 1 (CE Controlled)[14, 15]
tWC
ADDRESS
CE
tSA
tSCE
tAW
tHA
tPWE
WE
tBW
BHE, BLE
tSD
tHD
DATA I/O
Write Cycle No. 2 (BLE or BHE Controlled)
tWC
ADDRESS
BHE, BLE
tSA
tBW
tAW
tHA
tPWE
WE
tSCE
CE
tSD
tHD
DATA I/O
Notes
14. Data I/O is high impedance if OE or BHE and/or BLE= VIH.
15. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
Document #: 001-06433 Rev. *C
Page 10 of 17
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CY7C1021BNV33
Switching Waveforms(continued)
Write Cycle No. 2 (WE Controlled, OE LOW)
tWC
ADDRESS
tSCE
CE
tAW
tHA
tSA
tPWE
WE
tBW
BHE, BLE
tHZWE
tSD
tHD
DATA I/O
tLZWE
Truth Table
CE
OE
WE
H
X
L
L
L
X
BLE
BHE
X
X
X
High Z
High Z
Power-Down
Standby (ISB)
H
L
L
Data Out
Data Out
Read - All bits
Active (ICC)
L
H
Data Out
High Z
Read - Lower bits only
Active (ICC)
H
L
High Z
Data Out
Read - Upper bits only
Active (ICC)
L
L
Data In
Data In
Write - All bits
Active (ICC)
L
H
Data In
High Z
Write - Lower bits only
Active (ICC)
H
L
High Z
Data In
Write - Upper bits only
Active (ICC)
L
I/O0–I/O7
I/O8–I/O15
Mode
Power
L
H
H
X
X
High Z
High Z
Selected, Outputs Disabled
Active (ICC)
L
X
X
H
H
High Z
High Z
Selected, Outputs Disabled
Active (ICC)
Document #: 001-06433 Rev. *C
Page 11 of 17
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CY7C1021BNV33
Ordering Information
Cypress offers other versions of this type of product in many different configurations and features. The following table contains only
the list of parts that are currently available. For a complete listing of all options, visit the Cypress website at http://www.cypress.com
and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative.
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the office
closest to you, visit us at http://www.cypress.com/go/datasheet/offices.
Speed (ns)
Ordering Code
Package
Diagram
Package Type
15
CY7C1021BNV33L-15BAI
51-85096
48-ball Mini BGA (7 mm × 7 mm)
CY7C1021BNV33L-15VXI
51-85082
44-pin (400-Mil) Molded SOJ (Pb-free)
CY7C1021BNV33L-15ZXI
51-85087
44-pin TSOP Type II (Pb-free)
Operating
Range
Industrial
Ordering Code Definitions
CY 7 C 1 02 1 BN V33
L - 15
XX
I
Temperature Range:
I = Industrial
Package Type: XX = BA or VX or ZX
BA = 48-ball Mini BGA
VX = 44-pin Molded SOJ (Pb-free)
ZX = 44-pin TSOP Type II (Pb-free)
Speed: 15 ns
L = Low power
V33 = Voltage range (3 V to 3.6 V)
BN = 0.25 µm Technology
1 = Data width × 16-bits
02 = 1-Mbit density
1 = Fast Asynchronous SRAM family
Technology Code: C = CMOS
7 = SRAM
CY = Cypress
Please contact local sales representative regarding availability of these parts.
Document #: 001-06433 Rev. *C
Page 12 of 17
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CY7C1021BNV33
Package Diagrams
Figure 1. 48-ball FBGA (7 mm × 7 mm × 1.2 mm), 51-85096
51-85096 *I
Figure 2. 44-pin (400-Mil) Molded SOJ, 51-85082
51-85082 *C
Document #: 001-06433 Rev. *C
Page 13 of 17
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CY7C1021BNV33
Package Diagrams(continued)
Figure 3. 44-pin TSOP Type II, 51-85087
51-85087 *C
Document #: 001-06433 Rev. *C
Page 14 of 17
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CY7C1021BNV33
Acronyms
Document Conventions
Acronym
Description
Units of Measure
BGA
ball grid array
CMOS
complementary metal oxide semiconductor
ns
nano seconds
Symbol
Unit of Measure
CE
chip enable
µs
micro seconds
FBGA
Fine-Pitch Ball Grid Array

ohms
I/O
input/output
V
Volts
OE
output enable
µA
micro Amperes
SOJ
small outline J-lead
mA
milli Amperes
SRAM
static random access memory
mm
milli meter
TTL
transistor-transistor logic
MHz
Mega Hertz
TSOP
thin small-outline package
pF
pico Farad
WE
write enable
°C
degree Celcius
%
percent
mW
milli Watts
W
Watts
Document #: 001-06433 Rev. *C
Page 15 of 17
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CY7C1021BNV33
Document History Page
Document Title: CY7C1021BNV33 64 K × 16 Static RAM
Document Number: 001-06433
REV.
ECN NO.
Issue Date
Orig. of
Change
Description of Change
**
423847
See ECN
NXR
New Data Sheet
*A
2897061
03/22/10
AJU
Removed obsolete parts from ordering information table
Updated package diagrams
*B
3109897
12/14/2010
AJU
Added Ordering Code Definitions
*C
3103073
03/08/2011
PRAS
Document #: 001-06433 Rev. *C
Updated Package Diagrams.
Added Acronyms and Units of Measure.
Updated in new template.
Page 16 of 17
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CY7C1021BNV33
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
PSoC Solutions
cypress.com/go/automotive
cypress.com/go/clocks
psoc.cypress.com/solutions
cypress.com/go/interface
PSoC 1 | PSoC 3 | PSoC 5
cypress.com/go/powerpsoc
cypress.com/go/plc
Memory
Optical & Image Sensing
PSoC
Touch Sensing
USB Controllers
Wireless/RF
cypress.com/go/memory
cypress.com/go/image
cypress.com/go/psoc
cypress.com/go/touch
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2006-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 001-06433 Rev. *C
Revised March 8, 2011
Page 17 of 17
All products and company names mentioned in this document may be the trademarks of their respective holders.
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