SAMSUNG S1P2655A01

LINEAR INTEGRATED CIRCUIT
S1P2655A01/02/03/04/05
INTRODUCTION
HIGH VOLTAGE, HIGH CURRENT DARINGTON ARRAYS
16−DIP
The S1P2655A01, S1P2655A02, S1P2655A03, S1P2655A04
and S1P2655A05 are comprised of saven high voltage, high
current NPN darlington transistors arrays with common emitter,
open collector outputs. Suppression diodes are included for
inductive load driving and the inputs are pinned opposite the
outputs to simplify board layout. Peak inrush currents to 600mA
permit them to drive incandescent lamps.
The S1P2655A01 is a general purpose array for use with DTL,
16−SOP
TTL, PMOS or CMOS logic directly.
The S1P2655A02 version does away with the need for any
external discrete resistors, since each usit has a resistor and a
zener diode in series with the input. The S1P2655A02 is
designed for use with 14 to 25V PMOS devices. The zener
diode also gives these devices excellent noise immunity.
The S1P2655A03 has a series base resistor to each darlington
pair, and thus allows operation directly with TTL or CMOS operating at supply voltages of 5V. The S1P2655A03 will handle
numberous interfaces needs-particularly those beyond the
capailities of standard logic buffers.
The S1P2655A04 has an appropriate input resistor to allow direct operation from CMOS or PMOS outputs operating supply voltage of 6V to 15V.
The S1P2655A05 is designed for use with standard TTL and Schottky TTL, with which hinger output currents are
required and loading of the logic output is not a concern.
These devices will sink a minimum of 350mA when driven from a “totempole” logic output.
These versatile devices are useful for driving a wide range of loads including Solenoids, Relays, DC motors, LED
displays, Filament lamps, thermal printheads and high power buffer. Applications requiriing sink currents beyonds
the capability of a single output may be accomodated by paralleling the outputs.
APPLICATIONS
•
Relay driver
•
DC motor driver
•
Solenoids driver
•
LED display driver
•
Filament lamp driver
•
High power buffer
•
Thermal print head driver
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S1P2655A01/02/03/04/05
LINEAR INTEGRATED CIRCUIT
OPERAING INFORMATION
Device
Package
S1P2655A01-D0B0
16-DIP
S1P2655A01-S0B0
16-SOP
S1P2655A02-D0B0
16-DIP
S1P2655A02-S0B0
16-SOP
S1P2655A03-D0B0
16-DIP
S1P2655A03-S0B0
16-SOP
S1P2655A04-D0B0
16-DIP
S1P2655A04-S0B0
16-SOP
S1P2655A05-D0B0
16-DIP
S1P2655A05-S0B0
16-SOP
Input Level
Operating Temperature
DTL, TTL,
PMOS, CMOS
PMOS
TTL, CMOS
−20 − +85°C
CMOS, PMOS
TTL
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
Characteristic
Symbol
Value
Unit
Output Voltage
Vo
50
V
Input Voltage (S1P2655A02/03/04)
VIN
30
V
(S1P2655A05)
15
Continuous Collector Current
Ic
500
mA
Continuous Input Current
IIN
25
mA
Power Dissipation
PD
1.0
W
Operating Temperature
Topr
− 20 − + 85
°C
Storage Temperature
Tstg
− 55 − + 150
°C
2
LINEAR INTEGRATED CIRCUIT
S1P2655A01/02/03/04/05
ELECTRICAL CHARACTERISTICS
(Ta = 25°C, unless otherwise noted)
Characteristic
Symbol
Test Condition
VCE = 50V, Ta = 25°C, VIN = open
Min.
Typ.
Max.
−
−
50
−
100
VCE = 50V, Ta = 70°C, VIN = open
Output Leakage Current
Output Saturation Voltage
ILK
Vsat
VCE = 50V, Ta = 70°C,
VIN = 6.0V (S1P2655A02)
−
−
500
VCE = 50V, Ta = 70°C,
VIN = 1.0V (S1P2655A04)
−
−
500
IC = 100mA, IIN = 250µA
−
0.9
1.1
IC = 200mA, IIN = 350µA
−−
1.1
1.3
1.25
1.6
IC = 350mA, IIN = 500µA
Input Current 1 (Off Condition)
Input Current 2 (On Condition)
Input Voltage
IIN 1
IIN 2
VIN
IC = 500mA, Ta = 70°C
50
65
−
VIN = 17V (S1P2655A02), Vo = open
−
0.85
1.3
VIN = 3.85V (S1P2655A03), Vo = open
−
0.93
1.35
VIN = 5V (S1P2655A04), Vo = open
−
0.35
0.5
VIN = 12V (S1P2655A04), Vo = open
−
1.0
1.45
VIN = 3.0V (S1P2655A05), Vo = open
−
1.5
2.4
VCE = 2.0V, Ic = 300mA (S1P2655A02)
−
−
13
VCE = 2.0V, Ic = 200mA (S1P2655A03)
−
−
2.4
VCE = 2.0V, Ic = 250mA (S1P2655A03)
−
−
2.7
VCE = 2.0V, Ic = 300mA (S1P2655A03)
−
−
3.0
VCE = 2.0V, Ic = 125mA (S1P2655A04)
−
−
5.0
VCE = 2.0V, Ic = 200mA (S1P2655A04)
−
−
6.0
VCE = 2.0V, Ic = 275mA (S1P2655A04)
−
−
7.0
VCE = 2.0V, Ic = 350mA (S1P2655A04)
−
−
8.0
VCE = 2.0V, Ic = 350mA (S1P2655A05)
−
−
2.4
Unit
µA
V
µA
mA
V
DC Current Gain
hFE
VCE = 2.0V, Ic = 350mA (S1P2655A05)
1000
−
−
−
Input Capacitance
CIN
−
−
15
30
pF
Proparation Delay Time
Clamp Diode Leakage Current
Clamp Diode Forward Voltage
tON
0.5 VIN to 0.5 Vo
−
0.25
1.0
µs
tOFF
0.5 VIN to 0.5 Vo
−
0.25
1.0
µs
VIN = open, Vo = GND, VR = 50V, Ta =
25°C
−
−
50
µA
VIN = open, Vo = GND, VR = 50V, Ta =
70°C
−
−
100
µA
IF = 350mA
−
1.7
2.0
V
IR
VF
3
S1P2655A01/02/03/04/05
LINEAR INTEGRATED CIRCUIT
PIN CONFIGURATION
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
Figure 1.
4
LINEAR INTEGRATED CIRCUIT
S1P2655A01/02/03/04/05
SCHEMATIC DIAGRAMS
S1P2655A01 (each driver)
S1P2655A02 (each driver)
COM
COM
7V
10.5V
7.2K
3K
7.2K 3K
Figure 2.
Figure 3.
S1P2655A03 (each driver)
S1P2655A04 (each driver)
COM
2.7K
COM
10.5K
7.2K 3K
7.2K 3K
Figure 4.
Figure 5.
S1P2655A05 (each driver)
COM
1.05K
7.2K 3K
Figure 6.
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S1P2655A01/02/03/04/05
LINEAR INTEGRATED CIRCUIT
TYPICAL APPLICATIONS
PMOS TO LOAD
S1P2655A02
TTL TO LOAD
S1P2655A03/05
+V
+V
1
16
1
16
2
15
2
15
3
14
3
14
4
13
4
13
5
12
5
12
6
11
6
11
7
10
7
10
8
9
8
9
TTL
OUTPUT
PMOS
OUTPUT
LAMP
TEST
Figure 7.
Figure 8.
Buffer for High-current Load
S1P2655A04
USE of Pull-up Resistors to Increase Drive Current
S1P2655A03
+V
1
+VCC
+V
16
2
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
15
3
14
4
13
5
12
6
11
CMOS
OUTPUT
7
10
OUTPUT
8
9
Figure 9.
6
Figure 10.