Microsemi LX5516 Ingap hbt 2.4 - 2.5 ghz power amplifier module Datasheet

LX5516
InGaP HBT 2.4 - 2.5 GHz Power Amplifier Module
®
TM
P RODUCTION D AT A S HEET
The LX5516 is a power amplifier
module
optimized
for
WLAN
applications
in
the
2.4-2.5GHz
frequency range. The PAM is
implemented as a two-stage monolithic
microwave integrated circuit (MMIC)
with on-chip active bias and 50 Ω
impedance matched at both input and
output.
The device is manufactured with an
InGaP/GaAs Heterojunction Bipolar
Transistor
(HBT)
IC
process
(MOCVD). With single low voltage
supply of 3.3V, it delivers 29dB power
gain between 2.4-2.5GHz, at a low
quiescent current of 80mA.
For 18dBm OFDM output power
(64QAM, 54Mbps), the PAM provides a
low EVM (Error-Vector Magnitude) of
2.5%, and consumes 130mA total DC
current.
The LX5516 is available in a 12-pin
2x2mm micro-lead package (MLPQ12L). The compact footprint, ultra low
profile, and thermal capability of the
MLP package make the LX5516 an
ideal solution for high-gain power
amplifier
requirements
for
IEEE
802.11b/g/n applications.
Advanced InGaP HBT
2.4-2.5GHz Operation
Single-Polarity 3.3V Supply
Quiescent Current ~80mA
Power Gain ~ 29 dB
Pout=~+18dBm for 2.5% EVM,
OFDM 64QAM/54Mbps
Total Current ~130mA for Pout=
+18dBm
50Ω Input/Output Matching
On-chip Output Power Detector
Small Footprint: 2x2mm2
Ultra Low Profile:0.46mm
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KEY FEATURES
DESCRIPTION
APPLICATIONS
IEEE 802.11b/g/n
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
BLOCK DIAGRAM
Vc
RF
Input
RF
Output
Match
Input
MatchRF
Output
Active Bias Network
Vcc
Vref
Det
2X2MM MLP PACKAGE
PACKAGE ORDER INFO
LL
LX5516
Plastic MLPQ
12 pin 2x2mm
LX5516LL
Note: Available in Tape & Reel. Append the letters
“TR” to the part number. (i.e. LX5516LL-TR)
Copyright  2008
Rev 1.0, 2008-12-16
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX5516
®
TM
InGaP HBT 2.4 - 2.5 GHz Power Amplifier Module
P RODUCTION D AT A S HEET
PACKAGE PIN OUT
DC Supply Voltage, RF off ..............................................................................5V
Collector Current...................................................................................... 500mA
Total Power Dissipation .................................................................................2W
RF Input Power (With 50 Ohm Load at Output) ...................................... +10 dBm
Maximum operating Junction Temperature (Tj)……………………………… …..
150°C
Operation Ambient Temperature ..................................................... -40 to +85°C
Storage Temperature.....................................................................-60 to +150°C
Package Peak Temp. for Solder Reflow (40 seconds maximum exposure)260°C (+0
-5)
VC1
RF
Output
RF Input
DET VB VCC
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A B SO LU TE M AX I MU M R A TIN G S
LL PACKAGE
(Bottom View)
Note: Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of specified terminal.
RoHS / Pb-free 100% NiPdAu Lead
Finish
TH ER M A L D A TA
LL
Plastic MLPQ 12-Pin
7.9 C/W
76.5 C/W
THERMAL RESISTANCE-JUNCTION TO CASE, θ JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ JA
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pcboard system. All of the above assume no ambient airflow.
FUNCTIONAL PIN DESCRIPTION
Name
RF IN (2)
VCC (4)
VB (5)
DET(6)
RF OUT(8)
VC1(11)
GND
Copyright  2008
Rev 1.0, 2008-12-16
RF input for the power amplifier.
Supply voltage for the bias reference and control circuits.
Bias control voltage for the first and second stage.
Output power Detector.
RF output and power supply for the second stage amplifier.
DC supply voltage for the first stage amplifier.
The center metal base of the MLP package provides both DC/RF ground as well as heat sink for the power
amplifier.
PACKAGE DATA
(1,3,7,9,10,
12)
Description
PINs to be grounded to the center metal on the PCB.
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
TM
®
Thank you for your interest in Microsemi® Analog Mixed Signal products.
The full data sheet for this device contains proprietary information.
To obtain a copy, please contact your local Microsemi sales representative. The
name of your local representative can be obtained at the following link
http://www.microsemi.com/contact/contactfind.asp
or
Contact us directly by sending an email to:
[email protected]
Be sure to specify the data sheet you are requesting and include your company
name and contact information and or vcard.
We look forward to hearing from you.
Copyright
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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INFORMATION
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