Ordering number : EN6027 GaAs Infrared LED SPI-240-15-T1 SPI-240-15-T1 Ultraminiature photointerrupter supporting reflow soldering (Darlington-transistor type) Features • GaAs Infrared LED plus Darlington Phototransistor • Photo-Interrupter for reflow soldering • Compact type : H4.95 ✕ L6.0 ✕ W5.5mm • Taping type Absolute Maximum Ratings at Ta=25°C, 65%RH Input LED Output Phototransistor Parameter Forward Current Reverse Voltage Power Dissipation Collector-Emitter Voltage Emitter-Collector Voltage Collector Curren Power Dissipation Operating Temperature Storage Temperature Symbol IF VR PD VCEO VECO IC PC Topr Tstg Rating 50 5 70 20 5 20 70 --20 to +80 --30 to +85 Unit mA V mW V V mA mW °C °C Electro-Optical Characteristics at Ta=25°C, 65%RH Input Output Coupled Parameter Forward Voltage Reverse Current Dark Current Collector Output Current Symbol VF IR ICEO IC Condition IF=10mA VR=5V IF=0mA, VCE=10V IF=4mA, VCE=2V*1 Min. 1.0 --0.5 Typ. 1.15 --3 Max. 1.4 10 1 -- Unit V µA µA mA Collector Emitter Saturation Voltage VCE(sat) IF=4mA, IC=250µA -- -- 1.2 V VCC=5V, RL=100Ω IC=10mA --- 100 100 --- µs µs Rise Time tr Fall Time tf *1 Measurement Circuit of Collector Current VCE=2V IF=4mA Ic A SANYO Electric Co.,Ltd. Semiconductor Company TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN 72199 GI, (MI) No.6027 1/7 SPI-240-15-T1 Typical Characteristics CAUTION These numerical value show the electrical and optical characteristics of this product, and not assure this contents. Forward Current vs. Ambient Temperature 60 Power Dissipation vs. Ambient Temperature 120 (Rating) 100 Power Dissipation P (mW) Forward Current IF (mA) 50 (Rating) 40 30 20 10 80 60 40 20 0 0 -25 0 25 50 75 100 -25 Ambient Temperature Ta (°C) 25 50 75 100 Ambient Temperature Ta (°C) Forward Current vs. Forward Voltage Collector vs. Forward Current 500 20 100 25°C 50 VCE=2V Ta=25°C 18 Ta=75°C 50°C Collector Current IC (mA) Forward Current IF (mA) 0 0°C --25°C 10 5 16 14 12 10 8 6 4 2 1 0 0.5 0 1 1.5 2 0 4 8 12 16 20 Forward Voltage VF (V) Forward Current IF (mA) Collector Current vs. Collector-emitter Voltage Relative Collector Current vs. Ambient Temperature 20 140 Collector Current IC (µA) Relative Collector Current (%) Ta=25°C 18 IF=15mA 16 14 Pc(MAX) 12 10mA 10 8 7mA 6 4 4mA 2 2mA 0 IF=4mA VCE=2V 120 100 80 60 40 0 5 Collector-emitter Voltage VCE (V) 10 --25 0 25 50 75 100 Ambient Temperature Ta (°C) No.6027 2/7 SPI-240-15-T1 Typical Characteristics Collector-emitter Saturation Voltage vs. Ambient Temperature 10-5 0.9 0.8 0.7 0.6 0.5 --25 VCE=10V 5 IF=4mA IC=250µA 10-6 5 10-7 5 10-8 5 10-9 0 25 50 75 --25 100 0 25 50 75 100 Ambient Temperature Ta (°C) Ambient Temperature Ta (°C) Response Time vs. Load Resistance Test Circuit for Response Time 1000 IFP=10mA VCC=2V Ta=25°C 500 Response (µS) Collector Dark Current vs. Ambient Temperature 1.0 Collector Dark Current ICEO (A) Collector-emitter Saturation Voltage VCE (sat) (V) CAUTION These numerical value show the electrical and optical characteristics of this product, and not assure this contents. tf IFP 100 tr VCC 50 IFP RL RD Vout 10% Vout 10 90% tf tr 5 1 10 50 100 500 1k 5k 10k Load Resistance RL (Ω) Relative Collector Current vs. Shield Distance (1) Relative Collector Current vs. Shield Distance (2) 120 d 80 60 -- + 0 Detector center 40 20 0 IF=4mA VCE=2V Ta=25°C 100 80 Shield -0 60 d + Detector center 100 Relative Collector Current (%) IF=4mA VCE=2V Ta=25°C Shield Relative Collector Current (%) 120 40 20 0 --2 --1 0 1 Shield Distance d (mm) 2 3 --2 --1 0 1 2 3 Shield Distance d (mm) No.6027 3/7 SPI-240-15-T1 0.6, Pin No. Max 0.1 Pin connection 1. Ph. Tr Collector 2. Common (Cathode) 3. LED Anode 1 5.5 3-0.4 2.5 3.5 3 2 Ph.Tr LED 6 ± 0.3 3 ± 0.3 1.5 Injection gate 1.5 Optical C / L 2 4.5 2 4.95 0.25 + 0.1 -- 0.2 0.25 0.25 3.2 4.1 2.7 2.8 C0 .5 1 1 2.5 Tolerance : ±0.2 Unit : mm No.6027 4/7 SPI-240-15-T1 Package dimensions and Pin connection As stated in the sttached paper. (No.6027 4/7) Soldering conditions (1) Reflow soldering The temperature of the reflow furnace is to be set in accordance with the following temperature profile. Soldering must be done only one time. Temperature : On the topsurface of product Reflow type : Hot air Max 220°C 180°C Max 160°C Max 5sec Max 60sec (2) Manusl soldering Temperature Time Clearance : Max. 290°C (Soldering iron tip temperature) : Max. 3 sec : Min. 0.5mm from package Max 40sec 0.5mm 0.5mm PRECAUTIONS (1) Bending a lead should avoid. However, when bending is necessary, take care the next items. q Bending a lead must be done before soldering. w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that stress for the regin part cause troubles such as gold wire breaking and so on. e A lead must be bend under the stay. r Do not bend the same position of leads more than twice. (2) The hole pitch of a circuit board must fit to the recommended mounting dimension. (3) Take core the following when soldering. q Do not heat a product under any stress (a twist and so on) to leads. w Do not heat a product in the states of operating force to the regin part. (4) Use the flux which contain no chlorine, have no corrosion and do not need washing. (5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface. (6) Precautions of the product after the open dry packing q The product after the open dry packing should be stored in the dry packing again. The product should be kept under the conditions below, if the product is not stored in the dry paking. Temperature : 5 to 30°C Humidity : Max 70%RH Term : Max 7days w The product to be out the term without dry packing must be practiced baking. Baking conditions : +60±5°C, 10 to 20Hr (7) The reflow conditions must be confirmed that no problem by your reflow furnace. No.6027 5/7 SPI-240-15-T1 Taping Specifications 4 (1) Dimensions of tape (0.4) 1.75 2 ø1 8 (5.6) (9.3) 16 ± 0.3 7.5 .5 (3.5) (5.3) (6.1) ( ø1.7 ) ø80 ± 1 ø330 ± 1 (2) Dimensions of reel 2 ø1 3 17 ± 1 ø2 1 22 ± 1 Unit : mm No.6027 6/7 SPI-240-15-T1 CAUTION 1. No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster / crime-prevention equipment or the like, and the failure of which may directly or indirectly cause injury, death or property loss. 2. Anyone purchasing any products described or contained herein for an above-mentioned use shall: 1) Accept full responsibility and indemnify and defend SANYO ELECTRIC CO.,LTD., it’s affiliates, subsidiaries and distributors or any of their officers and employees, jointly and severally, against any and all claims and litigation and all damages, costs and expenses associated with such use. 2) Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., it’s affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. 3. Information (including circuit diagrams and circuit parameters) disclosed herein is for example only; it is not guaranteed for mass production, SANYO believes the information disclosed herein is accurate and reliable, but no guarantees are made or implied regarding it’s use or any infringements of intellectual property rights or other rights of third parties. Precautionary instructions in handling gallium arsenic products Special precautions must be taken in handling this product because it contains, gallium arsenic, which is designated as a toxic substance by law. Be sure to adhere strictly to all applicable laws and regulations enacted for this substance, particularly when it comes to disposal. Manufactured by ; Tottori SANYO Electric Co., Ltd. LED Division 5-318, Tachikawa-cho, Tottori City, 680-8634 Japan TEL: +81-857-21-2137 FAX: +81-857-21-2161 PS No.6027 7/7