FAIRCHILD FAN7390_12

FAN7390
High-Current, High & Low-Side, Gate-Drive IC
Features
Description
 Floating Channels for Bootstrap Operation to +600V
The FAN7390 is a monolithic high- and low-side gatedrive IC, which can drive high speed MOSFETs and
IGBTs that operate up to +600V. It has a buffered output
stage with all NMOS transistors designed for high pulse
current driving capability and minimum cross-conduction.
 Typically 4.5A/4.5A Sourcing/Sinking Current Driving
Capability
 Common-Mode dv/dt Noise Canceling Circuit
 Built-in Under-Voltage Lockout for Both Channels
 Matched Propagation Delay for Both Channels
 Logic (VSS) and Power (COM) Ground +/- 7V Offset
 3.3V and 5V Input Logic Compatible
 Output In-phase with Input
Fairchild’s high-voltage process and common-mode
noise canceling techniques provide stable operation of
the high-side driver under high dv/dt noise circumstances.
An advanced level shift circuit offers high-side gate driver
operation up to VS=-9.8V (typical) for VBS=15V.
The UVLO circuit prevents malfunction when VDD and
VBS are lower than the specified threshold voltage.
Applications
 PDP Sustain Driver
The high current and low output voltage drop feature
make this device suitable for the PDP sustain pulse
driver, motor driver, switching power supply, and highpower DC-DC converter applications.
 HID Lamp Ballast
 SMPS
 Motor Driver
8-SOP
14-SOP
Ordering Information
Part Number
Package
FAN7390MX
8-SOP
FAN7390M1X
14-SOP
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
Operating
Temperature Range
-40C ~ 125C
Packing Method
Tape & Reel
Tape & Reel
www.fairchildsemi.com
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
July 2012
15V
FAN7390
RBOOT
Up to 600V
DBOOT
HIN
1
HIN
VB
8
LIN
2
LIN
HO
7
Controller
Q1
R1
CBOOT
3
COM
VS
4
LO
VDD 5
R2
6
OUTPUT
Load
C1
Q2
R3
R4
FAN7390 Rev.01
Figure 1. Application Circuit for Half-Bridge (Referenced 8-SOP)
15V
RBOOT
DBOOT
FAN7390M1
Up to 600V
HIN
1
HIN
NC 14
LIN
2
LIN
VB
3
VSS
HO 12
4
NC
VS
5
COM
NC 10
6
LO
NC
9
7
VDD
NC
8
Controller
VSS
13
Q1
R1
R2
CBOOT
11
OUTPUT
Load
C1
Q2
R3
R4
FAN7390M1 Rev.03
Figure 2. Application Circuit for Half-Bridge (Referenced 14-SOP)
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
2
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Typical Application Circuit
FAN7390
8
VB
7
HO
6
VS
5
VDD
4
LO
3
COM
UVLO
200K
NOISE
CANCELLER
R
DRIVER
PULSE
GENERATOR
HIN 1
R
S
Q
UVLO
DRIVER
VSS/COM
LEVEL
SHIFT
DELAY
LIN 2
200K
FAN7390 Rev.06
Figure 3. Functional Block Diagram (Referenced 8-SOP)
FAN7390M1
13
VB
12
HO
11
VS
7
VDD
6
LO
5
COM
UVLO
200K
NOISE
CANCELLER
R
S
DRIVER
PULSE
GENERATOR
HIN 1
R
Q
UVLO
DRIVER
VSS/COM
LEVEL
SHIFT
DELAY
LIN 2
200K
VSS 3
Pin 4, 8, 9, 10 and 14 are no connection
FAN7390M1 Rev.06
Figure 4. Functional Block Diagram (Referenced 14-SOP)
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
3
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Internal Block Diagram
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Pin Configurations
FAN7390M
HIN
1
LIN
2
FAN7390M1
8
VB
HIN
1
14
NC
7
HO
LIN
2
13
VB
12
HO
11
VS
FAN7390
COM
3
6
VS
VSS
3
LO
4
5
VDD
NC
4
COM
5
10
NC
LO
6
9
NC
VDD
7
8
NC
FAN7390M1
FAN7390 Rev.01
FAN7390M1 Rev.01
Figure 5. Pin Assignments (Top View)
Pin Definitions
8-Pin
14-Pin
Name
Description
1
1
HIN
Logic Input for High-Side Gate Driver Output
2
2
LIN
Logic Input for Low-Side Gate Driver Output
3
VSS
Logic Ground (FAN7390M1 only)
3
5
COM
Low-Side Driver Return
4
6
LO
Low-Side Driver Output
5
7
VDD
Low-Side and Logic Part Supply Voltage
6
11
VS
High-Voltage Floating Supply Return
7
12
HO
High-Side Driver Output
8
13
VB
High-Side Floating Supply
4, 8, 9, 10, 14
NC
No Connect
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
4
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. TA=25°C, unless otherwise specified.
Symbol
Characteristics
VS
High-Side Floating Supply Offset Voltage
VB
High-Side Floating Supply Voltage
Min.
Max.
Unit
VB-25
VB+0.3
V
-0.3
625.0
V
VS-0.3
VB+0.3
V
VHO
High-Side Floating Output Voltage HO
VDD
Low-Side and Logic Fixed Supply Voltage
-0.3
25.0
V
VLO
Low-Side Output Voltage LO
-0.3
VDD+0.3
V
VIN
Logic Input Voltage (HIN and LIN)
VSS-0.3
VDD+0.3
V
VSS
Logic Ground (FAN7390M1 only)
VDD-25
VDD+0.3
V
50
V/ns
8-SOP
0.625
14-SOP
1.000
8-SOP
200
14-SOP
110
dVS/dt
PD(1)(2)(3)
Allowable Offset Voltage Slew Rate
Power Dissipation
W
JA
Thermal Resistance, Junction-to-Ambient
TJ
Junction Temperature
+150
C
TSTG
Storage Temperature
+150
C
C/W
Notes:
1. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
2. Refer to the following standards:
JESD51-2: Integral circuits thermal test method environmental conditions - natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
3. Do not exceed PD under any circumstances.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Max.
Unit
VB
High-Side Floating Supply Voltage
VS+10
VS+22
V
VS
High-Side Floating Supply Offset Voltage
6-VDD
600
V
VHO
High-Side Output Voltage
VS
VB
V
VDD
Low-Side and Logic Supply Voltage
10
22
V
VLO
Low-Side Output Voltage
COM
VDD
V
VIN
Logic Input Voltage (HIN and LIN)
VSS
VDD
V
TA
Operating Ambient Temperature
-40
+125
C
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
5
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Absolute Maximum Ratings
VBIAS (VDD, VBS)=15.0V, VS=VSS=COM, TA=25C, unless otherwise specified. The VIL, VIH, and IIN parameters are
referenced to VSS/COM and are applicable to the respective input signals HIN and LIN. The VO and IO parameters are
referenced to COM and VS is applicable to the respective output signals HO and LO.
Symbol
Characteristics
Test Condition
Min.
Typ.
Max. Unit
POWER SUPPLY SECTION (VDD AND VBS)
VDDUV+
VBSUV+
VDD and VBS Supply Under-Voltage 
Positive-going Threshold
8.0
8.8
9.8
VDDUVVBSUV-
VDD and VBS Supply Under-Voltage 
Negative-going Threshold
7.4
8.3
9.0
VDDUVH VDD and VBS Supply Under-Voltage 
VBSUVH Lockout Hysteresis Voltage
V
0.5
ILK
Offset Supply Leakage Current
VB=VS=600V
50
IQBS
Quiescent VBS Supply Current
VIN=0V or 5V
45
80
IQDD
Quiescent VDD Supply Current
VIN=0V or 5V
75
110
IPBS
Operating VBS Supply Current
fIN=20kHz, rms value
530
640
IPDD
Operating VDD Supply Current
fIN=20kHz, rms value
530
640
µA
µA
LOGIC INPUT SECTION (HIN, LIN)
VIH
Logic "1" Input Voltage
VIL
Logic "0" Input Voltage
2.5
IIN+
Logic "1" Input Bias Current
VIN=5V
25
50
IIN-
Logic "0" Input Bias Current
VIN=0V
1.0
2.0
RIN
Input Pull-down Resistance
1.2
100
200
V
µA
K
GATE DRIVER OUTPUT SECTION (HO, LO)
VOH
High-level Output Voltage, VBIAS-VO
No Load
1.0
V
VOL
Low-level Output Voltage, VO
No Load
35
mV
IO+
Output High, Short-circuit Pulsed
Current(4)
VO=0V, VIN=5V with PW<10µs
3.5
4.5
IO-
Output Low, Short-circuit Pulsed
Current(4)
VO=15V, VIN=0V with
PW<10µs
3.5
4.5
VS
Allowable Negative VS Pin Voltage for
HIN Signal Propagation to HO
VSSCOM
A
-9.8
VSS-COM/COM-VSS Voltage Endurability
-7.0
-7.0
V
7.0
V
Note:
4. This parameter guaranteed by design.
Dynamic Electrical Characteristics
VBIAS (VDD, VBS)=15.0V, VS=VSS=COM=0V, CL=1000pF and TA=25C unless otherwise specified.
Symbol
ton
Characteristics
Test Condition
Min.
Typ.
Max.
Turn-on Propagation Delay
VS=0V
140
200
toff
Turn-off Propagation Delay
VS=0V
140
200
MT
Delay Matching, HS & LS Turn-on/off
0
50
tr
Turn-on Rise Time
25
50
tf
Turn-off Fall Time
20
45
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
Unit
ns
www.fairchildsemi.com
6
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Electrical Characteristics
240
220
220
200
200
180
180
tOFF [ns]
tON [ns]
240
160
140
160
140
120
120
100
100
80
80
60
-40
-20
0
20
40
60
80
100
60
-40
120
-20
0
Temperature [°C]
40
40
30
30
20
60
80
100
120
20
10
10
-20
0
20
40
60
80
100
0
-40
120
-20
0
20
40
60
80
100
120
Temperature [°C]
Temperature [°C]
Figure 8. Turn-on Rise Time
vs. Temperature
Figure 9. Turn-off Fall Time
vs. Temperature
50
50
40
MTOFF [ns]
40
MTON [ns]
40
Figure 7. Turn-off Propagation Delay
vs. Temperature
tF [ns]
tR [ns]
Figure 6. Turn-on Propagation Delay
vs. Temperature
0
-40
20
Temperature [°C]
30
20
30
20
10
10
0
-40
0
-20
0
20
40
60
80
100
-10
-40
120
Temperature [°C]
0
20
40
60
80
100
120
Temperature [°C]
Figure 10. Turn-on Delay Matching vs. Temperature
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
-20
Figure 11. Turn-off Delay Matching vs. Temperature
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7
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Typical Characteristics
120
120
100
100
IQBS [A]
IQDD [A]
140
80
60
80
60
40
40
20
20
0
-40
-20
0
20
40
60
80
100
0
-40
120
-20
0
Temperature [°C]
1000
1000
800
800
600
400
80
100
120
400
-20
0
20
40
60
80
100
200
-40
120
-20
0
20
40
60
80
100
120
Temperature [°C]
Figure 14. Operating VDD Supply Current
vs. Temperature
Figure 15. Operating VBS Supply Current
vs. Temperature.
9.5
9.0
9.0
8.5
VDDUV- [V]
VDDUV+ [V]
60
600
Temperature [°C]
8.5
8.0
7.5
8.0
7.5
-40
40
Figure 13. Quiescent VBS Supply Current
vs. Temperature
IPBS [A]
IPDD [A]
Figure 12. Quiescent VDD Supply Current
vs. Temperature
200
-40
20
Temperature [°C]
-20
0
20
40
60
80
100
7.0
-40
120
Figure 16. VDD UVLO+ vs. Temperature
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
-20
0
20
40
60
80
100
120
Temperature [°C]
Temperature [°C]
Figure 17. VDD UVLO- vs. Temperature
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8
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Typical Characteristics (Continued)
9.0
9.0
8.5
VBSUV- [V]
VBSUV+ [V]
9.5
8.5
8.0
8.0
7.5
7.5
-40
-20
0
20
40
60
80
100
7.0
-40
120
-20
0
Temperature [°C]
Figure 18. VBS UVLO+ vs. Temperature
VOL [mV]
VOH [mV]
80
100
120
10
900
600
0
-10
300
-20
0
20
40
60
80
100
-20
-40
120
-20
0
Temperature [°C]
2.5
2.5
2.0
2.0
VIL [V]
3.0
1.5
1.5
1.0
1.0
0
20
40
60
80
100
0.5
-40
120
60
80
100
120
-20
0
20
40
60
80
100
120
Temperature [°C]
Temperature [°C]
Figure 22. Logic High Input Voltage
vs. Temperature
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
40
Figure 21. Low-Level Output Voltage
vs. Temperature
3.0
-20
20
Temperature [°C]
Figure 20. High-Level Output Voltage
vs. Temperature
VIH [V]
60
20
1200
0.5
-40
40
Figure 19. VBS UVLO- vs. Temperature
1500
0
-40
20
Temperature [°C]
Figure 23. Low Input Voltage
vs. Temperature
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9
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Typical Characteristics (Continued)
-7
60
50
-8
VS [V]
IIN+ [A]
40
30
20
-9
-10
10
-11
0
-10
-40
-20
0
20
40
60
80
100
-12
-40
120
-20
0
20
40
60
80
100
120
Temperature [°C]
Temperature [°C]
Figure 24. Logic Input High Bias Current
vs. Temperature
Figure 25. Allowable Negative VS Voltage
vs. Temperature
.
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
10
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Typical Characteristics (Continued)
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Switching Time Definitions
15V
HIN
1
HIN
VB 8
LIN
2
LIN
HO 7
10µF
100nF
1nF
3
COM
4
LO
VS 6
15V
VDD 5
1nF
10µF
100nF
FAN7390 Rev.01
Figure 26. Switching Time Test Circuit (Referenced 8-SOP)
HIN
LIN
HO
LO
FAN7390 Rev.01
Figure 27. Input/Output Timing Diagram
HIN
50%
50%
LIN
ton
tr
toff
90%
tf
90%
HO
LO
10%
10%
FAN7390 Rev.01
Figure 28. Switching Time Waveform Definitions
HIN
LIN
50%
LO
10%
50%
MT
HO
10%
90%
LO
90%
HO
MT
FAN7390 Rev.01
Figure 29. Delay Matching Waveform Definitions
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
11
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Physical Dimensions
Figure 30. 8-Lead Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, 
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
12
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
Physical Dimensions (Continued)
Figure 31. 14-Lead Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, 
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
13
FAN7390 — High-Current, High & Low Side, Gate-Drive IC
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.6
www.fairchildsemi.com
14