SEMTECH SC2677TSTR

SC2677
Dual Synchronous Voltage Mode
Controller with Current Sharing Circuitry
POWER MANAGEMENT
Description
Features
The SC2677 is a versatile 2 phase, synchronous, voltage mode PWM controller that may be used in two distinct ways. First, the SC2677 is ideal for applications
where point of use output power exceeds any single input power budget. Alternatively, the SC2677 can be used
as a dual switcher. The SC2677 features a temperature
compensated voltage reference, an under voltage lockout over current protection and internal level-shifted, highside drive circuitry.
‹ 300kHz to 1MHz externally programmable
frequency operation
Soft Start and Enable function
Power Good output provided
Under voltage short circuit protection
Phase-shifted switchers minimize ripple
High efficiency operation, >90%
Programmable output(s) as low as 0.5V
Industrial temperature range
TSSOP-20 package
‹ Bias voltage as low as 4.5V
‹ Adjustable phase shift between channels
‹
‹
‹
‹
‹
‹
‹
‹
In current sharing configuration, the SC2677 can produce a single output voltage from two separate voltage
sources (which can be different voltage levels) while
maintaining current sharing between the channels. Current sharing is programmable to allow loading each input
supply as required by the application.
Tw o Phase, Current Sharing Controller
‹ Flexible, same or separate VIN
‹ Programmable current sharing
‹ Thermal distribution via multi-phase output
In dual switcher configuration, two feedback paths are
provided for independent control of the separate outputs.
The device will provide a regulated output from flexibly
configured inputs (3.3V, 5V, 12V), provided 5V is present
for VCC. The phasing between the two switchers is adjustable to minimize the input and output ripple.
Applications
‹
‹
‹
‹
Graphics cards
Peripheral add-in card
Dual-Phase power supply
Power supplies requiring two outputs
Simplified Application Schematic
+5V
L1
M1
1
Vout1
2
C1
M2
C2
+12V
C3
1uF
PWRGD
R2
ENABLE
R1
11
BSTC
12
DL1
14
13
DH1
COMP1
BST1
15
16
-IN1
17
PHASING
SS/ENA
PWRGD
GND
R5
R6
DL2
DH2
PGND
10
9
8
COMP2
0R0
BST2
7
+IN2
-IN2
6
5
4
3
2
1
VCC
SC2677
FREQ
U1
VREF
R7
18
C4
19
R4
20
C5
R3
C6
R8
C7
R9
R11
R10
C8
+12V
+3.3V
L2
1
Vout2
2
M3
C9
M4
C10
Revision: NOV. 15, 2004
1
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SC2677
POWER MANAGEMENT
Absolute Maximum Rating
Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified
in the Electrical Characteristics section is not implied.
Parameter
Symbol
Limits
Units
VIN
-0.3 to 15
V
±1
V
BST1, BST2 to GND
-0.3 to 20
V
BSTC to GND
-0.3 to 20
V
-IN1, +/-IN2 to GND
7
V
COMP1, COMP2 to GND
7
V
DH1, DH2 to GND
-0.3 to 20
V
DL1, DL2 to GND
-0.3 to BSTC + 0.3
V
VCC to GND
PGND to GND
-3 peak (50nS)
PWRGD to GND
PHASING
SS/ENA to GND
(1)
V
VCC + 0.3
V
7
V
-0.3 to 7
V
Thermal Resistance Junction to Case
θJC
17
°C/W
Thermal Resistance Junction to Ambient
θJA
90
°C/W
Operating Ambient Temperature Range
TA
0 to 70
°C
Operating Junction Temperature Range
TJ
0 to 125
°C
Storage Temperature Range
TSTG
-65 to +150
°C
Lead Temperature (Soldering) 10 sec
TLEAD
300
°C
Electrical Characteristics
Unless Specified: VCC = 4.75 to 5.25V, GND = PGND = 0V, FB = VO, TJ = 25°C, VBSTC = VBST = 12V
Parameter
C onditions
Min
Typ
Max
U nits
Output Voltage
VOUT = VFB
0.495
0.500
0.505
V
Supply Voltage
V CC
4.5
15
V
Supply C urrent
UVLO
VCC = 5.0
10
mA
VCC Ramp up Threshold
2.84
V
V CC
100
mV
0.5
V
UVLO Hysteresi s
Reference
Reference Load Regulati on
VREF source 10uA ~ 100uA
0.2
%
Reference Li ne Regulati on
5V < V C C < 15V
0.7
%
Output Li ne Regulati on
5V < VIN < 15V
0.7
%
Gai n (Gm) (Error Ampli fi er)
C OMP pi n source 100uA
Bi as C urrent Offset (Slave Error Ampli fi er)
Max C urrent (Error Ampli fi er)
Input Bi as C urrent
5
6
mA/V
-2
-1
0
mV
Source
200
250
uA
Si nk
400
460
uA
-IN1, +IN2, -IN2
Short C i rcui t Protecti on Threshold
45
Osci llator Frequency Range
© 2004 Semtech Corp.
4
300
2
55
2
µA
65
%
1000
kHz
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SC2677
POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless Specified: VCC = 4.75 to 5.25V, GND = PGND = 0V, FB = VO, TJ = 25°C, VBSTC = VBST = 12V
Parameter
Conditions
Min
Typ
Max
Units
Oscillator Frequency
RSET = 2.5kohm
450
500
550
kHz
Oscillator Max Duty Cycle
FOSC = 500kHz
86
90
%
180
°C
Phasing of DH2 and DL1
VPHASING = 0.585V
DH Sink Current
DH - PGND = 3.5V
1.7
A
DH Sink Current
DH - PGND = 2.5V
0.85
A
DH Source Current
BSTH - DH = 3.75V
1.7
A
DH Source Current
BSTH - DH = 3V
0.85
A
DL Sink Current
DL - PGNG = 3.5V
1.7
A
DL Sink Current
DL - PGND = 2.5V
0.85
A
DL Source Current
BSTL - DL = 3.75V
1.7
A
DL Source Current
BSTL - DL = 3V
0.85
A
Note 5
50
Dead Time
Soft Start Charge Current (2)
Soft Start Transition Threshold(2)
120
ns
50
µA
0% duty cycle
400
mV
100% duty cycle
825
mV
Synchronous mode
1.22
V
Soft Start Enable
Soft Start End
85
Power Good Threshold
VOUT ramping up
Power Good Pull Down
Sink Current = 2mA
83%
88%
93%
VOUT
0.4
V
NOTES:
(1) Measured from 50% to 50% pulse amplitude.
(2) The soft start pin sources 50µA to an external capacitor. The converter operates in synchronous mode
above the soft start transition threshold and in asynchronous mode below it.
(3) Power good is an open collector output which is pulled low when the output voltage is under 75%.
(4) This device is ESD sensitive. Use of standard ESD handling precautions is required.
(5) 120ns maximum at 70°C.
Marking Information
(TSSOP-20)
TOP
yyww = Datecode (Example: 9908)
xxxx = Semtech Lot # (Example: 90101)
© 2004 Semtech Corp.
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SC2677
POWER MANAGEMENT
Pin Configuration
Ordering Information
Top View
D evice(1)
P ackag e
SC 2677TSTR
TSSOP-20
SC 2677TSTRT(2)
TSSOP-20
SC 2677EVB-1
C urrent Share Evaluati on Board
SC 2677EVB-2
D ual C hannel Evaluati on Board
Notes:
(1) Only available in tape and reel packaging. A reel contains 2500 devices.
(2) Lead free package.
(TSSOP-20 Pin)
Pin Descriptions
EXPANDED PIN DESCRIPTION
Pin 1: (VREF)
Internal 0.5V reference. Connected to the + input of
the master channel error amplifier.
Pin 2: (FREQ)
External frequency adjustment. Connect a resistor to
AGND to set the switching frequency. Please see
more information in Application section.
Pin 3: (VCC)
Bias pin for the controller. Connect a ceramic
decoupling capacitor from this pin to AGND with
minimum trace length.
Pin 4: (+IN2)
“+” input of the slave error amplifier.
Pin 5, 16: (-IN2, -IN1)
“-” inputs of the error amplifiers.
Pin 6, 15: (COMP2, COMP1)
Compensation pins of the error amplifiers.
Pin 7, 14: (BST2, BST1)
Supply pins for the high side drivers. Usually connected to bootstrap circuit.
Pin 8, 13: (DH2, DH1)
Gate drive pins for the top MOSFETs. Requires a
small series resistor.
Pin 9, 12: (DL2, DL1)
Gate drive pins for the bottom MOSFETs. Requires a
small series resistor.
© 2004 Semtech Corp.
Pin 10: (PGND)
Power GND. Return of the high side and low side gate
drivers.
Pin 11: (BSTC)
Supply pin for bottom MOSFET gate drivers.
Pin 17: (PHASING)
This pin controls the phase shift between master and
slave for optimum noise immunity. Use a resistive
divider from the FREQ pin (pin 2) to AGND, and
connect the tap of the resistive divider to pin 17.
Please see more information in Application section.
Pin 18: (SS/ENA)
Soft start pin. Connect a ceramic capacitor from this
pin to AGND, and there is an internal current source
charging up this capacitor during soft start. The PWM
operation can be disabled if this pin is pulled low.
Pin 19: (PWRGD)
Power good signal. This is an open collector output. It
is pulled low internally if output voltage is outside the
power good window.
Pin 20: (GND)
Analog GND. Return of the analog signals and bias of
the chip.
4
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SC2677
POWER MANAGEMENT
Block Diagram
1.25V
50uA
NOTES
(1) Channel 1 is the Master and Channel 2 is the Slave in current sharing configuration.
(2) For dual output operation, tie +IN2 to VREF and the two PWM channels are independent.
© 2004 Semtech Corp.
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+5V
ENABLE
PWRGD
+12V
4.6k
1.0uF
2.2
10uF
C36
U1
C41
10uF
0.1uF
R31
C40
5.9K
R19
R13
19
1uF
C39
1000uF
1000uF
C28
7.5K
R5
10uF
10uF
C4
C3
0.1uF
C24
1000uF
C5
1000uF
C42
1uF
C25
0R0
R2
SC2677
0R0
R32
IPD06N03LA
M5
1uF
C38
M3
R24
7.50K
IPD06N03LA
301
M7
R21
220nF
C33
C35
1nF
C60
1.0
77120-A7,2XAwg18,8 Turns,4mohm
L2
2
1
2uH
R35
220nF
10uF
C12
10uF
C13
10uF
C14
10uF
C15
0R0
R36
10uF
C16
10uF
C45
10uF
C46
10uF
10uF
10uF
12.1K
C56
1800uF
C55
1800uF
C20
1800uF
C19
1800uF
C49
C48
C47
R14
1.78K
R8
220nF
1.00K
R10
220nF
1uF
3.74K
R26
C37
R22
2.49K
1nF
C21
1.0
R1
77120-A7,2XAwg18,8 Turns,4mohm
L1
2
1
2uH
C23
C26
IPD06N03LA
IPD06N03LA
13
C2
M1
14
C1
20
GND
VR EF
1
PWRGD
FR EQ
2
17
PHASING
18
SS/ENA
VC C
3
-IN 2
5
+IN2
4
16
-IN 1
15
COMP1
COMP2
6
12
DL1
11
BSTC
PGND
BST1
BST2
7
DH 1
DH2
8
6
9
DL2
© 2004 Semtech Corp.
10
+3.3V
1.4V/16A
+Vout
SC2677
POWER MANAGEMENT
Evaluation Schematic
2 Channels with Current Sharing
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SC2677
POWER MANAGEMENT
Applications Information - Theory of Operation
Main Loop(s)
Soft Start/Enable
The Soft Start/Enable (SS/ENA) pin serves several functions. If held below the Enable threshold, both channels
are inhibited. DH1 and DH2 will be low, turning off the
top FETs. Between the Soft Start Enable threshold and
the Soft Start End threshold, the duty cycle is allowed to
increase. At the Soft Start End threshold, maximum duty
cycle is reached. In practical applications the error amplifier will be controlling the duty cycle before the Soft
Start End threshold is reached. To avoid boost problems
during start-up in current share mode, both channels start
up in asynchronous mode, and the bottom FET body diode is used for circulating current during the top FET off
time. When the SS/ENA pin reaches the Soft Start Transition threshold, the channels begin operating in synchronous mode for improved efficiency. The soft start pin
sources approximately 50uA and soft start timing can be
set by selection of an appropriate soft start capacitor
value.
a) Two independent channels with either common
or different input voltages and different output voltages. The two channels each have their own voltage feedback path from their own output. In this
mode, positive input of the error amplifier 2 is connected externally to Vref. If the application uses a
common input voltage, the sawtooth phase shift
between the channels provides some measure of
input ripple current cancellation.
It is possible to sequence the start up of the channel with an RC delay between the reference and
+IN2. The capacitor will be internally reset during
UVLO and soft start.
© 2004 Semtech Corp.
Frequency Set and Phasing
The switching frequency can be programmed by connecting a resistor from the FREQ pin to AGND. The PHASING
pin controls the phase shift between the master sawtooth
and slave sawtooth which allows the adjustment of the
phase shift for maximum noise immunity by controlling
the timing between master and slave transition. A resistive divider is used from the FREQ pin to AGND and the
divided voltage is fed to the PHASING pin as depicted.
7
11
BSTC
12
DL1
13
DH1
14
BST1
15
COMP1
16
-IN1
17
PHASING
18
SS/ENA
PGND
10
DH2
BST2
DL2
9
8
7
-IN2
+IN2
COMP2
6
5
4
VCC
SC2677
FREQ
U1
3
3.92K
2
R19
PWRGD
GND
20
3.57K
19
R13
1
b) Two channels operating in current sharing mode
with common output voltage and either common
input voltage or different input voltages. In this
mode, channel 1 operates as a voltage mode Buck
controller, as before, but error amp 2 monitors and
amplifies the difference in voltage across the output current sense resistors of channel 1 and channel 2 (Master and Slave) and adjusts the Slave duty
cycle to match output currents. To controller also
works well for using the output choke winding resistance as current sensing element (please refer the
application schematic for details). The amount of
the current of the slave channel vs.. the master
channel can be programmed according to the
application. This feature is especially useful when
two input sources are used and each source has its
power budget.
The offset of the current sharing error amplifier is
trimmed whthin the range of -2mV to 0. The polarity being such that the slave is OFF if the master
has no current.
Power Good
VREF
The SC2677 is a dual, voltage mode synchronous Buck
controller. The two separate channels are identical and
share only IC supply pins (Vcc and GND), output driver
ground (PGND) and pre-driver supply voltage (BSTC).
They also share a common oscillator generating a
sawtooth waveform for channel 1 and an dephased
sawtooth for channel 2. Channel 2 has both inputs of the
error amplifier uncommitted and available externally. This
allows the SC2677 to operate in two distinct modes.
The controller provides a power good signal. This is an
open collector output, which is pulled low if the output
voltage is outside of the power good window.
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SC2677
POWER MANAGEMENT
Applications Information
(R 13+ R 19) v s.O scillato r F re q u e n cy
It is important to keep the gate traces short, the IC must
be close to the power switches. It is recommended to
use at least 25 mil width or wider trace when ever
possible. A good placement can help if the controller is
placed in the middle of the two PWM channels.
Oscillator Frequency (kHz)
1000
900
800
700
600
500
Grounding requirements are always important in a buck
converter layout, especially at high power. Power ground
(PGND) should be returned to the bottom MOSFET source
to provide the best gate current return path. Analog
ground (GND) shape should be used for the anaglog returns such as chip decoupling, frequency setiing, reference voltage (or soft starting cap), and the compensation.
This groung shap should be single point connected to
the PGND shape near the ground side of the output
capacitors. This will provide noise free analog ground for
operation stablity, and also provide best possible remote sensing for the feedback voltage. In case two
output rails need to be regulated, the AGND shape should
single point connected to the geometrica center of the
PGND for the two point of loads. The single ponit tie is a
must to prevent the power current from flowing on the
AGND shape, so that the analog circuitry in the controller has an electrically quiet reference and to provide the
greatest noise free operation. Keep in mind that the
AGND pin is never allowed to have bigger than 1V voltage difference vs the PGND pin. This usually achievable
by using a ground plan for PGND in PCB layout. Using
ground plane for PGND can reduce the physical separation between the two grounds, such that even the fast
current transitions in the PGND plane can not generate
voltage spikes exceeding the 1V level, therefore preventing unstable and erratic behavior from happening.
400
300
4
6
8
10
12
14
16
18
20
(R 13+ R 19) (ko h m)
Vp h a sin g v s P h as e S h ift
180
160
Phase (deg)
140
120
100
80
60
40
20
0
0 .5 5
0 .6 0
0 .6 5
0 .7 0
0 .7 5
0 .8 0
0 .8 5
0 .9 0
V p h a s in g (V )
Shutdown
The output short circuit protection is done by output
undervoltage detection. Upon output short circuit and
when the output voltage drops bellow a certain percentage of the regulation target (see elctrical characteristics
table for details, the PWM will be disabled and the output will be dsiabbled and latched off. The latch can be
reset by power cycling.
Layout Guidelines
Power and signal traces must be kept separated for noise
considerations. Feedback, current sense traces and analog ground should not cross any traces or planes carrying
high switching currents, such as in the input loop or the
phase node.
The feedback divider must be close to the IC and be
returned to analog ground. Current sense traces must
be run parallel and close to each other and to analog
ground.
The input loop, consisting of the input capacitors and
both MOSFETs must be kept as small as possible. Since
all of the high switching currents occur in the input loop,
the enclosed loop area must be kept small to minimize
inductance and radiated and conducted noise emissions.
Designing for minimum trace length is not the only factor
The IC must have a ceramic decoupling capacitor across
its supply pins, mounted as close to the device as
possible. The small ceramic, noise-filtering capacitors on
the current sense lines should also be placed as close to
the IC as possible.
for best design, often a more optimum layout can be
achieved by keeping the wide trace and using proper layer
stacking to minimize the stray inductance.
© 2004 Semtech Corp.
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SC2677
POWER MANAGEMENT
Outline Drawing - TSSOP-20
A
D IM
D
e
E /2
E1
E
P IN 1
IN D IC A T O R
ccc C
2 X N /2 T IP S
1 2 3
e /2
B
0 .0 5
0 .8 0
0 .1 9
0 .0 9
6 .4 0
4 .3 0
1 .2 0
0 .1 5
1 .0 5
0 .3 0
0 .2 0
6 .6 0
6 .5 0
4 .5 0
4 .4 0
6 .4 0 B S C
0 .6 5 B S C
0 .4 5
0 .6 0
0 .7 5
( 1 .0 )
20
0
8
0 .1 0
0 .1 0
0 .2 0
D
aaa C
S E A T IN G
PLANE
.0 4 7
.0 0 6
.0 4 2
.0 1 2
.0 0 7
.2 5 9
.2 5 5
.1 7 7
.1 7 3
.2 5 2 B S C
.0 2 6 B S C
.0 1 8
.0 2 4
.0 3 0
(.0 3 9 )
20
0
8
.0 0 4
.0 0 4
.0 0 8
.0 0 2
.0 3 1
.0 0 7
.0 0 3
.2 5 1
.1 6 9
A
A1
A2
b
c
D
E1
E
e
L
L1
N
01
aaa
bbb
ccc
N
2X
D IM E N S IO N S
IN C H E S
M IL L IM E T E R S
M IN N O M M A X M IN N O M M A X
A2
C
A
H
A1
bxN
bbb
C
A -B D
c
GAGE
PLANE
0 .2 5
L
(L 1 )
S ID E V IE W
S E E D E T A IL
D E T A IL
A
01
A
NO TES:
1.
C O N T R O L L I N G D I M E N S I O N S A R E IN M IL L I M E T E R S ( A N G L E S I N D E G R E E S ) .
2.
DATUM S
3.
D IM E N S IO N S " E 1 " A N D " D " D O N O T I N C L U D E M O L D F L A S H , P R O T R U S IO N S
OR G ATE BURRS.
4.
R E F E R E N C E J E D E C S T D M O - 1 5 3 , V A R IA T I O N A C .
-A -
AND
-B -
T O B E D E T E R M IN E D A T D A T U M P L A N E
-H -
Land Pattern - TSSOP-20
X
D IM
(C )
G
C
G
P
X
Y
Z
Z
Y
D IM E N S IO N S
IN C H E S
M IL L I M E T E R S
( .2 2 2 )
.1 6 1
.0 2 6
.0 1 6
.0 6 1
.2 8 3
( 5 .6 5 )
4 .1 0
0 .6 5
0 .4 0
1 .5 5
7 .2 0
P
NOTES:
1.
T H IS L A N D P A T T E R N IS F O R R E F E R E N C E P U R P O S E S O N L Y .
C O N S U L T Y O U R M A N U F A C T U R IN G G R O U P T O E N S U R E Y O U R
C O M P A N Y 'S M A N U F A C T U R I N G G U I D E L I N E S A R E M E T .
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2004 Semtech Corp.
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