K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY Document Title 2M x 8 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial issue. April 10th 1998 Preliminary 1.0 Data Sheet 1998. July 14th 1998 Final 1.1 Data Sheet 1999. April 10th 1999 Final 1) Added CE don’t care mode during the data-loading and reading 1.2 1) Revised real-time map-out algorithm(refer to technical notes) July 23th 1999 Final 1.3 Changed device name - KM29W16000AT -> K9F1608W0A-TCB0 - KM29W16000AIT -> K9F1608W0A-TIB0 Sep.15th 1999 Final The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near you. 1 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY 2M x 8 Bit NAND Flash Memory FEATURES GENERAL DESCRIPTION • Voltage Supply : 2.7V ~ 5.5V • Organization - Memory Cell Array : (2M + 64K)bit x 8bit - Data Register : (256 + 8)bit x8bit • Automatic Program and Erase - Page Program : (256 + 8)Byte - Block Erase : (4K + 128)Byte - Status Register • 264-Byte Page Read Operation - Random Access : 10µs(Max.) - Serial Page Access : 80ns(Min.) • Fast Write Cycle Time - Program time : 250µs(typ.) - Block Erase time : 2ms (typ.) • Command/Address/Data Multiplexed I/O port • Hardware Data Protection - Program/Erase Lockout During Power Transitions • Reliable CMOS Floating-Gate Technology - Endurance : 1M Program/Erase Cycles - Data Retention : 10 years • Command Register Operation • 44(40) - Lead TSOP Type II (400mil / 0.8 mm pitch) - Forward Type The K9F1608W0A is a 2M(2,097,152)x8bit NAND Flash Memory with a spare 64K(65,536)x8bit. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. A program operation programs the 264-byte page in typically 250µs and an erase operation can be performed in typically 2ms on a 4K-byte block. Data in the page can be read out at 80ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command inputs. The on-chip write controller automates all program and erase system functions, including pulse repetition, where required, and internal verify and margining of data. Even the write-intensive systems can take advantage of the K9F1608W0A extended reliability of 1,000,000 program/erase cycles by providing either ECC(Error Correction Code) or real time mapping-out algorithm. These algorithms have been implemented in many mass storage applications and also the spare 8bytes of a page combined with the other 256 bytes can be utilized by system-level ECC. The K9F1608W0A is an optimum solution for large nonvolatile storage application such as solid state storage, digital voice recorder, digital still camera and other portable applications requiring nonvolatility. PIN CONFIGURATION PIN DESCRIPTION VSS CLE ALE WE WP N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C I/O0 I/O1 I/O2 I/O3 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 Pin Name VCC CE RE R/B GND N.C N.C N.C N.C N.C I/O0 ~ I/O7 N.C N.C N.C N.C N.C I/O7 I/O6 I/O5 I/O4 VCCQ Command Latch Enable ALE Address Latch Enable CE Chip Enable RE Read Enable WE Write Enable WP Write Protect GND Ground Input VCC VCCQ NOTE : Connect all V CC,VccQ and VSS pins of each device to power supply outputs. Do not leave VCC or VSS disconnected. 2 Data Inputs/Outputs CLE R/B 44(40) TSOP (II) STANDARD TYPE Pin Function Ready/Busy output Power(2.7V~5.5V) Output Butter Power(2.7V~5.5V) VSS Ground N.C No Connection K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY Figure 1. FUNCTIONAL BLOCK DIAGRAM X-Buffers Latches & Decoders A8 - A20 16M + 512K Bit NAND Flash ARRAY Y-Buffers Latches & Decoders A 0 - A7 (256 + 8)Byte x 8192 Page Register & S/A Y-Gating Command I/O Buffers & Latches Command Register CE RE WE VccQ Vss Control Logic & High Voltage Generator I/0 0 Global Buffers I/0 7 CLE ALE WP Figure 2. ARRAY ORGANIZATION 1 Block(=16 Row) (4K + 128)Byte 1 Page = 264 Byte 1 Block = 264 B x 16 Pages = (4K + 128) Bytes 1 Device = 264B x 16Pages x 512 Blocks = 16.5 Mbits 16M : 8K Row (=512 Block) 8 bit 256B Column 8B Column I/O 0 ~ I/O 7 Page Register 8Byte 256Byte I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 1st Cycle A0 A1 A2 A3 A4 A5 A6 A7 2nd Cycle A8 A9 A10 A11 A12 A13 A14 A15 3rd Cycle A16 A17 A18 A19 A20 *X *X *X NOTE : A12 to A20 : Block Address * : X can be VIL or VIH . 3 Column Address Row Address (Page Address) K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY PRODUCT INTRODUCTION The K9F1608W0A is a 16.5Mbit(17,301,504 bit) memory organized as 8192 rows by 264 columns. Spare eight columns are located from column address of 256 to 263. A 264-byte data register is connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each of the 16 cells resides in a different page. A block consists of the 16 pages formed by one NAND structures, totaling 2,112 NAND structures of 16 cells. The array organization is shown in Figure 2. The program and read operations are executed on a page basis, while the erase operation is executed on block basis. The memory array consists of 512 separately or grouped erasable 4K-byte blocks. It indicates that the bit by bit erase operation is prohibited on the K9F1608W0A. The K9F1608W0A has addresses multiplexed into 8 I/O′s. This scheme dramatically reduces pin counts and allows systems upgrades to future densities by maintaining consistency in system board design. Command, address and data are all written through I/O`s by bringing WE to low while CE is low. Data is latched on the rising edge of WE. Command Latch Enable(CLE) and Address Latch Enable(ALE) are used to multiplex command and address respectively, via the I/O pins. All commands require one bus cycle except for Block Erase command which requires two cycles : a cycle for erase-setup and another for erase-execution after block address loading. The 2M byte physical space requires 21 addresses, thereby requiring three cycles for byte-level addressing : column address, low row address and high row address, in that order. Page Read and Page Program need the same three address cycles following the required command input. In Block Erase operation, however, only the two row address cycles are used. Device operations are selected by writing specific commands into the command register. Table 1 defines the specific commands of the K9F1608W0A. Table 1. COMMAND SETS Function 1st. Cycle 2nd. Cycle Sequential Data Input 80h - Read 1 00h - Read 2 50h - Read ID 90h - Reset FFh - Page Program 10h - Block Erase 60h D0h Read Status 70h - 4 Acceptable Command during Busy O O K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY PIN DESCRIPTION Command Latch Enable(CLE) The CLE input controls the path activation for commands sent to the command register. When active high, commands are latched into the command register through the I/O ports on the rising edge of the WE signal. Address Latch Enable(ALE) The ALE input controls the path activation for address and input data to the internal address/data register. Addresses are latched on the rising edge of WE with ALE high, and input data is latched when ALE is low. Chip Enable(CE) The CE input is the device selection control. When CE goes high during a read operation the device is returned to standby mode. However, when the device is in the busy state during program or erase, CE high is ignored, and does not return the device to standby mode. Write Enable(WE) The WE input controls writes to the I/O port. Commands, address and data are latched on the rising edge of the WE pulse. Read Enable(RE) The RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is valid tREA after the falling edge of RE which also increments the internal column address counter by one. I/O Port : I/O 0 ~ I/O 7 The I/O pins are used to input command, address and data, and to outputs data during read operations. The I/O pins float to high-z when the chip is deselected or the outputs are disabled. Write Protect (WP) The WP pin provides inadvertent write/erase protection during power transitions. The internal high voltage generator is reset when the WP pin is active low. Ready/Busy(R/B) The R/B output indicates the status of the device operation. When low, it indicates that a program, erase or random read operation is in process and return to high state upon completion. It is an open drain output and does not float to high-z condition when the chip is deselected or outputs are disabled. Power Line(VCC & VCCQ) The VCCQ is the power supply for I/O interface logic. It is electrically isolated from main power line(VCC=2.7~5.5V) for supporting 5V tolerant I/O with 5V power supply at VCCQ. 5 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit VIN -0.6 to +7.0 V Voltage on any pin relative to VSS Temperature Under Bias K9F1608W0A-TCB0 -10 to +125 TBIAS K9F1608W0A-TIB0 °C -40 to +125 Storage Temperature TSTG -65 to +150 °C IOS 5 mA Short Circuit Output Current NOTE : 1. Minimum DC voltage is -0.3V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns. Maximum DC voltage on input/output pins is VCCQ+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns. 2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability. RECOMMENDED OPERATING CONDITIONS (Voltage reference to GND, K9F1608W0A-TCB0:TA=0 to 70°C, K9F1608W0A-TIB0:TA=-40 to 85°C) Parameter Symbol Min Typ. Max Unit Supply Voltage VCC 2.7 - 5.5 V Supply Voltage VCCQ1) 2.7 - 5.5 V Supply Voltage VSS 0 0 0 V NOTE : 1. Vcc and VccQ pins are separater each other. DC AND OPERATING CHARACTERISTICS(Recommended operating conditions otherwise noted.) Parameter Sequential Read Operating Current Program Erase Symbol ICC1 Vcc=2.7V ~ 3.6V Test Conditions tcycle=80ns, CE=VIL, IOUT=0mA Vcc=3.6V ~ 5.5V Min Typ Max Min Typ Max - 10 20 - 15 30 ICC2 - - 10 20 - 15 30 ICC3 - - 10 20 - 25 40 Stand-by Current(TTL) ISB1 CE=VIH, WP=0V/VCC - - 1 - - 1 Stand-by Current(CMOS) ISB2 CE=VCC-0.2, WP=0V/VCC - 5 50 - 5 50 Input Leakage Current ILI VIN=0 to 5.5V - - ±10 - - ±10 Output Leakage Current ILO VOUT=0 to 5.5V - - ±10 - - ±10 Input High Voltage VIH I/O Pins 2.0 - VCCQ+0.3 3.0 - VCCQ+0.5 Except I/O Pins 2.0 - VCC+0.3 3.0 - VCC+0.5 -0.3 - 0.6 -0.3 - 0.8 2.4 - - 2.4 - - - - 0.4 - - 0.4 8 10 - 8 10 - Input Low Voltage, All inputs VIL Output High Voltage Level VOH IOH=-400µA VOL IOL=2.1mA Output Low Voltage Level Output Low Current(R/B) - IOL(R/B) VOL=0.4V 6 Unit mA µA V mA K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY VALID BLOCK Parameter Valid Block Number Symbol Min Typ. Max Unit NVB 502 508 512 Blocks NOTE : 1. The K9F1608W0A may include invalid blocks. Invalid blocks are defined as blocks that contain one or more bad bits. Do not try to access these invalid blocks for program and erase. During its lifetime of 10 years and/or 1million program/erase cycles,the minimum number of valid blocks are guaranteed though its initial number could be reduced. (Refer to the attached technical notes) 2. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block AC TEST CONDITION (K9F1608W0A-TCB0:TA=0 to 70°C, K9F1608W0A-TIB0:TA=-40 to 85°C, VCC=2.7V ~ 5.5V unless otherwise noted) Value Parameter Vcc=2.7V ~ 3.6V Input Pulse Levels Vcc=3.6V ~ 5.5V 0.4V to 2.4V 0.4V to 3.4V Input Rise and Fall Times 5ns Input and Output Timing Levels 0.8V and 2.0V 1 TTL GATE and Output Load 1 TTL GATE and CL = 100pF CL=50pF(3.0V+/-10%),100pF(3.0V~3.6V) CAPACITANCE(TA=25°C, Vcc=5.0V f=1.0MHz) Item Symbol Test Condition Min Max Unit Input/Output Capacitance CI/O VIL=0V - 10 pF Input Capacitance CIN VIN=0V - 10 pF NOTE : Capacitance is periodically sampled and not 100% tested. MODE SELECTION CLE ALE CE H L L H WE RE WP L H X L H X Mode Read Mode Command Input Address Input(3clock) H L L H H L H L H H L L L H H Data Input L L L H X Sequential Read & Data Output Write Mode L L L H H X During Read(Busy) X X X X X H During Program(Busy) X X X X X H During Erase(Busy) X X(1) X X X L Write Protect X X H X X 0V/V CC(2) Command Input Address Input(3clock) Stand-by NOTE : 1. X can be VIL or VIH 2. WP should be biased to CMOS high or CMOS low for standby. Program/Erase Characteristics Parameter Symbol Min Typ Max Unit tPROG - 0.25 1.5 ms Number of Partial Program Cycles in the Same Page Nop - - 10 cycles Block Erase Time tBERS - 2 10 ms Program Time 7 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY AC Timing Characteristics for Command / Address / Data Input Symbol Min Max Unit CLE Set-up Time Parameter tCLS 20 - ns CLE Hold Time tCLH 40 - ns CE Setup Time tCS 20 - ns CE Hold Time tCH 40 - ns WE Pulse Width tWP 40 - ns ALE Setup Time tALS 20 - ns ALE Hold Time tALH 40 - ns Data Setup Time tDS 30 - ns Data Hold Time tDH 20 - ns Write Cycle Time tWC 80 - ns WE High Hold Time tWH 20 - ns AC Characteristics for Operation Parameter Symbol Min Max Unit Data Transfer from Cell to Register tR - 10 µs ALE to RE Delay tAR 150 - ns ALE to RE Delay(read ID) tAR1 200 - ns CE to RE Delay( ID read) tCR 200 - ns Ready to RE Low tRR 20 - ns WE High to Busy tWB - 200 ns Read Cycle Time tRC 80 - ns RE Access Time tREA - 45 ns RE High to Output Hi-Z tRHZ 5 20 ns CE High to Output Hi-Z tCHZ - 30 ns RE High Hold Time tREH 20 - ns tIR 0 - ns 200 Output Hi-Z to RE Low Last RE High to Busy(at sequential read) tRB - tCRY - CE High Hold Time(at the last serial read) (3) tCEH 250 - ns RE Low to Status Output tRSTO - 45 ns CE Low to Status Output tCSTO - 55 ns RE High to WE Low tRHW 0 - ns WE High to RE Low tWHR 50 - ns Device Resetting Time(Read/Program/Erase) tRST - 5/10/500 µs CE High to Ready(in case of interception by CE at read) (1) NOTE : 1. If CE goes high within 30ns after the rising edge of the last RE, R/B will not return to VOL . 2. The time to Ready depends on the value of the pull-up resistor tied R/B pin. 3. To break the sequential read cycle, CE must be held high for longer time than tCEH. 8 100+tr(R/B) ns (2) ns K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY NAND Flash Technical Notes Invalid Block(s) Invalid blocks are defined as blocks that contain one or more invalid bits whose reliability is not guaranteed by Samsung. Typically, an invalid block will contain a single bad bit. The information regarding the invalid block(s) is called as the invalid block information. The invalid block information is written to the 1st or the 2nd page of the invalid block(s) with 00h data. Devices with invalid block(s) have the same quality level or as devices with all valid blocks and have the same AC and DC characteristics. An invalid block(s) does not affect the performance of valid block(s) because it is isolated from the bit line and the common source line by a select transistor. The system design must be able to mask out the invalid block(s) via address mapping. The 1st block of the NAND Flash, however, is fully guaranteed to be a valid block. Identifying Invalid Block(s) All device locations are erased(FFh) except locations where the invalid block information is written prior to shipping. Since the invalid block information is also erasable in most cases, it is impossible to recover the information once it has been erased. Therefore, the system must be able to recognize the invalid block(s) based on the original invalid block information and create the invalid block table via the following suggested flow chart(Figure 1). Any intentional erasure of the original invalid block information is prohibited. Start Set Block Address = 0 Increment Block Address Create (or update) Invalid Block(s) Table No * Check "FFH" on the 1st and 2nd page Check "FFH" ? Yes No Last Block ? Yes End Figure 1. Flow chart to create invalid block table. 9 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY NAND Flash Technical Notes (Continued) Error in write or read operation Over its life time, the additional invalid blocks may occur. Through the tight process control and intensive testing, Samsung minimizes the additional block failure rate, which is projected below 0.1% up until 1million program/erase cycles. Refer to the qualification report for the actual data.The following possible failure modes should be considered to implement a highly reliable system. In the case of status read failure after erase or program, block replacement should be done. To improve the efficiency of memory space, it is recommended that the read or verification failure due to single bit error be reclaimed by ECC without any block replacement. The said additional block failure rate does not include those reclaimed blocks. Failure Mode Write Read ECC Detection and Countermeasure sequence Erase Failure Status Read after Erase --> Block Replacement Program Failure Status Read after Program --> Block Replacement Read back ( Verify after Program) --> Block Replacement or ECC Correction Single Bit Failure Verify ECC -> ECC Correction : Error Correcting Code --> Hamming Code etc. Example) 1bit correction & 2bit detection Program Flow Chart If ECC is used, this verification operation is not needed. Start Write 00H Write 80H Write Address Write Address Wait for tR Time Write Data Write 10H Verify Data Write 70H No * Program Error Yes Program Completed SR. 6 = 1 ? or R/B = 1 ? * Program Error Yes No No * SR. 0 = 0 ? Yes 10 : If program operation results in an error, map out the block including the page in error and copy the target data to another block. K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY NAND Flash Technical Notes (Continued) Erase Flow Chart Read Flow Chart Start Start Write 60H Write 00H Write Block Address Write Address Write D0H Read Data Write 70H ECC Generation SR. 6 = 1 ? or R/B = 1 ? * Erase Error No Reclaim the Error Verify ECC Yes Yes No No Page Read Completed SR. 0 = 0 ? Yes Erase Completed * : If erase operation results in an error, map out the failing block and replace it with another block. Block Replacement Buffer memory error occurs Block A Block B 11 When the error happens in Block "A", try to write the data into another Block "B" by reloading from an external buffer. Then, prevent further system access to Block "A"(by creating a "invalid block" table or other appropriate scheme.) K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY System Interface Using CE don’t-care. For a easier system interface, CE may be inactive during the data-loading or sequential data-reading as shown below. The internal 256byte page registers are utilized as seperate buffers for this operation and the system design gets more flexible. In addition, for voice or audio applications which use slow cycle time on the order of u-seconds, de-activating CE during the data-loading and reading would provide significant savings in power consumption. Figure 3. Program Operation with CE don’t-care. CLE CE don’t-care ≈ ≈ CE WE ALE I/O0~7 80H Start Add.(3Cycle) Data Input Data Input 10H (Max. 55ns) tCS tCH tCEA CE CE tREA RE tWP WE I/O0~7 out Timing requirements : If CE is is exerted high during sequential data-reading, the falling edge of CE to valid data(tCEA) must be kept greater than 55ns. Figure 4. Read Operation with CE don’t-care. CLE CE don’t-care ≈ CE RE ALE tR R/B WE I/O0~7 00H Data Output(sequential) Start Add.(3Cycle) 12 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY * Command Latch Cycle CLE tCLS tCLH tCS tCH CE tWP WE tALS tALH ALE tDH tDS Command I/O 0 ~ 7 * Address Latch Cycle tCLS CLE tCS tWC tWC CE tWP tWP tWP WE tWH tWH tALS tALH ALE tDS I/O 0 ~ 7 tDH A0~A7 13 tDS tDH A8~A15 tDS tDH A16~A20 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY * Input Data Latch Cycle tCLH CLE tCH CE tALS tWC tWP ≈ ALE tWP tWP WE tDS I/O 0 ~ 7 tWH tDH DIN 0 tDS tDH tDS tDH DIN 255 DIN 1 * Sequential Out Cycle after Read(CLE=L, WE=H, ALE=L) tRC CE tCHZ* tREH tREA ≈ tREA tREA RE Dout I/O 0 ~ 7 Dout ≈ tCHZ* Dout tRR R/B NOTES : Transition is measured ±200mV from steady state voltage with load. This parameter is sampled and not 100% tested. 14 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY * Status Read Cycle tCLS CLE tCLS tCLH tCS CE tCH tWP WE tCHZ* tCSTO tWHR RE tDH tDS I/O 0 ~ 7 tIR tRHZ* tRSTO Status Output 70H READ1 OPERATION(READ ONE PAGE) CLE tCEH CE tCHZ WE tCRY tWB tAR ALE tR tRHZ RE tRR I/O 0 ~ 7 00h A0 ~ A7 Column Address R/B A8 ~ A15 Dout N A16 ~ A20 Page(Row) Address Busy 15 Dout N+1 Dout N+2 Dout N+3 ≈ ≈ ≈ tRC Dout 263 tRB K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY READ1 OPERATION(INTERCEPTED BY CE) CLE CE WE tWB tCHZ tAR ALE tRC tR RE tRR I/O 0 ~ 7 00h A 0 ~ A7 Column Address A8 ~ A15 Dout N A16 ~ A20 Dout N+1 Dout N+2 Dout N+3 Page(Row) Address Busy R/B READ2 OPERATION(READ ONE PAGE) CLE CE WE tR tWB tAR ALE ≈ tRR 50H A 0 ~ A7 Dout 255+M A8 ~ A15 A16 ~ A20 Dout 255+M+1 ≈ I/O 0 ~ 7 ≈ RE Dout 263 R/B Selected Row M Address 256 8 Start address M 16 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY SEQUENTIAL ROW READ OPERATION CLE CE WE ≈ ≈ ALE Dout N+1 Dout N A0 ~ A7 A8 ~ A15 A16 ~ A20 ≈ Ready Busy R/B M Dout N+2 Dout 263 Dout 0 Dout 1 ≈ 00H Dout 2 Dout 263 ≈ I/O 0 ~ 7 ≈ RE Busy M+1 Output N Output PAGE PROGRAM OPERATION CLE ≈ CE WE tWB tPROG ALE I/O 0~7 80H A0 ~ A7 A8 ~ A15 A16 ~ A20 Sequential Data Column Input Command Address Page(Row) Address ≈≈ RE Din Din Din 10H 263 N N+1 1 up to 264 Byte Data Program Serial Input Command ≈ R/B 70H 17 I/O0 Read Status Command I/O0 =0 Successful Program I/O0 =1 Error in Program K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY BLOCK ERASE OPERATION(ERASE ONE BLOCK) CLE CE WE tWB tBERS ALE RE I/O 0 ~ 7 60H A8 ~ A15 A16 ~ A20 DOH 70H I/O0 Block Address R/B ≈ Busy Auto Block Erase Setup Command Erase Command Read Status Command MANUFACTURE & DEVICE ID READ OPERATION CLE CE WE ALE RE tREA I/O0~7 90H 00H ECH Read ID Command Maker Code 18 EAH Device Code I/O0=0 Successful Erase I/O0 =1 Error in Erase K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY DEVICE OPERATION PAGE READ Upon initial device power up, the device defaults to Read1 mode. This operation is also initiated by writing 00H to the command register along with three address cycles. Once the command is latched, it does not need to be written for the following page read operation. Three types of operations are available : random read, sequential page read and sequential row read. The random read mode is enabled when the page address is changed. The 264 bytes of data within the selected page are transferred to the data registers in less than 10µs(tR). The CPU can detect the completion of this data transfer(tR) by analyzing the output of R/B pin. Once the data in a page is loaded into the registers, they may be read out in 80ns cycle time by sequentially pulsing RE with CE staying low. High to low transitions of the RE clock output the data starting from the selected column address up to the last column address(column 264). After the data of last column address is clocked out, the next page is automatically selected for sequential read. Waiting 10µs again allows for reading of the page. The sequential row read operation is terminated by bringing CE to high. The way the Read1 and Read2 commands work is like a pointer set to either the main area or the spare area. The spare area of bytes 256 to 263 may be selectively accessed by writing the Read2 command. Addresses A0 to A2 set the starting address of the spare area while addresses A3 to A7 are ignored. Unless the operation is aborted, the page address is automatically incremented for sequential row read as in Read1 operation and spare eight bytes of each page may be sequentially read. The Read1 command(00H) is needed to move the pointer back to the main area. Figures 3 thru 6 show typical sequence and timings for each read operation. Figure 3. Read1 Operation CLE CE WE ALE tR R/B RE I/O 0 ~ 7 00H Start Add.(3Cycle) Data Output(Sequential) A0 ~ A7 & A8 ~ A20 (00H Command) Seek Time Data Field Spare Field 19 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY Figure 4. Read2 Operation CLE CE WE ALE R/B Busy(Seek Time) RE I/O 0 ~ 7 50H Data Output(Sequential) Start Add.(3Cycle) A0 ~ A2 & A8 ~ A20 Spare Field (A3 ~ A7 : Don't Care) Seek Time Data Field Spare Field ≈ Figure 5. Sequential Row Read1 Operation tR tR R/B I/O0~7 00H Start Add.(3Cycle) Data Output 1st A0 ~ A7 & A 8 ~ A20 1st 2nd Nth Data Field Spare Field 20 tR Data Output Data Output 2nd (264 Byte) Nth (264 Byte) K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY tR ≈ Figure 6. Sequential Row Read2 Operation tR R/B I/O0~7 50H Start Add.(3Cycle) tR Data Output Data Output Data Output 1st 2nd (8Byte) Nth (8Byte) A0 ~ A2 & A8 ~ A20 (A 3 ~ A7 : Don't Care) 1st 2nd Nth Data Field Spare Field PAGE PROGRAM The device is programmed basically on a page basis. But it also allows multiple partial page programming of a byte or consecutive bytes up to 264 may be programmed in a single page program cycle. The number of partial page programming operation in the same page without an intervening erase operation must not exceed ten. The addressing may be done in random order in a block. A page program cycle consist of a serial data loading period in which up to 264 bytes of data must be loaded into the device, and nonvolatile programming period in which the loaded data is programmed into the appropriate cell. The sequential data loading period begins by inputting the Serial Data Input command(80H), followed by the three cycle address input and then serial data loading. The bytes other than those to be programmed do not need to be loaded. In order to program the bytes in the spare columns of 256 to 263, the pointer should be set to the spare area by writing the Read 2 command(50H) to the command register. The pointer remains in the spare area unless the Read 1 command(00H) is entered to retum to the main area. The Page Program confirm command(10H) initiates the programming process. Writing 10H alone without perviously entering the serial data will not initiate the programming process. The internal write controller automatically executes the algorithms and timings necessary for program and verify, thereby freeing the CPU for other tasks. Once the program process starts, the Status Register may be read RE and CE low after the Read Status command(70H) is written to it. The CPU can detect the completion of program cycle by monitoring the R/B output, or the Status bit(I/O6) of the Status Register. Only the Read Status command and Reset command are valid while programming is in progress. When the Page Program is complete, the Write Status Bit(I/O0) may be checked(Figure 7). The internal write verify detects only errors for "1"s that are not successfully programmed to "0"s. The command register remains in Read Status command mode until another valid command is written to the command register. Figure 7. Program & Read Status Operation tPROG R/B I/O Pass 0~7 80H Address & Data Input 10H 70H A0 ~ A7 & A8 ~ A20 264 Byte Data I/O0 Fail 21 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY BLOCK ERASE The Erase operation is done on a block(4K Byte) basis. Block address loading is accomplished in two cycles initiated by an Erase Setup command(60H). Only address A12 to A20 is valid while A8 to A11 is ignored. The Erase Confirm command(D0H) following the block address loading initiates the internal erasing process. This two-step sequence of setup followed by execution command ensures that memory contents are not accidentally erased due to external noise conditions. At the rising edge of WE after the erase confirm command input, the internal write controller handles erase, erase-verify and pulse repetition where required. When the erase operation is complete, the Write Status Bit(I/O0) may be checked. Figure 8 details the sequence. Figure 8. Block Erase Operation tBERS R/B I/O 0 ~ 7 60H Address Input(2Cycle) D0H I/O0 70H Pass Block Add. : A8 ~ A20 Fail READ STATUS The device contains a Status Register which may be read to find out whether program or erase operation is complete, and whether the program or erase operation is completed successfully. After writing 70H command to the command register, a read cycle outputs the contents of the Status Register to the I/O pins on the falling edge of CE or RE, whichever occurs last. This two line control allows the system to poll the progress of each device in multiple memory connections even when R/B pins are common-wired. RE or CE does not need to be toggled for updated status. Refer to table 2 for specific Status Register definitions. The command register remains in Status Read mode until further commands are issued to it. Therefore, if the status register is read during a random read cycle, a read command(00H or 50H) should be given before sequential page read cycle. Table2. Status Register Definition SR Status Definition I/O 0 Program / Erase "0" : Successful Program / Erase "1" : Error in Program / Erase I/O 1 "0" I/O 2 I/O 3 "0" Reserved for Future Use "0" I/O 4 "0" I/O 5 "0" I/O 6 Device Operation I/O 7 Write Protect 22 "0" : Busy "1" : Ready "0" : Protected "1" : Not Protected K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY READ ID The device contains a product identification mode, initiated by writing 90H to the command register, followed by an address input of 00H. Two read cycles sequentially output the manufacture code(ECH), and the device code (EAH) respectively. The command register remains in Read ID mode until further commands are issued to it. Figure 9 shows the operation sequence. Figure 9. Read ID Operation CLE tCR CE WE tAR1 ALE RE I/O 0 ~ 7 tREA 90H Address. 1 cycle A0 ~ A7 :"0" Dout(ECH) Dout(EAH) Maker code Device code RESET The device offers a reset feature, executed by writing FFH to the command register. When the device is in Busy state during random read, program or erase mode, the reset operation will abort these operations. The contents of memory cells being altered are no longer valid, as the data will be partially programmed or erased. The command register is cleared to wait for the next command, and the Status Register is cleared to value C0H when WP is high. Refer to table 3 for device status after reset operation. If the device is already in reset state a new reset command will not be accepted by the command register. The R/B pin transitions to low for tRST after the Reset command is written. Reset command is not necessary for normal operation. Refer to Figure 10 below. Figure 10. RESET Operation tRST R/B I/O 0~7 FFH Table3. Device Status Operation Mode After Power-up After Reset Read 1 Waiting for next command 23 K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY READY/BUSY The device has a R/B output that provides a hardware method of indicating the completion of a page program, erase and random read completion. The R/B pin is normally high but transitions to low after program or erase command is written to the command register or random read is started after address loading. It returns to high when the internal controller has finished the operation. The pin is an open-drain driver thereby allowing two or more R/B outputs to be Or-tied. An appropriate pull-up resister is required for proper operation and the value may be calculated by the following equation. VCC Rp = R/B open drain output VCC(Max.) - VOL(Max.) IOL + ΣIL = Note* 8mA +ΣIL where IL is the sum of the input currents of all devices tied to the R/B pin. *Note: K9F1608W0A : 5.1V When Vcc=3.6V~5.5V 3.2V When Vcc=2.7V~3.6V GND Device DATA PROTECTION The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal voltage detector disables all functions whenever Vcc is below about 2V. WP pin provides hardware protection and is recommended to be kept at VIL during power-up and power-down as shown in Figure 11. The two step command sequence for program/erase provides additional software protection. ≈ Figure 11. AC Waveforms for Power Transition ~ 2.5V High ≈ VCC WP 24 ~ 2.5V K9F1608W0A-TCB0, K9F1608W0A-TIB0 FLASH MEMORY PACKAGE DIMENSIONS 44(40) LEAD PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(II) 44(40) - TSOP2 - 400F Unit :mm/Inch 0~8° 0.25 TYP 0.010 #23(21) #1 10.16 0.400 11.76±0.20 0.463±0.008 0.45~0.75 0.018~0.030 #44(40) 0.50 0.020 #22(20) +0.10 0.15 -0.05 +0.004 1.00±0.10 0.039±0.004 18.81 Max. 0.741 18.41±0.10 0.725±0.004 1.20 Max. 0.047 0.006 -0.002 ( 0.805 ) 0.032 0.35±0.10 0.014 ±0.004 0.05 Min. 0.002 0.10 MAX 0.004 0.80 0.0315 25