h November 28, 1995 ELECTRONIC COMPONE SHARP CORPORATION GROUP OPTO-ELECTS DEVICES DIV. SPECIFICATION F \ DEVICE SPECIFICATION Business dealing name FOR PHOTOCOUPLER MODEL No. PC817 1. These specification sheets include the contents under the copyright of Sharp Corporation Please keep them with reasonable care as important information. Please don’t reproduce or cause anyone reproduce them without Sharp’s consent. (“Sharp”]. 2. Please obey the instructions mentioned below for actual use of this device. SHARP takes no responsibility for damage caused by improper use of the devices. (I) This device is designed for general electronic Main uses of this device are as follows; - OA equipment * Computer [ - Measuring equipment l equipment. - Telecommunication Tooling machine equipment - AV equipment (Terminal) l Home appliance, etc. (2) Please take proper steps in order to maintain reliability and safety, in case this device is used for the uses mentioned below which require high reliability. - Unit concerning - Traffic signal [ control and safety of a vehicle * Gas leak detection * Other safety equipment, [ * Nuclear control * Telecommunication equipment DATE BY automobile * Medical below which require extremely equipment (Trunk) 1 equipment Contact a SHARP representative of sales office in advance devices for any applications other than those applications recommend by SHARP at (1). CUSTOMER’S APPROVAL train, * Fire box and burglar alarm etc.) box etc. (3) Please do not use for the uses mentioned - Space equipment (air plane, breaker etc. high reliability. 1 1 when you intend to use S?%4.RP for general electronic equipment DATE PRESENTED BY T. Matsumura, Department General Manager of Engineering Dept.,11 Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION SHARP CORPORATION i 1 November 1. Application This specification applies to the outline Model No. PC8 17series. and characteristics of photocoupler 2. Outline Refer to the attached 3. Ratings drawing No. CY7073K02. and characteristics Refer to the attached sheet, page 3 to 6. 4. Reliability Refer to the attached 5. Incoming sheet, page 7. inspection Refer to the attached sheet, page 8. 6. Supplement 6.1 Isolation voltage shall be measured in the following (11 Short between anode to cathode on the primary to emitter on the secondary side. (21 The dielectric withstand tester with zero-cross method. side and between circuit collector shall be used. (3) The wave form of applied voltage shall be a sine wave. (It is recommended that the isolation voltage be measured in insulation oil.) 28. 1995 1 SHARP CORPORATION 6.2 Business dealing name (” 0” mark indicates business Ordered nroduct I Test conditions Ic (mA) A, B, C, D or no mark 2.5 to 30 PC817XIl A 1,=5mA PC8 17XI2 PC8 17XI3 PC8 17XI4 B 4.0 to 8.0 6.5 to 13 10to20 15 to 30 vc,=5v 4.0to 13 : 6.5 to 20 10 to 30 Ta=25’C PC817XI5 PC8 17Xi6 1 PC817XI7 PC8 172U8 I PC8 17XI9 1 PC817XIO . C D 1 AorB B or C C or D I A, B or C B, CorD 1 A, B, C or D I 6.3 This Model is approved Approved product) Rank mark Business dealingname PC817Xl 0 dealing name of ordered 1 4.0 to 20 6.5 to 30 1 4.oto30 by UL. Model No. : PC8 17 UL file No. : E64380 6.4 This product is not designed against irradiation. This product is assembled with electrical This product incorporates non-coherent 7. Notes Refer to the attached sheet- 1- 1, 2. input and output. light emitting diode. Ta=25”C l 1 Forward Collector current current Ic 50 mA PC 150 mW Ptot 200 mW voltage viso 5 kVrms temperature Topr -30 to +lOO ‘C Tstg -55 to +125 “C Tsol 260 “C *l Collector power *l Total power *3 Isolation Operating Storage dissipation dissipation temperature *4 Soldering temperature ‘1 The derating factors of absolute are shown in Fig. 1 to 4. *2 Pulse width_IlOO ,us, Duty ratio : 0.001 *3 AC for 1 min, 40 to 6O%RH l 4 For 10s maximum ratings due to ambient (Refer to Fig. 5) temperature SHARP CORPORATION 3.2 Electra-optical r characteristics Parameter Forward Syllhl voltage Peak forward voltage VF vFM Condition MIN. TYP. MAX. Unit 1.2 1.4 v 3.0 v 10 PA 30 250 pF :- - 100 nA 35 - - V I,=10 /LA, I,=0 6 - - V I,=5mA.VcE=5V 2.5 - 30 mA 0.1 0.2 v 1o’l - Q 0.6 1.0 pF 80 - kHz 4 18 pus 3 18 pus IFI,=20mA Im=0.5A Input Reverse current 1, v,=4v Terminal Ct v=o, f=lkHz Dark output capacitance current Collector-emitter breakdown voltage BvCEO Emitter-collector breakdown voltage BvECO Collector current Collector-emitter saturation voltage Transfer characteristics kE0 Ic V CEfsat) vc,=20v, IF=0 Ic=O. 1mA IF.=0 1,=2omA Ic=lmA Isolation resistance RIS0 Floating capacitance cf v=o, f=lMHz fc vc,=5v, Ic=2mA R,=lOO R, -3dB Rise time tr Fall time lf vc,=2v Ic=2mA R,=lOO R Cut-off frequency DC500V 40 to 6O%FW 5XlO’O - Rank mark mark i 6. 5’0.5 7. 62ro-3 l2 Pin Nos. and internal cdnnection diagram 1 1 d 2 d T 1. oy 10. oz. 5 1. l-J 2. 54$0.25 1 UNIT: l 2) Factory identification l/l mark shall be or shall not be marked. PC817 mm SHARP CORPORRTION (Fig. 1) Forward ambient (Fig. 2) Diode power diss&iok<->, vs. ambient temperature current vs. temperature 5 2 .+ i P t; -.. 80 70 60 40 3 & 4 -30 0 Ambient 25 55 75 temperature 100 -30 125 0 Ambient z .5 25 50 temperature 75 100 25 55 125 r -30 0 Ambient Ta ( ‘C ) 75 temperature (Fig. 4) Total power vs. ambient 25 100 125 Ta ( ‘C ) dissipation temperature 50 temperature 75 100 125 Ta (‘C ) (Fig. 5) Peak forward current vs. duty ratio PulsewidthS Ta=25’C 2 2000 1000 i 500 2 0 Ambient Ta ( “C ) (Fig. 3) Collector power dissipation vs. ambient temperature -30 20 ps 200 ; 100 m” 50 2z 20 Y 10 2 5 lo-‘2 5 lo”2 5 lo-‘2 e Duty ratio 5 10” J SHARP CORPORATION 4. Reliability of products The reliability shall be satisfied with items listed below. Confidence level : 90% LTPD: 10%/20% Test Conditions Test Items Failure $1 Solderability “2 Judgement Criteria Samples (nl Defective(C) 23O”C, 5 s n=ll, C=O n=ll, C=O n=ll, C=O n=ll, C=O n=ll, C=O n=ll, C=O Soldering heat 260°C. 10 s Terminal (Tension) strength Weight : 5N 5 s/each terminal Terminal strength (Bending) *3 Weight : 2.5N 2 times /each terminal Mechanical 15000m/s2, 0.5ms 3 times/ tX, +Y, fZ v,>ux 1.2 I,>UXZ Icso >‘ux2 Variable vibration shock frequency direction rc<LX0.7 100 to 2000 to 1ooHz/4min 200m/s2 4 times/ X, Y, 2 direction Temperature cycling 1 cycle -55 ‘C to t 125°C (30mir-i) (30mi.n) 20 cycles test High temp. and high humidity storage +6O’C, 9O%RH, High temp. storage +125”C, Low temp. storage -55”C, 1 OOOh Operation I,=SOmA, Ptot=200mW Ta=25”C, 1OOOh V CE(sat) *l life Test method, conforms lOOOh ’ ’ O2 n=22,C=O U lOOOh > ’ Upper specification limit L : Lower specification limit to JIS C 7021. ‘2 Solder shall adhere at the area of 95% or more of immersed portion of lead and pin hole or other holes shall not be concentrated on one portion. *3 Terminal bending direction is shown below. n=22,C=O n=22 ,C=O i-i=22 ,C=O n=22.C=0 SHARP CORPORATION 5. Incoming inspection 5.1 Inspection items (11 Electrical characteristics V,, I,, I,,, VCE:(satj,Ic, R,,, Visa (2) Appearance 5.2 Sampling method and Inspection level A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items axe shown below. Defect Inspection item AQL (%) SHflRP CORPORATION Precautions for Photocouplers 1 For cleaning (1) Solvent cleaning (2) Ultrasonic Applicable : Solvent temperature 45°C or less Immersion for 3 min or less cleaning solvent : The affect to device by ultrasonic cleaning is different by cleaning bath size, ultrasonic power output, cleaning time, PWB size or device mounting condition etc. Please test it in actual using condition and con&m that doesn’t occur any defect before starting the ultrasonic cleaning. : Ethyl alcohol, Methyl alcohol Freon TE * TF. DifIon-solvent Please refrain form using Chloro device as much as possible since the ozonosphere. Before you use to confirm that it does not attack S3-E Fluoro Carbon type solvent to clean it is internationally restricted to protect alternative solvent you are requested package resin. 2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50% / 5years) SHflRP CORPORRTION 3. Precaution ( 11 If solder refIow for Soldering Photocoupler : It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure. 230t I - 200°C 180°C 25°C (2) Other precautions An infbared Iamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (1). Also avoid immersing the resin part in the solder.