PRODUCT/PROCESS CHANGE NOTIFICATION PCN DSG-COM/03/145 PCN LEADFREE PLATING FOR SO8 PACKAGE IN MUAR first lines 2003/02/7 PCN DSG-COM/03/145 Product Family /Commercial Product STANDARD LINEAR products in SO8 package Type Of Change Package assembly process change Reason For Change Environmental directive Description of the change To remove lead from plating by using preplating nickel palladium gold leadframe NiPdAu. This change will not affect ELECTRICAL & MECHANICAL parameters. Samples available: LM393DT/LM358DT. Other samples: on request. PLEASE BOOK YOUR SAMPLE ORDER IN NON-STANDARD WITH THE FOLLOWING COMMENT "AS PER LEADFREE PCN DSG-COM/03/145". Forecasted date of change 07-May-2003 Forecasted date of samples for customer 07-Feb-2003 Forecasted date for STMicroelectronics change qualification report availability 07-Feb-2003 Marking to identify changed product "E" letter on the package close to ST LOGO Description of qualification program See Attached Qualification Plan Product Line(s) and/or Part Number(s) See Attached List Manufacturing Location(s) Estimated Date of first shipment 07-May-2003 Division Product Manager Jean Claude KAIRE Date: Jan.29 ,03 Division Q.A. Manager Francoise PACCARD Date: Jan.29 ,03 Customer Acknowledgement of Receipt PCN DSG-COM/03/145 Please sign and return to STMicroelectronics Sales Office Qualification Plan Denied Name: Qualification Plan Approved Title: Company: Change Denied Date: Change Approved Signature: Remark ....................................................................................................................................................................................................................... ....................................................................................................................................................................................................................... ....................................................................................................................................................................................................................... ....................................................................................................................................................................................................................... ....................................................................................................................................................................................................................... 2003/02/7 Process Change/ Transfer Qualification report n° QASO8N91 PROCESS CHANGE / TRANSFER QUALIFICATION REPORT PCN reference: DSG-COM/03/145 Qualification Report n°: QASO8N91 Qualification Type: Material change Process: Leadfree plating New glue Hitachi 4900 Date of issue: 22th January 2003 Reference documents: SOP 2.5.9 Process critical and key parameters 0076604 Process Qualification and release to production 0078588 Reliability requirements for product qualification 0046008 Process control plan for Front End 0060531 FMEA procedure 0061050 Back end qualification procedure 0091984 Construction analysis 0037709 Package construction analysis 7006451 Management of manufacturing source change 0033689 Process flow chart Prepared by JM Bugnard Page 1/9 Process Change/ Transfer Qualification report n° QASO8N91 Content 1 PROCESS MAIN SPECIFICATION CHANGE 1.1 Process change description 1.2 Process main specification change 1.3 Possible effects of change on Parametric, Electrical, Quality or Reliability 2 QUALIFICATION PLAN 2.1 Test vehicle description 2.2 Process qualification requirements 2.3 E WS qualification requirements 2.4 Final Test qualification requirements 2.5 Bench Test requirements 2.6 Reliability qualification requirements 3 QUALIFICATION RESULTS 3.1 Process qualification results 3.2 EWS qualification results 3.3 Final Test qualification results 3.4 Bench Test qualification results 3.5 Reliability qualification results 4 PROCESS CHANGE QUALIFICATION CERTIFICATE Prepared by JM Bugnard Page 2/9 Process Change/ Transfer Qualification report n° QASO8N91 1. PROCESS MAIN SPECIFI CATION CHANGE 1.1 Process change description. 1.1.1 Nature of Change: Leadfree plating NiPdAu preplated leadframe and glue change (Hitachi 4900) 1.1.2 Reason for Change: To be compliant with Environmental directives. 1.1.3 Affected process: SO8 assembled in ST Muar 1.1.4 Affected products: All standard linear devices assembled in SO8 1.1.5 Implementation date: April 2003 1.2 DETAILLED DESCRIPTION OF CHANGE Assembly site Assembly flow + Control Plan Frame (material) Die attach material Wire material Wire diameter Mold compound Wire bond method Lead finishing New Process Current Process ST Muar (Malaysia) 7124337 Copper + NiPdAu preplating Hitachi 4900ST Gold 1 MIL MP8000 CH4 Thermosonic NiPdAu (preplated) ST Muar (Malaysia) 7071671 Copper Ablebond 8390 Gold 1 MIL MP8000 CH4 Thermosonic Tin plating (SnPb85/15) LEAD-FREE components are defined by STMicroelectronics as ECOPACK® components. The implementation of the ECOPACK specification includes the suppression of lead (Pb) in those alloys used the lead finishing of components. The identification of ECOPACK products will be achieved through specific labelling on component boxes. Whenever possible, the letter “E” will be added in the marking pattern beside the ST logo on the package body. 1.3 MAJOR EFFECTS OF CHANGE ON QUALITY, PARAMETRIC, ELECTRICAL OR RELIABILITY DATA No effect on solderability: ECOPACK components a re solderable with both current SnPb and AgSnCu lead free PCB assembly processes. Reliability improvement: In addition to the change of connection coating, a change in materials (glue) occurs in SO Narrow in order to meet the higher soldering tem perature constraints required for lead-free soldering using, in particular, the IPC/JEDEC JSTD020B standard as reference. Prepared by JM Bugnard Page 3/9 Process Change/ Transfer Qualification report n° QASO8N91 2. QUALIFICATION PLAN 2.1 PROCESS QUALIFICATION REQUIREMENTS 2.1.1 Flow Chart comparison (1) yes [ X ] no [ ] N/A [ ] 2.1.2 Control Plan comparison (1) yes [ X ] no [ ] N/A [ ] 2.1.3 FMEA study (1) yes [ X ] no [ ] N/A [ ] 2.1.4 Process construction analysis (1) yes [ X ] no [ ] N/A [ ] 2.1.5 Quantity of qualification lots [ ]1 [ ]2 2.1.6 Critical parametric parameters analysis (Cpk) [X ]3 [ ]4 yes [X ] no [ ] N/A [ ] yes [X ] no [ ] N/A [ ] Bond pull test, Bond shear test. 2.1.7 Non critical parameters analysis (Mean) Note 1: as described in related ADCS procedure 2.2 Test Vehicles (TV) description. Line Sales Type P&L Dice size Package Assy Reliab plant 0431* 0158* 0082* TL431CD LM358D TL082CD 71 71 71 1.38x1.12mm 1.07x 1.01 1.74x1.48 SO8 SO8 SO8 ST Muar ST Muar ST Muar Grenoble +Muar Grenoble Muar Lot # 1 1 1 * shrinked die version 2.3 FINAL TEST QUALIFICATION REQUIREMENTS [ x ] yes [ ] no 2.3.1 Quantity of qualification lots []1 [X ] 2 []3 2.3.2 Lot average yield data: []1 [X ]2 []3 2.3.3 Package type SO8 2.3.4 Parameter distributions [X ] N/A [ ] LotA [ ] LotB [ ] Lot C 2.3.4.1List of parameters: 2.3.4.2 Qualification criteria: N/A 2.4 BENCH MEASUREMENTS QUALIFICATION REQUIREMENTS [ X] yes [ ] no [ ]N/A Construction analysis conforms to ST specification. 2.5 SPECIFIC TESTS QUALIFICATION REQUIREMENTS [] yes 2.5.1 ESD [] yes [ x ] no 2.5.1 Latch-up [] yes [ x ] no Prepared by JM Bugnard [ ] no [x] N/A Page 4/9 Process Change/ Transfer Qualification report n° QASO8N91 2.6 RELIABILITY QUALIFICATION REQUIREMENTS 2.6.1 Reliability tests performed on [x] LotA [x] LotB [x] yes [] no [x] LotC 2.6.2 Reliability tests: Tests HTB Environment Sequence THB Conditions Ta=125°C Vs=absolute max rating PPT 3 atm. + TMC Ta=85C RH=85pct Vs=nominal Test 1000h 48h 100 cy. 1000h LotA LotB LotC Comments X X X Purpose: to point out problems connected to electrical stress related with the field application condition X X X X X X TMC Ta= -65/+150C 1000c X X X PPT Ta=121°C P=2atm 480h X X X Jedel level determination Jedel level 1 168h 85°C / 85%RH + 3IR reflow soldering Ta= -65/+150C X* X** X** TMSK 500shk X X Purpose: To point out failure mechanism mainly due to electrochemical effects developped inside the device for contamination ions and electrical field applied Purpose: to point out the thermomechanical mismatch among the different materials employed Purpose: to point out critical water entry path with consequential electrolytic and galvanic corrosion. Purpose: To point out problem connected to the reflow soldering. Purpose: to point out the thermomechanical mismatch among the different materials employed * With 260°C reflow peak (see Appendix 1) ** With 245°C reflow peak (see Appendix 1) 2.6.3 Drift analysis on Vio parameter (HTB & THB) 2.6.4 Qu alification criteria: Prepared by JM Bugnard [x yes [ ] no no reject after reliability. Page 5/9 Process Change/ Transfer Qualification report n° QASO8N91 3. QUALIFICATION RESULTS 3.1 Process qualification results. Bond Pull Test Device Wire size Min Max Average Stdev Cpk TL431CD LM358CD 1.0mil 1.0 mil 8.3g 8.5g 14.4g 12.7g 10.9 10.5 1.34 1.26 1.72 1.71 Device Wire size Min Max Average Stdev Cpk TL431CD LM358CD 1.0mil 1.0 mil 45.0g 43.2g 65.4g 60.8g 57.2 53.1 5.72 5.04 1.94 1.92 comments Minimum specification: 4g Bond shear test comments Minimum specification: 32g 3.2 Bench Test qualification results 3.2.1 X-ray analysis Wire sweeping conform No glue void 3.2.2 External visual NiPdAu plating: No exposed copper Surface finish: Uniform stains free & uniform print Cracks: Not visible at x10 Resin holes: not visible at x10 Other: No other visual defect 3.2.3 Scanning acoustic microscopy No delamination. 3.2.4 Microsection Resin holes: no void Glue thickness: conform (min: 11.3µm, max 11.8µm) Glue voids: no void Die tilt: conform (0.5µm) Die scribing: conform NiPdAu plating thickness: conform Package alignment : conform 3.2.5 Decapped devices Loop height: conform Ball size variation: conform Bond shape: conform: Bond centering: conform Weld shape: conform Weld centering: conform Die scribing: conform Die chipping: conform Prepared by JM Bugnard Page 6/9 Process Change/ Transfer Qualification report n° QASO8N91 3.2.6 External dimension measurement Conform 3.2.7 Solderability Conform (both after 24h steam aging and 24 hours dry air) on 80 units 3.3 FINAL TEST QUALIFICATION TL431CD 99.75% Test Yield LM358D 99.91 3.4 Reliability qualification results Conditions Duration Steps TMC -65/+150°C 1000 cy TMSK -65/+150°C 500 shks PPT 121°C, 2atm. 480 hours Envir. Sequ. TMC + PPT 100cy + 48h HTB 125°C 1000 h THB 85°C, 85%HR 1000 h 100cy 1000cy 100 shks 500shks 168h 240h 480h 100cy 48h 168 1000h 168 1000h Test RSM 245°C RSM 260°C Lot 1 TL431CD 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/20 + 0/15 0/20 Lot 2 LM358D 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/15 Lot 3 TL082CD 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/60 0/60 0/60 0/60 0/20 0/20 Test marked in blue performed in ST Muar 3.4.1 Drift analysis HTB (mean Vref drift) TL431CD THB (mean Vref drift) TL431CD HTB (mean Vio drift) LM358D THB (mean Vio drift) LM358D HTB (mean Vio drift) TL082CD THB (mean Vio drift) TL082CD Prepared by JM Bugnard 168h 2.57mV 0.54mV 0.047mV -0.01mV 0.32mV 0.20mV 1000 1.88mV 1.17mV 0.108 0.05 0.29mV 0.15mV Page 7/9 Process Change/ Transfer Qualification report n° QASO8N91 PROCESS CHANGE QUALIFICATION CERTIFICATE (7420046) PROCESS or PACKAGE: SO8 NRS NiPdAu preplated frame qualification CERTIFICATE NUMBER PLANT: Muar Malaysia C212SON1 GROUPS INVOLVED DSG DIVISION INVOLVED Standard linear IC’s TRANSFER TO PLANT TRANSFER FROM PLANT DESIGN RULE MANUAL 0018063 PROCESS FMEA 7141456 PROCESS FLOW CHART 7124337 PROCESS CONTROL PLAN 7124337 PARAMETRIC TESTING DOCUMENTATION N/A WLR N/A RELIABILITY REPORT QASONIP1 CONSTRUCTION ANALYSIS REPORT NO 09/02 ASSEMBLY REPORT Muar ASM PPF Qual. run QUALIFICATION REPORT QASONIP1 TEST VEHICLE PROCESS Bipolar TEST VEHICLE PACKAGE SO8 TEST VEHICLE SALES TYPE TL0431CD, LM358D, TL082CD Approval Group DSG PROD.ENG. STD LINEAR DSG PROD.ENG. MANAGER STD LINEAR DSG QUALITY MANAGT GNB QA DIRECTOR ST MUAR Prepared by JM Bugnard Name N ATHALIE BANCHERI ALAIN CHASSAGNEUX Date 24-DEC-2002 20-DEC-2002 FRANCOISE PACCARD RICHARD WONG 07-JAN -2003 24-DEC-2002 Page 8/9 Process Change/ Transfer Qualification report n° QASO8N91 APPENDIX 1 INFRARED REFLOW SOLDERING Prepared by JM Bugnard Page 9/9 Information furnished is believed to be accurate and reliable . However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties, which may result from it’s use. No license is granted by implication or otherwise under any patents or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorised for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics c 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hongkong - India - Israel - Italy - Japan - Malaysia - Malta - Morroco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States http://www.st.com 2003/02/7