SMDA05C-8 THRU SMDA24C-8 Bidirectional TVS Array for Protection of Eight Lines PROTECTION PRODUCTS Description Features u Transient protection for data lines to The SMDAxxC-8 series of transient voltage suppressors are designed to protect components which are connected to data and transmission lines from voltage surges caused by ESD (electrostatic discharge), EFT (electrical fast transients), and lightning. u u u u u u TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The SMDAxxC-8 is designed to provide transient suppression on multiple data lines and I/O ports. The low profile SO-14 design allows the user to protect up to eight data and I/O lines with one package. They are bidirectional device and may be used on lines where the normal operating voltage is above and below ground (i.e. -12V to +12V). Mechanical Characteristics u u u u The SMDAxxC-8 TVS diode array will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. 2 3 12 13 JEDEC SO-14 package Molding compound flammability rating: UL 94V-0 Marking : Part Number, Logo, Date Code Packaging : Tape and Reel per EIA 481 Applications u u u u u u u u Circuit Diagram 1 & 14 IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Small SO-14 surface mount package Protects eight I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology RS-232 & RS-422 Data Lines Microprocessor Based Equipment LAN/WAN Equipment Set-Top Box Notebooks, Desktops, & Servers Portable Instrumentation Peripherals Serial and Parallel Ports Schematic & PIN Configuration 7&8 5 6 1 14 2 13 3 12 4 11 5 10 6 9 7 8 9 10 SO-14 (Top View) Revision 9/2000 1 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbo l Value Units Peak Pulse Pow er (tp = 8/20µs) Pp k 300 Watts Lead Soldering Temp erature TL 260 (10 sec.) °C Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics SMDA05C-8 Par ame te r Symbo l Co nd itio ns Minimum Typ ical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdow n Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 20 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 9.8 V Maximum Peak Pulse Current I PP tp = 8/20µs 17 A Junction Cap acitance Cj Betw een I/O Pins and Gnd V R = 0V, f = 1MHz 350 pF Symbo l Co nd itio ns Maximum Units 12 V 6 V SMDA12C-8 Par ame te r Minimum Typ ical Reverse Stand-Off Voltage VRWM Reverse Breakdow n Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 19 V Maximum Peak Pulse Current I PP tp = 8/20µs 12 A Junction Cap acitance Cj Betw een I/O Pins and Gnd V R = 0V, f = 1MHz 120 pF ã 2000 Semtech Corp. 2 13.3 V www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Electrical Characteristics (Continued) SMDA15C-8 Par ame te r Symbo l Co nd itio ns Minimum Typ ical Maximum Units 15 V Reverse Stand -Off Voltage V RWM Reverse Breakd ow n Voltage V BR It = 1mA Reverse Leakage Current IR V RWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A , tp = 8/20µ s 24 V Maximum Peak Pulse Current I PP tp = 8/20µ s 10 A Junction Cap acitance Cj Betw een I/O Pins and Gnd V R = 0V, f = 1MHz 75 pF Symbo l Co nd itio ns Maximum Units 24 V 16.7 V SMDA24C-8 Par ame te r Minimum Typ ical Reverse Stand-Off Voltage VRWM Reverse Breakdow n Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 43 V Maximum Peak Pulse Current I PP tp = 8/20µs 5 A Junction Cap acitance Cj Betw een I/O Pins and Gnd V R = 0V, f = 1MHz 50 pF ã 2000 Semtech Corp. 3 26.7 V www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 90 % of Rated Power or IPP Peak Pulse Power - P PP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Pulse Waveform 110 Waveform Parameters: tr = 8µs td = 20µs 100 90 Percent of IPP 80 70 e 60 -t 50 40 td = IPP/2 30 20 10 0 0 5 10 15 20 25 30 Time (µs) IEC 61000-4-2 Discharge Parameters ESD Pulse Waveform (IEC 61000-4-2) Level ã 2000 Semtech Corp. 4 First Peak Current Peak Current at 30 ns Peak Current at 60 ns Test Test Voltage Voltage (Contact ( A ir Disch arge) Disch arge) (kV ) (kV ) (A) (A) (A) 1 7.5 4 8 2 2 2 15 8 4 4 4 3 22.5 12 6 6 8 4 30 16 8 8 15 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Applications Information Device Connection for Protection of Eight Data Lines Circuit Diagram The SMDAxxC-8 is designed to protect up to 8 data or I/O lines. They are bidirectional devices and may be used on lines where the signal polarities are above and below ground. GND 1 The SMDAxxC-8 TVS arrays employ a monolithic structure. Therefore, the working voltage (VRWM) and breakdown voltage (VBR) specifications apply to the differential voltage between any two data line pins. For example, the SMDA24C-8 is designed for a maximum voltage excursion of +/-12V between any two data lines. I/O 1 2 13 I/O 8 I/O 2 3 12 I/O 7 N.C. 4 11 N.C. I/O 3 5 10 I/O 6 I/O 4 6 9 I/O 5 GND 7 8 GND Connection Diagram The device is connected as follows: l 14 GND Pins 2, 3, 5, 6, 9, 10, 12 and 13 are connected to the lines that are to be protected. Pins 1, 7, 8, and 14 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Pins 4 and 11 are not connected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: l l l l l l Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. ã 2000 Semtech Corp. 5 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Outline Drawing - SO-14 Land Pattern - SO-14 ã 2000 Semtech Corp. 6 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Ordering Information Par t Numbe r Wo r king Vo ltage Qty p e r Reel R e e l Size SMDA 05C-8.TE 5V 2,500 13 Inch SMDA 12C-8.TE 12V 2,500 13 Inch SMDA 15C-8.TE 15V 2,500 13 Inch SMDA 24C-8.TE 24V 2,500 13 Inch Note: (1) No suffix indicates tube pack. Contact Information Semtech Corporation Protection Products Division 652 Mitchell Rd., Newbury Park, CA 91320 Phone: (805)498-2111 FAX (805)498-3804 ã 2000 Semtech Corp. 7 www.semtech.com