BYW29/F/FP/G-200 ® HIGH EFFICIENCY FAST RECOVERY DIODES MAIN PRODUCT CHARACTERISTICS IF(AV) 8A VRRM 200 V trr (max) 25 ns VF (max) 0.85 V A K K A FEATURES AND BENEFITS Very Low Forward Losses Negligible switching losses High surge current capability Insulated packages (ISOWATT220AC, TO-220FPAC): Insulation voltage: 2000 VDC Typical insulation capacitance = 12 pF ■ ■ A NC K D2PAK BYW29G-200 TO-220FPAC BYW29FP-200 ■ ■ DESCRIPTION Single rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in TO-220AC, ISOWATT220AC, TO-220FPAC and D2PAK, this device is intended for use in high frequency inverters, free wheeling and polarity protection applications. A A K K TO-220AC BYW29-200 ISOWATT220AC BYW29F-200 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) RMS forward current 16 A 8 A 80 A IF(AV) Average forward current δ = 0.5 D2PAK / TO-220AC Tc =120°C ISOWATT220AC TO-220FPAC Tc = 100°C IFSM Surge non repetitive forward current (All pins connected) Tstg Storage and junction temperature range Tj Maximum operating junction temperature May 2002 - Ed: 4B tp=10ms sinusoidal - 65 to + 150 °C + 150 1/7 BYW29/F/FP/G-200 THERMAL RESISTANCE Symbol Rth (j-c) Parameter Junction to case thermal resistance TO-220AC D2PAK ISOWATT220AC Value Unit 2.8 °C/W 5 TO-220FPAC 5.5 STATIC ELECTRICAL CHARACTERISTICS Symbol Parameter IR * Reverse leakage current VF ** Pulse test : Test Conditions Forward voltage drop Max. Unit Tj = 25°C 10 µA Tj = 100°C 0.6 mA IF = 5 A Tj = 125°C 0.85 V IF = 10 A Tj = 125°C 1.05 IF = 10 A Tj = 25°C 1.15 VR = VRRM Min. Typ. * tp = 5 ms, duty cycle < 2 % ** tp = 380 µs, duty cycle < 2 % To evaluate the conduction losses use the following equation : P = 0.65 x IF(AV) + 0.040 IF2(RMS) RECOVERY CHARACTERISTICS Symbol trr tfr VFP 2/7 Parameter Reverse recovery time Test Conditions Min. Typ. Max. Unit ns Tj = 25°C Irr = 0.25 A IF = 0.5A IR = 1A 25 Tj = 25°C dIF/dt = -50A/µs IF = 1A VR = 30V 35 Forward recovery time Tj = 25°C IF = 1A dIF/dt = 100A/µs VFR = 1.1 x VF max Peak forward voltage Tj = 25°C IF = 1A dIF/dt = 100A/µs ns 15 V 2 BYW29/F/FP/G-200 Fig.1 : Average forward power dissipation versus average forward current. PF(av)(W) Fig.2 : Peak current versus form factor. 160 12 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 IM(A) T IM 140 10 P = 10W δ=tp/T 120 tp δ=1 8 100 80 6 60 4 T 40 P = 15W 2 0 0 1 2 3 4 5 6 20 δ=tp/T IF(av)(A) 7 8 9 tp 10 P = 5W 11 Fig.3 : Forward voltage drop versus forward current (maximum values). δ 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Fig.4-1 : Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, D2PAK). IFM(A) Zth(j-c)/Rth(j-c) 100.0 1.0 δ = 0.5 10.0 Tj=125°C δ = 0.2 δ = 0.1 Tj=25°C 1.0 T Single pulse VFM(V) tp(s) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Fig.4-2 :Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC, ISOWATT220AC). 0.1 1.E-03 1.E-02 δ=tp/T 1.E-01 tp 1.E+00 Fig.5-1 : Non repetitive surge peak forward current versus overload duration (TO-220AC, D2PAK). Zth(j-c)/Rth(j-c) IM(A) 80 1.0 δ = 0.5 70 δ = 0.2 60 δ = 0.1 50 Tc=25°C 40 0.1 Single pulse Tc=75°C 30 Tc=120°C 20 T IM tp(s) 0.0 1.E-03 1.E-02 1.E-01 10 δ=tp/T 1.E+00 1.E+01 t t(s) δ=0.5 tp 0 1.E-03 1.E-02 1.E-01 1.E+00 3/7 BYW29/F/FP/G-200 Fig.5-2 : Non repetitive surge peak forward current versus overload duration (TO-220FPAC, ISOWATT220AC). Fig.6 : Average current versus ambient temperature. (δ = 0.5) IM(A) IF(av)(A) 60 10 9 ISOWATT220AC Rth(j-a)=Rth(j-c) 50 TO-220AC/D²PAK 8 7 40 TO-220FPAC 6 Tc=25°C 5 30 4 Tc=75°C 20 Rth(j-a)=15°C:W 3 2 Tc=100°C IM 10 t 1 t(s) δ=0.5 0 1.E-03 Tamb(°C) 0 1.E-02 1.E-01 1.E+00 Fig.7 : Junction capacitance versus reverse voltage applied (Typical values). 0 25 50 75 100 125 150 Fig.8 : Reverse recovery charges versus dIF/dt (90%confidence). C(pF) Qrr(nC) 1000 100 F=1MHz Vosc=30mV Tj=25°C IF=8A VR=100V Tj=100°C 100 VR(V) dIF/dt(A/µs) 10 10 1 10 100 10 1000 Fig.9 : Peak reverse recovery current versus dIF/dt (90% confidence). 100 1000 Fig.10 : Dynamic parameters versus junction temperature. IRM(A) Qrr; IRM[Tj] / Qrr; IRM[Tj=125°C] 100 1.50 IF=8A VR=100V Tj=100°C IF=8A VR=100V 1.25 1.00 IRM 10 0.75 0.50 QRR 0.25 dIF/dt(A/µs) Tj(°C) 1 0.00 10 4/7 100 1000 0 25 50 75 100 125 150 BYW29/F/FP/G-200 Fig.11 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm) for D2PAK. Rth(j-a)(°C/W) 80 70 60 50 40 30 20 10 S(cm²) 0 0 2 4 6 8 10 12 14 16 18 20 PACKAGE MECHANICAL DATA D2PAK (Plastic) DIMENSIONS REF. E C2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 A L2 Millimeters D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° FOOT PRINT (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 5/7 BYW29/F/FP/G-200 PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. A H2 C L5 L7 ØI L6 L2 D L9 F1 M F E G Inches Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 L4 Millimeters Min. 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 PACKAGE MECHANICAL DATA TO-220FPAC REF. A H B Dia L6 L2 L7 L3 L5 D F1 L4 F G1 G 6/7 E A B D E F F1 G G1 H L2 L3 L4 L5 L6 L7 Dia. DIMENSIONS Millimeters Inches Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20 Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126 BYW29/F/FP/G-200 PACKAGE MECHANICAL DATA ISOWATT220AC DIMENSIONS A H B Diam REF. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.50 2.70 0.098 0.106 D 2.40 2.75 0.094 0.108 E 0.40 0.70 0.016 0.028 F 0.75 1.00 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 H 10.00 10.40 0.394 0.409 L6 L7 L2 L3 F1 L2 F D E 16.00 Typ. 0.630 Typ. L3 28.60 30.60 1.125 1.205 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Diam 3.00 3.20 0.118 0.126 G Type Marking Package Weight Base Qty Delivery Mode BYW29-200 BYW29-200 TO-220AC 1.86 g 50 Tube BYW29F-200 BYW29F-200 ISOWATT220AC 2.2 g 50 Tube TO-220FPAC 2g 50 Tube 1.48 g 50 Tube BYW29FP-200 BYW29FP-200 BYW29G-200 ■ ■ ■ ■ ■ ■ BYW29G-200 2 D PAK Cooling method: by conduction (C) Recommended torque value (ISOWATT220AC, TO-220FPAC): 0.55 N.m Maximum torque value: 0.7 N.m Recommended torque value (TO-220AC): 0.8 N.m Maximum torque value: 1.0 N.m Epoxy meets UL94, V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 7/7