VISHAY 140CRH

140 CRH
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip), High Temperature
FEATURES
• Polarized aluminum electrolytic capacitors,
non-solid electrolyte, self healing
• SMD-version with base plate, lead (Pb)-free
reflow solderable
• Charge and discharge proof, no peak current
limitation
140 CRH
125 °C
• Parts for advanced high temperature reflow soldering
according to JEDEC J-STD-020 available
146 CTI
Lower Z
• Compliant to RoHS Directive 2002/95/EC
Lower temp.
• Vibration proof, 4-pin version and 6-pin version
• AEC-Q200 qualified
150 CRZ
• Extended useful life for MAL214099...E3 parts to
6000 h at 125 °C
Fig. 1
APPLICATIONS
• SMD technology, for high temperature reflow soldering
QUICK REFERENCE DATA
DESCRIPTION
Nominal case sizes
(L x W x H in mm)
Rated capacitance range, CR
Tolerance on CR
Rated voltage range, UR
Category temperature range
VALUE
• Industrial and professional applications
8 x 8 x 10
to 18 x 18 x 21
• Automotive, general industrial, telecom
± 20 %
6.3 V to 63 V
- 55 °C to + 125 °C
Endurance test at 125 °C
1000 h to 5000 h
Useful life at 125 °C
1500 h to 6000 h
Useful life at 40 °C
1.8 x lR applied
150 000 h to 500 000 h
Shelf life at 0 V, 125 °C
Based on sectional specification
Climatic category IEC 60068
Document Number: 28396
Revision: 09-May-11
• Smoothing, filtering, buffering
10 μF to 4700 μF
1000 h
IEC 60384-18/CECC 32300
MARKING
• Rated capacitance (in μF)
• Rated voltage (in V)
• Date code, in accordance with IEC 60062
• Black mark or “-” sign indicating the cathode (the anode is
identified by bevelled edges)
• Code indicating group number (H)
PACKAGING
Supplied in blister tape on reel
55/125/56
For technical questions, contact: [email protected]
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140 CRH
Aluminum Capacitors
SMD (Chip), High Temperature
Vishay BCcomponents
SELECTION CHART FOR CR, UR, AND RELEVANT NOMINAL CASE SIZES (L x W x H in mm)
UR (V)
CR
(μF)
6.3
10
16
25
35
50
63
10






8 x 8 x 10
22






8 x 8 x 10
33






8 x 8 x 10
47





8 x 8 x 10
10 x 10 x 10
68




8 x 8 x 10
10 x 10 x 10
10 x 10 x 14
12.5 x 12.5 x 13
100



8 x 8 x 10
10 x 10 x 10
10 x 10 x 14
150


8 x 8 x 10

10 x 10 x 14
-
-
220

8 x 8 x 10

10 x 10 x 10
12.5 x 12.5 x 13
12.5 x 12.5 x 13
12.5 x 12.5 x 16
330
8 x 8 x 10
10 x 10 x 10
10 x 10 x 14
12.5 x 12.5 x 13
12.5 x 12.5 x 13
12.5 x 12.5 x 16
16 x 16 x 16
16 x 16 x 21
18 x 18 x 16
16 x 16 x 21
470
10 x 10 x 10
10 x 10 x 14
12.5 x 12.5 x 13
12.5 x 12.5 x 16
12.5 x 12.5 x 16
16 x 16 x 16
18 x 18 x 16
18 x 18 x 21
680
10 x 10 x 14
12.5 x 12.5 x 13
12.5 x 12.5 x 16

16 x 16 x 16
820




16 x 16 x 21
16 x 16 x 16
16 x 16 x 16
16 x 16 x 21
16 x 16 x 21
1000

12.5 x 12.5 x 16
1200



1500


16 x 16 x 21
18 x 18 x 21
18 x 18 x 16
18 x 18 x 16
-
18 x 18 x 21
-
18 x 18 x 16
18 x 18 x 21

18 x 18 x 21
-
-
16 x 16 x 16
16 x 16 x 21
18 x 18 x 21
-
-
18 x 18 x 16
18 x 18 x 16
-
-
-
16 x 16 x 21
18 x 18 x 21
-
-
-
-

16 x 16 x 16
3300

16 x 16 x 21
18 x 18 x 16
-
-
-
-
-
4700

18 x 18 x 21
-
-
-
-
-
18 x 18 x 21
-
-
-
-
18 x 18 x 21
-
-
-
-
HMAX.
MAX. 0.3
HMAX.
MAX. 0.3
B
LMAX.
L1MAX.S
35V
1000u
3R-H
D
WMAX.
B
WMAX.
L1MAX. S
25V
2200u
L4-H
25V
220 u
A4-H
D
6-pin:
≥ Ø 16 mm
min. 0.4/max. 1.0 (2 x)
4-pin:
Ø 12.5 mm
min. 0.4/max. 1.0 (2 x)
2-pin:
≤ Ø 10 mm
min. 0.4/max. 1.0 (2 x)
2200
HMAX.
MAX. 0.3
D
WMAX.
B
LMAX.
L1MAX. S
LMAX.
Fig. 2 - Dimensional outline
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For technical questions, contact: [email protected]
Document Number: 28396
Revision: 09-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
140 CRH
Aluminum Capacitors
SMD (Chip), High Temperature
Vishay BCcomponents
Table 1
DIMENSIONS in millimeters AND MASS
NOMINAL
CASE SIZE
LxWxH
CASE
CODE
LMAX.
WMAX.
HMAX.
ØD
BMAX.
S
L1MAX.
MASS
(g)
8 x 8 x 10
0810
8.5
8.5
10.5
8.0
1.0
2.2
10.2
 1.0
10 x 10 x 10
1010
10.5
10.5
10.5
10.0
1.0
3.5
12.1
 1.3
10 x 10 x 14
1014
10.5
10.5
14.3
10.0
1.0
3.5
12.1
 1.5
12.5 x 12.5 x 13
1213
12.9
12.9
14.0
12.5
1.3
3.6
14.9
 2.6
12.5 x 12.5 x 16
1216
12.9
12.9
16.5
12.5
1.3
3.6
14.9
 2.8
16 x 16 x 16
1616
16.6
16.6
17.5
16.0
1.3
6.5
18.6
 5.5
16 x 16 x 21
1621
16.6
16.6
22.0
16.0
1.3
6.5
18.6
 6.0
18 x 18 x 16
1816
19.0
19.0
17.5
18.0
1.3
6.5
21.0
 8.0
18 x 18 x 21
1821
19.0
19.0
22.0
18.0
1.3
6.5
21.0
 8.3
Table 2
TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES
NOMINAL
CASE SIZE
LxWxH
CASE
CODE
PITCH
P1
TAPE WIDTH
W
TAPE
THICKNESS
T2
REEL DIAMETER
PACKAGING
QUANTITY
PER REEL
8 x8 x 10
0810
16
24
11.6
380
500
10 x 10 x 10
1010
16
24
11.6
380
500
10 x 10 x 14
1014
16
24
15.4
330
250
12.5 x 12.5 x 13
1213
20
24
16.2
380
250
12.5 x 12.5 x 16
1216
24
32
18.5
380
200
16 x 16 x 16
1616
28
44
18.9
380
150
16 x 16 x 21
1621
28
44
23.4
380
100
18 x 18 x 16
1816
32
44
18.9
380
125
18 x 18 x 21
1821
32
44
23.4
380
100
Note
• Detailed tape dimensions see section “PACKAGING”
Document Number: 28396
Revision: 09-May-11
For technical questions, contact: [email protected]
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
140 CRH
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip), High Temperature
MOUNTING
SOLDERING
The capacitors are designed for automatic placement on to
printed-circuit boards.
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
component during processing.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print
layout and/or adjacent components.
For maximum conditions refer to Fig. 4 or Fig. 5.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
For recommended soldering pad dimensions, refer to Fig. 3
and Table 3.
As a general principle, temperature and duration shall be the
minimum necessary required to ensure good soldering
connections. However, the specified maximum curves
should never be exceeded.
e
a
c
a
d
b
f
b
b
d
a
c
a
a
Case size Ø D ≤ 10 mm
c
a
Case size Ø D ≥ 16 mm
Case size Ø D = 12.5 mm
Fig. 3 - Recommended soldering pad dimensions
Table 3
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
CASE CODE
a
b
c
d
e
f
0810
4.4
2.5
3.0
-
-
-
1010
4.4
2.5
4.0
-
-
-
1014
4.4
2.5
4.0
-
-
-
1213
6.3
2.5
4.0
4.2
5.0
5.6
1216
6.3
2.5
4.0
4.2
5.0
5.6
1616
7.8
9.6
4.7
-
-
-
1621
7.8
9.6
4.7
-
-
-
1816
8.8
9.6
4.7
-
-
-
1821
8.8
9.6
4.7
-
-
-
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For technical questions, contact: [email protected]
Document Number: 28396
Revision: 09-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
140 CRH
Aluminum Capacitors
SMD (Chip), High Temperature
Vishay BCcomponents
STANDARD SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS
T (°C)
TPeak
230
217
t4
t3
200
150
t2
t1
time (s)
Fig. 4 - Maximum temperature load during reflow soldering
Table 4
REFLOW SOLDERING CONDITIONS for MAL214097xxxE3
CASE CODE
0810 TO 1014
CASE CODE
1213 TO 1216
Max. time from 25 °C to TPeak
240 s
200 s
Min. ramp-up rate to 150 °C
3 K/s
3 K/s
Max. time from 150 °C to 200 °C (t1)
150 s
120 s
0.5 K/s to 3 K/s
0.5 K/s to 3 K/s
Max. time from 200 °C to 217 °C (t2)
60 s
60 s
Max. time above TLiquidus (217 °C) (t3)
90 s
60 s
Max. time above 230 °C (t4)
40 s
30 s
250 °C
240 °C
Max. time above TPeak minus 5 °C
5s
10 s
Max. ramp-down rate from TLiquidus
3 K/s to 6 K/s
3 K/s to 6 K/s
PROFILE FEATURES
Ramp up rate from 200 °C to TPeak
Peak temperature TPeak
Notes
• Temperature measuring point on top of the case and on terminals
• Max. 2 runs with pause of min. 30 min in between
Document Number: 28396
Revision: 09-May-11
For technical questions, contact: [email protected]
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
140 CRH
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip), High Temperature
ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS
ACCORDING TO JEDEC J-STD-020
T (°C)
TPeak
230
217
t4
t3
200
190
t2
150
t1
25
time (s)
Fig. 5 - Maximum temperature load during reflow soldering
Table 5
REFLOW SOLDERING CONDITIONS for MAL214099xxxE3
CASE CODE
1010
CASE CODE
1213 TO 1216
CASE CODE
1616 TO 1821
Max. time from 25 °C to TPeak
300 s
300 s
300 s
Min. ramp-up rate to 150 °C
3 K/s
3 K/s
3 K/s
Max. time from 150 °C to 200 °C (t1)
150 s
150 s
150 s
Max. time from 190 °C to 200 °C (t2)
110 s
110 s
110 s
0.5 K/s to 3 K/s
0.5 K/s to 3 K/s
0.5 K/s to 3 K/s
Max. time above TLiquidus (217 °C) (t3)
90 s
90 s
90 s
Max. time above 230 °C (t4)
70 s
65 s
60 s
260 °C
250 °C
245 °C
40 s
30 s
30 s
3 K/s to 6 K/s
3 K/s to 6 K/s
3 K/s to 6 K/s
PROFILE FEATURES
Ramp up rate from 200 °C to TPeak
Peak temperature TPeak
Max. time above TPeak minus 5 °C
Ramp-down rate from TLiquidus
Notes
• Temperature measuring point on top of the case and on terminals
• Max. 2 runs with pause of min. 30 min in between
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For technical questions, contact: [email protected]
Document Number: 28396
Revision: 09-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
140 CRH
Aluminum Capacitors
SMD (Chip), High Temperature
ORDERING EXAMPLE
ELECTRICAL DATA
SYMBOL
Vishay BCcomponents
Electrolytic capacitor 140 CRH series
DESCRIPTION
CR
Rated capacitance at 100 Hz, tolerance ± 20 %
IR
Rated RMS ripple current at 100 kHz, 125 °C
IL2
Max. leakage current after 2 min at UR
tan 
Max. dissipation factor at 100 Hz
Z
Max. impedance at 100 kHz
220 μF/50 V; ± 20 %
Nominal case size: 12.5 mm x 12.5 mm x 13 mm; taped on
reel
Ordering code: MAL214099111E3
Note
• Unless otherwise specified, all electrical values in Table 6 apply
at Tamb = 20 °C, P = 86 kPa to 106 kPa, RH = 45 % to 75 %
Table 6
ELECTRICAL DATA AND ORDERING INFORMATION
UR
(V)
6.3
10
16
25
CR
(μF)
NOMINAL
CASE SIZE
LxWxH
(mm)
IR
100 kHz
125 °C
(mA)
IL2
2 min
(μA)
tan 
100 Hz
Z
100 kHz
20 °C
()
ORDERING
CODE (1)
MAL2140...
ORDERING
CODE (2)
MAL2140...
330
470
680
220
330
470
680
1000
2200
3300
3300
4700
150
330
470
680
1000
1000
1500
1500
2200
2200
3300
100
220
330
470
1000
1000
1500
1500
2200
8 x 8 x 10
10 x 10 x 10
10 x 10 x 14
8 x 8 x 10
10 x 10 x 10
10 x 10 x 14
12.5 x 12.5 x 13
12.5 x 12.5 x 16
16 x 16 x 16
16 x 16 x 21
18 x 18 x 16
18 x 18 x 21
8 x 8 x 10
10 x 10 x 14
12.5 x 12.5 x 13
12.5 x 12.5 x 16
16 x 16 x 16
16 x 16 x 21
16 x 16 x 16
18 x 18 x 16
16 x 16 x 21
18 x 18 x 21
18 x 18 x 21
8 x 8 x 10
10 x 10 x 10
12.5 x 12.5 x 13
12.5 x 12.5 x 16
16 x 16 x 16
16 x 16 x 21
16 x 16 x 21
18 x 18 x 16
18 x 18 x 21
180
300
430
180
300
430
750
900
1000
1200
1200
1550
180
430
750
900
1100
1200
1100
1200
1200
1550
1550
180
300
750
900
1100
1200
1200
1200
1550
21
30
43
22
33
47
68
100
220
330
330
470
24
53
75
108
160
160
240
240
352
352
528
25
55
82
117
250
250
375
375
550
0.30
0.30
0.30
0.26
0.26
0.26
0.22
0.22
0.24
0.24
0.26
0.28
0.22
0.22
0.18
0.18
0.18
0.18
0.18
0.18
0.20
0.20
0.22
0.18
0.18
0.16
0.16
0.16
0.16
0.16
0.16
0.18
0.40
0.25
0.20
0.40
0.25
0.20
0.12
0.09
0.08
0.06
0.08
0.06
0.40
0.20
0.12
0.09
0.08
0.06
0.08
0.08
0.06
0.06
0.06
0.40
0.25
0.12
0.09
0.08
0.06
0.06
0.08
0.06
97303E3
97301E3
97302E3
97403E3
97401E3
97402E3
97411E3
97412E3
97502E3
97501E3
97511E3
97512E3
97602E3
97601E3
97611E3
97612E3
-
99301E3
99401E3
99411E3
99412E3
99413E3
99414E3
99415E3
99416E3
99511E3
99512E3
99513E3
99514E3
99515E3
99516E3
99517E3
99518E3
99519E3
99601E3
99611E3
99612E3
99613E3
99614E3
99615E3
99616E3
99617E3
Notes
Standard reflow soldering profile, see Fig. 4 and Table 4
(2) Advanced reflow soldering profile, according to JEDEC J-STD-020, see Fig. 5 and Table 5
(1)
Document Number: 28396
Revision: 09-May-11
For technical questions, contact: [email protected]
www.vishay.com
7
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
140 CRH
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip), High Temperature
ELECTRICAL DATA AND ORDERING INFORMATION
UR
(V)
35
50
63
CR
(μF)
NOMINAL
CASE SIZE
LxWxH
(mm)
IR
100 kHz
125 °C
(mA)
IL2
2 min
(μA)
tan 
100 Hz
Z
100 kHz
20 °C
()
ORDERING
CODE (1)
MAL2140...
ORDERING
CODE (2)
MAL2140...
68
8 x 8 x 10
180
24
0.14
0.40
97003E3
-
100
10 x 10 x 10
255
35
0.14
0.25
97001e3
99001E3
150
10 x 10 x 14
317
53
0.14
0.20
97002e3
-
220
12.5 x 12.5 x 13
750
77
0.14
0.12
97011e3
99011E3
330
12.5 x 12.5 x 13
750
115
0.14
0.12
97012e3
99012E3
470
12.5 x 12.5 x 16
900
164
0.14
0.09
97013e3
99013E3
680
16 x 16 x 16
1100
238
0.14
0.08
-
99014E3
820
16 x 16 x 21
1200
287
0.14
0.06
-
99015E3
1000
18 x 18 x 16
1200
350
0.14
0.08
-
99016E3
1200
18 x 18 x 21
1550
420
0.14
0.06
-
99017E3
1500
18 x 18 x 21
1550
525
0.14
0.06
-
99018E3
47
8 x 8 x 10
145
24
0.14
0.70
97103E3
-
68
10 x 10 x 10
205
34
0.14
0.50
97101E3
99101E3
100
10 x 10 x 14
255
50
0.14
0.40
97102E3
-
220
12.5 x 12.5 x 13
750
110
0.12
0.23
97111E3
99111E3
330
12.5 x 12.5 x 16
900
165
0.12
0.18
97112E3
99112E3
470
16 x 16 x 16
900
235
0.12
0.15
-
99113E3
680
16 x 16 x 21
1000
340
0.12
0.13
-
99114E3
680
18 x 18 x 16
1000
340
0.12
0.15
-
99115E3
820
18 x 18 x 16
1000
410
0.12
0.15
-
99116E3
820
18 x 18 x 21
1050
410
0.12
0.13
-
99117E3
1000
18 x 18 x 21
1050
500
0.12
0.13
-
99118E3
10
8 x 8 x 10
145
6.3
0.12
0.70
97805E3
-
22
8 x 8 x 10
145
14
0.12
0.70
97803E3
-
33
8 x 8 x 10
145
21
0.12
0.70
97804E3
-
47
10 x 10 x 10
205
30
0.12
0.50
97801E3
99801E3
68
10 x 10 x 14
255
43
0.12
0.40
97802E3
-
100
12.5 x 12.5 x 13
500
63
0.10
0.25
97811E3
99811E3
220
12.5 x 12.5 x 16
600
138
0.10
0.20
97812E3
99812E3
330
16 x 16 x 16
700
208
0.10
0.18
-
99813E3
330
16 x 16 x 21
750
208
0.10
0.15
-
99814E3
330
18 x 18 x 16
750
208
0.10
0.18
-
99815E3
470
16 x 16 x 21
750
296
0.10
0.15
-
99816E3
470
18 x 18 x 16
750
296
0.10
0.18
-
99817E3
470
18 x 18 x 21
900
296
0.10
0.15
-
99818E3
680
18 x 18 x 21
900
428
0.10
0.15
-
99819E3
Notes
(1) Standard reflow soldering profile, see Fig. 4 and Table 4
(2) Advanced reflow soldering profile, according to JEDEC J-STD-020, see Fig. 5 and Table 5
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Document Number: 28396
Revision: 09-May-11
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140 CRH
Aluminum Capacitors
SMD (Chip), High Temperature
Vishay BCcomponents
Table 7
ADDITIONAL ELECTRICAL DATA
PARAMETER
CONDITIONS
VALUE
Surge voltage for short periods
IEC 60384-18, subclause 4.14
Us  1.15 x UR
Reverse voltage for short periods
IEC 60384-18, subclause 4.16
Urev  1 V
After 2 min at UR
IL2  0.01 x CR x UR
Ø D = 8 mm
Typ. 6 nH
Ø D = 10 mm
Typ. 8 nH
Ø D  12.5 mm
Typ. 11 nH
Voltage
Current
Leakage current
Inductance
Equivalent series inductance (ESL)
Resistance
ESR = tan /2fCR
Equivalent series resistance (ESR) at 100 Hz Calculated from tan max. and CR (see Table 6)
DISSIPATION FACTOR (tan )
CAPACITANCE (C)
1.2
10
C
C0
1
1.1
tan
tan0
2
1
1.0
0.9
2
1
Curve 1: 10 V
Curve 2: 63 V
0.1
0.8
- 60
- 40
- 20
0
20
C0 = Capacitance at 20 °C, 100 Hz
40
60
80
100 120
Tamb (°C)
Fig. 6 - Typical multiplier of capacitance as a function
of ambient temperature
Document Number: 28396
Revision: 09-May-11
- 60
- 40
- 20
0
20
40
tan δ0 = Typical tan δ at 20 °C, 100 Hz
60
80
100
120 140
Tamb (°C)
Fig. 7 - Typical multiplier of dissipation factor (tan )
as a function of ambient temperature
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140 CRH
Aluminum Capacitors
SMD (Chip), High Temperature
Vishay BCcomponents
EQUIVALENT SERIES RESISTANCE (ESR)
10
ESR
ESR0
1
0.1
10
10
2
10
3
10
ESR0 = Typical ESR at 20 °C, 100 Hz
4
5
f (Hz) 10
Tamb = 20 °C
Fig. 8 - Typical multiplier of ESR as a function of frequency
IMPEDANCE (Z)
10 2
10 2
Curve 1: 100-25-0810
Curve 2: 220-25-1010
Curve 3: 330-25-1213
Curve 4: 470-25-1216
Curve 5: 1000-25-1616
Curve 6: 2200-25-1821
Z
(Ω)
100
Curve
Curve
Curve
Curve
Curve
Curve
Curve
Z
(Ω)
100
1:
2:
3:
4:
5:
6:
7:
22-63-0810
47-63-1010
68-63-1014
100-63-1213
220-63-1216
330-63-1616
680-63-1821
10
10
1
2
3
4
5
6
1
0.1
1
2
3
4
5
6
7
1
0.1
0.01
0.01
10
10
2
10
3
10
4
f (Hz)
10
5
10
10
2
10
3
10
Tamb = 20 °C
Fig. 9 - Typical impedance as a function of frequency
4
5
f (Hz) 10
Tamb = 20 °C
Fig. 10 - Typical impedance as a function of frequency
RIPPLE CURRENT AND USEFUL LIFE
Table 8
ENDURANCE TEST DURATION AND USEFUL LIFE
MAL214097...
NOMINAL
CASE SIZE
DxL
(mm)
CASE
CODE
ENDURANCE
AT 125 °C
(h)
8 x 8 x 10
10 x 10 x 10
10 x 10 x 14
12.5 x 12.5 x 13
12.5 x 12.5 x 16
16 x 16 x 16
16 x 16 x 21
18 x 18 x 16
18 x 18 x 21
0810
1010
1014
1213
1216
1616
1621
1816
1821
1000
1000
1000
2000
2000
-
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USEFUL LIFE
USEFUL LIFE
ENDURANCE
AT 40 °C
AT 125 °C
AT 125 °C
1.8 x IR APPLIED
(h)
(h)
(h)
1500
150 000
1500
150 000
1000
1500
150 000
3000
300 000
3000
3000
300 000
4000
5000
5000
5000
5000
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MAL214099...
USEFUL LIFE
USEFUL LIFE
AT 40 °C
AT 125 °C
1.8 x IR APPLIED
(h)
(h)
1500
150 000
3500
350 000
5000
400 000
6000
500 000
6000
500 000
6000
500 000
6000
500 000
Document Number: 28396
Revision: 09-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
140 CRH
Aluminum Capacitors
SMD (Chip), High Temperature
Vishay BCcomponents
RIPPLE CURRENT AND USEFUL LIFE
MBC242
IA 4.3
IR
4.2
4.1
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3.0
Lifetime multiplier
2.8
0
1.
5
1.
2.6
0
2.
0
3.
2.4
0
4.
0
6.
0
8.
2.2
2.0
12
20
1.8
30
1.6
60
1.4
1.2
1.0
0.8
0.5
0.0
0
10
IA = Actual ripple current at 100 kHz
IR = Rated ripple current at 100 kHz, 125 °C
(1)
Useful life at 125 °C and IR applied;
see Table 8
0
20
(1)
0
40
40
50
60
70
80
90
100
110
130 Tamb (°C)
120
Fig. 11 - Multiplier of useful life as a function of ambient temperature and ripple current load
Table 9
MULTIPLIER OF RIPPLE CURRENT (IR) AS A FUNCTION OF FREQUENCY
IR MULTIPLIER
FREQUENCY
(Hz)
UR = 6.3 V TO 25 V
UR = 35 V AND 50 V
UR = 63 V
50
0.60
0.45
0.40
100
0.70
0.60
0.55
300
0.80
0.75
0.70
1000
0.85
0.85
0.85
3000
0.90
0.90
0.90
10 000
0.95
0.95
0.95
30 000
0.97
0.97
0.97
100 000
1.00
1.00
1.00
Document Number: 28396
Revision: 09-May-11
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THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
140 CRH
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip), High Temperature
Table 10
TEST PROCEDURES AND REQUIREMENTS
TEST
NAME OF TEST
REFERENCE
PROCEDURE
(quick reference)
REQUIREMENTS
Mounting
IEC 60384-18,
subclause 4.3
Shall be performed prior to tests mentioned below;
reflow soldering;
for maximum temperature load refer to chapter “Mounting”
C/C: ± 5 %
tan   spec. limit
IL2  spec. limit
Endurance
IEC 60384-18/
CECC 32300,
subclause 4.15
Tamb = 125 °C; UR applied;
for test duration see Table 8
UR = 6.3 V; C/C: ± 25 %
UR  10 V; C/C: ± 20 %
tan   2 x spec. limit
IL2  spec. limit
Useful life
CECC 30301,
subclause 1.8.1
Tamb = 125 °C; UR and IR applied;
for test duration see Table 8
C/C: ± 30 %
tan   3 x spec. limit
IL2  spec. limit
no short or open circuit
total failure percentage: 1 %
Shelf life
(storage at high
temperature)
IEC 60384-18/
CECC 32300,
subclause 4.17
Tamb = 125 °C; no voltage applied;
1000 h
after test: UR to be applied for 30 min,
24 h to 48 h before measurement
For requirements
see “Endurance test” above
Reverse voltage
IEC 60384-18/
CECC 32300,
subclause 4.16
Tamb = 125 °C:
125 h at U = - 0.5 V,
followed by 125 h at UR
C/C: ± 15 %
tan   1.5 x spec. limit
IL2  spec. limit
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Document Number: 28396
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Disclaimer
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Revision: 11-Mar-11
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