BYT 13-600 →1000 ® FAST RECOVERY RECTIFIER DIODES SOFT RECOVERY VERY HIGH VOLTAGE SMALL RECOVERY CHARGE APPLICATIONS ANTISATURATION DIODES FOR TRANSISTOR BASE DRIVE SNUBBER DIODES DO-201AD (Plastic) ABSOLUTE MAXIMUM RATINGS (limiting values) Symbol Parameter Value Unit IFRM Repetive Peak Forward Current tp ≤ 20µs 50 A IF (AV) Average Forward Current * Ta = 55°C δ = 0.5 3 A IFSM Surge non Repetitive Forward Current tp = 10ms Sinusoidal 100 A Ptot Power Dissipation * Ta 3.75 W Tstg Tj Storage and Junction Temperature Range - 40 to + 150 - 40 to + 150 °C 230 °C TL Maximum Lead Temperature for Soldering during 10s at 4mm from Case Symbol VRRM = 55°C BYT 13- Parameter Repetitive Peak Reverse Voltage Unit 600 800 1000 600 800 1000 V THERMAL RESISTANCE Symbol Rth (j - a) Parameter Junction-ambient* Value Unit 25 °C/W * On infinite heatsink with 10mm lead length. August 1998 Ed : 1B 1/4 BYT13-600 → 1000 ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS Synbol Test Conditions Min. Typ. Max. Unit IR Tj = 25°C VR = VRRM 20 µA VF Tj = 25°C IF = 3A 1.3 V Max. Unit 150 ns RECOVERY CHARACTERISTICS Symbol trr Test Conditions Tj = 25°C IF = 0.5A IR = 1A Min. Irr = 0.25A Typ. To evaluate the conduction losses use the following equations: VF = 0.95 + 0.050 IF P = 0.95 x IF(AV) + 0.050 IF2(RMS) F i gu re 1. Max i mum ave ra ge p ower dissipation versus average forward current. Figure 2. Average forward current versus ambient temperature. Figure 3. Thermal resistance versus lead length. Mounting n°1 INFINITE HEATSINK 2/4 Mounting n°2 PRINTED CIRCUIT BYT 13-600 → 1000 Figure 4. Transient thermal impedance junction-ambient for mounting n°2 versus pulse duration (L = 10 mm). Figure 6. Capacitance versus reverse applied voltage Figure 5. Peak forward current versus peak forward voltage drop (maximum values). Figure 7. Non repetitive surge peak current versus number of cycles 3/4 BYT13-600 → 1000 PACKAGE MECHANICAL DATA DO-201AD (Plastic) B note 1 A E B E ØD ØC note 1 ØD note 2 REF. A B ∅C ∅D E DIMENSIONS NOTES Millimeters Inches Min. Max. Min. Max. 9.50 0.374 1 - The lead diameter ∅ D is not controlled over zone E 25.40 1.000 2 - The minimum axial lengh within which the device may be 5.30 0.209 placed with its leads bent at right angles is 0.59"(15 mm) 1.30 0.051 1.25 0.049 Marking : type number, white band indicates cathode Cooling method : by convection (method A) Weight : 1.166g Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsIbility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1998 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 4/4